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Samsung Electronics Co., Ltd.Canon, Inc.Hitachi Ltd.Fujitsu Ltd.Sharp Corp.SANYO Electric Co., Ltd.Sumitomo Electric Industries Ltd.Sumitomo Chemical Co., Ltd.BOE Technology Group Co., Ltd.Boe Innovation Investment Co. Ltd.KYOCERA Chemical Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fuji Electronics Co., Ltd.Nikon Corp.OppoTaiwan Semiconductor Manufacturing Co., Ltd.Semiconductor Energy Laboratory Co., Ltd.Guangzhou Bosma Optoelectronic Technology Co. Ltd.Toppan, Inc.Fraunhofer-Gesellschaft eVSamsung Electro-Mechanics Co., Ltd.AGC, Inc. (Japan)ABB Automation, Inc.Renesas Electronics Corp.Shin-Etsu Chemical Co., Ltd.Alps Alpine Co., Ltd.Suzuki Co., Ltd.Showa Denko Materials Co. Ltd.South China University of Technology
Taiwan Semiconductor Manufacturing Co., Ltd.Western Digital Technologies, Inc.Xilinx, Inc.Altera Corp.Gowin Semiconductor Corp.QuickLogic Corp.Flex Logix Technologies, Inc.Innovationszentrum für Telekommunikationstechnik GmbH IZTS2C, Inc.Shri Ramdeobaba College of Engineering & ManagementSilego Technology, Inc.Fachhochschule Technikum WienInstituto Superior Politecnico Jose Antonio EcheverriaM S Ramaiah School of Advanced StudiesJTAG Technologies BVIQ-Analog Corp.Université Cergy-PontoiseAcculogic, Inc.Tabula, Inc.Sandensha KKReal Intent, Inc.Dynalith Systems Co., Ltd.
Samsung Electronics Co., Ltd.Canon, Inc.Canon, Inc.Fujitsu Ltd.Sharp Corp.SANYO Electric Co., Ltd.Sumitomo Electric Industries Ltd.Sumitomo Electric Industries Ltd.BOE Technology Group Co., Ltd.KYOCERA Chemical Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fuji Electronics Co., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Taiwan Semiconductor Manufacturing Co., Ltd.Semiconductor Energy Laboratory Co., Ltd.Guangzhou Bosma Optoelectronic Technology Co. Ltd.Samsung Electro-Mechanics Co., Ltd.Renesas Electronics Corp.Shin-Etsu Chemical Co., Ltd.Alps Alpine Co., Ltd.Yamaha Corp.Suzuki Co., Ltd.Showa Denko Materials Co. Ltd.Resonac Corp.Sumitomo Metal Industries Ltd.Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd.Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd.TCL China Star Optoelectronics Technology Co., Ltd.NXP Semiconductors (Thailand) Co., Ltd.
BOE Technology Group Co., Ltd.Boe Innovation Investment Co. Ltd.Taiwan Semiconductor Manufacturing Co., Ltd.Semiconductor Energy Laboratory Co., Ltd.Renesas Electronics Corp.LG Display Co., Ltd.Lam Research Corp.Chi Mei Optoelectronics Corp.Nichia Corp.JUKI Corp.Socionext, Inc.Macronix International Co., Ltd.Shin-Etsu Handotai Co., Ltd.Shinko Electric Industries Co., Ltd.Shinko Electric Industries Co., Ltd.National Semiconductor Corp.Institute of Microelectronics of Chinese Academy of SciencesDB HITEK Co., Ltd.Advanced Semiconductor Engineering, Inc.Skyworks Solutions, Inc.Altera Corp.Chunghwa Picture Tubes Ltd.Soitec SANovatek Microelectronics Corp.Dowa Electronics Materials Co., Ltd.Citizen Electronics (China) Co., Ltd.Shenzhen Royole Technologies Co., Ltd.Shenzhen Royole Technologies Co., Ltd.Toshiba Electronic Devices & Storage Corp.Round Rock Research LLC
Electronics & Telecommunications Research InstituteASML Netherlands BVHyundai MicroElectronics Co., Ltd.Institute of Microelectronics of Chinese Academy of SciencesNovatek Microelectronics Corp.Beijing NAURA Microelectronics Equipment Co., Ltd.JOLED, Inc.Shanghai Huali Microelectronics Corp.Shanghai Huali Microelectronics Corp.Asahi Kasei Microdevices Corp.Tianma Microelectronics Co., Ltd.Wuhan Tian Ma Microelectronics Co., Ltd.Shanghai Tianma Microelectronics Co., Ltd.Xiamen Tianma Microelectronics Co., Ltd.Xiamen Tianma Microelectronics Co., Ltd.Heraeus Precious Metals GmbH & Co. KGElectro Scientific Industries, Inc.Sanechips Technology Co., Ltd.Nuvoton Technology Corp.MPI Corp.LX Semicon Co., Ltd.Fujitsu Microelectronics, Inc.ELAN Microelectronics Corp.Kateeva, Inc.Raydium Semiconductor Corp.Aselsan Elektronik Sanayi ve Ticaret ASShanghai AVIC Optoelectronics Co., Ltd.CMC Materials, Inc.Hangzhou Silan Microelectronics Co., Ltd.Samtec, Inc.
General Electric Co.General Electric Co.DENSO Corp.Honeywell International, Inc.Schaeffler Technologies AG & Co. KGFANUC Corp.Yokogawa Electric Corp.Daihatsu Motor Co., Ltd.Azbil Corp.Hitachi Industrial Equipment Systems Co., Ltd.Rohde & Schwarz GmbH & Co. KGHochiki Corp.Legrand SARittal GmbH & Co. KGZhejiang Chint Electrics Co., Ltd.JFE Engineering Corp.Aiphone Co., Ltd.Leica Geosystems AGLeica Geosystems AGVega Grieshaber KGIDEC Corp.Allen-Bradley Co., Inc.Castrol Ltd.Schweitzer Engineering Laboratories, Inc.Panasonic Industrial Devices SUNX Co., Ltd.Panasonic Industrial Devices SUNX Co., Ltd.Schneider Electric SETamron Co., Ltd.Keysight Technologies, Inc.Hokuriku Electric Industry Co., Ltd.
LIG Nex1 Co., Ltd.Raytheon Co.Nokia Siemens Networks OyTokin Corp. /JP/National University of Defense TechnologyNational University of Defense TechnologyAsahi Kasei Microdevices Corp.Guangdong Galanz Enterprises Co., Ltd.New Japan Radio Co., Ltd.Nisshinbo Micro Devices, Inc.Leica Geosystems AGLeica Geosystems AGL3Harris Technologies ASA Ltd.Roke Manor Research Ltd.Israel Aerospace Industries Ltd.Keysight Technologies, Inc.MCI, Inc.MCI, Inc.USG Interiors LLCAselsan Elektronik Sanayi ve Ticaret ASMACOM Technology Solutions Holdings, Inc.Vaisala OyjSun Create Electronics Co., Ltd.Rheinmetall Air Defence AGShanghai Hesai Technology Co., LtdGuangzhou Haige Communications Group Inc. Co.Guangzhou Haige Communications Group Inc. Co.TeleNav, Inc.Shenzhen Silver Basis Technology Co., Ltd.Beijing Rigol Electronic Co. Ltd.