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Samsung Electronics Co., Ltd.Canon, Inc.Hitachi Ltd.Fujitsu Ltd.Sharp Corp.SANYO Electric Co., Ltd.Intel Corp.Sumitomo Electric Industries Ltd.Sumitomo Chemical Co., Ltd.BOE Technology Group Co., Ltd.Boe Innovation Investment Co. Ltd.KYOCERA Chemical Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fuji Electronics Co., Ltd.Nikon Corp.OppoTaiwan Semiconductor Manufacturing Co., Ltd.Semiconductor Energy Laboratory Co., Ltd.Toppan, Inc.Samsung Electro-Mechanics Co., Ltd.AGC, Inc. (Japan)ABB Automation, Inc.Renesas Electronics Corp.Shin-Etsu Chemical Co., Ltd.Alps Alpine Co., Ltd.Suzuki Co., Ltd.Showa Denko Materials Co. Ltd.South China University of TechnologySoutheast University
Huawei Technologies Co., Ltd.Ericsson, Inc.Intel Corp.Nippon Telegraph & Telephone Corp.ZTE Corp.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.NTT DOCOMO, Inc.vivo Mobile Communication Co., Ltd.Nokia Siemens Networks OyMediaTek, Inc.China Mobile Communications Group Co., Ltd.China Mobile Communications Group Co., Ltd.SZ DJI Technology Co., Ltd.telent Ltd.Mannesmann AGSK Telecom Co., Ltd.BlackBerry Ltd.Xiaomi Corp.Motorola Solutions, Inc.Nubia Technology Co., Ltd.KDDI Corp.China United Network Communications Ltd.Beijing University of Posts & TelecommunicationsMotorola Solutions Credit Co. LLCGuangzhou Shiyuan Electronic Technology Co. Ltd.Guangzhou Shiyuan Electronic Technology Co. Ltd.Deutsche Telekom AGHangzhou H3C Technologies Co., Ltd.China Telecom Corp. Ltd.
Samsung Electronics Co., Ltd.Canon, Inc.Fujitsu Ltd.Sharp Corp.SANYO Electric Co., Ltd.Intel Corp.Sumitomo Electric Industries Ltd.BOE Technology Group Co., Ltd.KYOCERA Chemical Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fuji Electronics Co., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Taiwan Semiconductor Manufacturing Co., Ltd.Semiconductor Energy Laboratory Co., Ltd.Samsung Electro-Mechanics Co., Ltd.Renesas Electronics Corp.Shin-Etsu Chemical Co., Ltd.Alps Alpine Co., Ltd.Yamaha Corp.Suzuki Co., Ltd.Showa Denko Materials Co. Ltd.Sumitomo Metal Industries Ltd.Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd.TCL China Star Optoelectronics Technology Co., Ltd.NXP Semiconductors (Thailand) Co., Ltd.NGK SPARK PLUG CO., LTD.NXP BVTCL China Star Optoelectronics Technology Co., Ltd.
Novaled GmbHPrecursor Energetics, Inc.Cassia Networks Inc.Freeosk, Inc.Bandridge Europe NVL2, Inc.Nanopath, Inc.
LG Information & Communications Ltd.DEXIN Corp.Pulse-Link, Inc.Nanotron Technologies GmbHDigital Global Systems, Inc.DecaWave Ltd.FRTEK Co., Ltd.Alereon, Inc.HUBER+SUHNER Cube Optics AGTaiwan Mobile Co., Ltd.Zinwave Ltd.Physical Devices, Inc.Hydrason Solutions Ltd.Broadlogic Network Technologies, Inc.NII Holdings, Inc.Tsujiko Co., Ltd.COJOT OySaint Lawrence Communications LLCEmpower RF Systems, Inc.Aviacomm, Inc.S2 Corp.Anadigics, Inc.EpiSys Science, Inc.Ignion SLWireless Power Amplifier Module, Inc.
MotionPoint Corp.FluidionWam!Net, Inc.SEAL Innovation, Inc.
LG Electronics, Inc.Intel Corp.Apple, Inc.Google LLCHoneywell International, Inc.Alcatel-Lucent S ANTT DOCOMO, Inc.Haier Smart Home Co., Ltd.Carrier Corp.MediaTek, Inc.Aisin AW Co., Ltd.Otis Elevator Co.Azbil Corp.SK Telecom Co., Ltd.BlackBerry Ltd.Xiaomi Corp.Motorola Solutions, Inc.JD.com, Inc.Sichuan Changhong Electric Co., Ltd.Sichuan Changhong Electric Co., Ltd.Orange SADeutsche Telekom AGHangzhou Hikvision Digital Technology Co., Ltd.Miele & Cie. KGHangzhou Hikvision Digital Technology Co., Ltd.Mattel, Inc.Zhejiang Dahua Technology Co. Ltd.Unisys Corp.Tata Consultancy Services Ltd.Broadcom Corp.