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Samsung Electronics Co., Ltd.Canon, Inc.Canon, Inc.Hitachi Ltd.Fujitsu Ltd.Sharp Corp.SANYO Electric Co., Ltd.Intel Corp.Sumitomo Electric Industries Ltd.Sumitomo Electric Industries Ltd.Hon Hai Precision Industry Co., Ltd.SK hynix, Inc.BOE Technology Group Co., Ltd.Taiwan Semiconductor Manufacturing Co., Ltd.Boe Innovation Investment Co. Ltd.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fuji Electronics Co., Ltd.Nikon Corp.LG Display Co., Ltd.OppoTaiwan Semiconductor Manufacturing Co., Ltd.Oki Electric Industry Co., Ltd.Applied Materials, Inc.Micron Technology, Inc.Fraunhofer-Gesellschaft eVShin-Etsu Chemical Co., Ltd.TOPPAN Holdings, Inc.Guangzhou Bosma Optoelectronic Technology Co. Ltd.TDK Corp.
Samsung Electronics Co., Ltd.Canon, Inc.Canon, Inc.Fujitsu Ltd.Sharp Corp.SANYO Electric Co., Ltd.Intel Corp.Sumitomo Electric Industries Ltd.Hon Hai Precision Industry Co., Ltd.SK hynix, Inc.BOE Technology Group Co., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Taiwan Semiconductor Manufacturing Co., Ltd.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fuji Electronics Co., Ltd.LG Display Co., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Taiwan Semiconductor Manufacturing Co., Ltd.Oki Electric Industry Co., Ltd.Micron Technology, Inc.Shin-Etsu Chemical Co., Ltd.Guangzhou Bosma Optoelectronic Technology Co. Ltd.Alps Alpine Co., Ltd.Yamaha Corp.Showa Denko Materials Co. Ltd.Resonac Corp.STMicroelectronics SASumitomo Metal Industries Ltd.Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd.
Taiwan Semiconductor Manufacturing Co., Ltd.Nordson Corp.Shinko Electric Industries Co., Ltd.Tokyo Seimitsu Co., Ltd.Siliconware Precision Industries Co., Ltd.MKS Instruments, Inc.Micronics Japan Co., Ltd.STATS ChipPAC Pte Ltd.FormFactor, Inc.ChipMOS Technologies, Inc.MPI Corp.Powertech Technology, Inc.JCET Group Co., Ltd.Namics Corp.AT & S Austria Technologie & Systemtechnik AGXintec, Inc.JAPAN ELECTRONIC MATERIALS CORP.JAPAN ELECTRONIC MATERIALS CORP.HANMI Semiconductor Co., Ltd.King Yuan Electronics Co., Ltd.Chipbond Technology Corp.Amkor Technology, Inc.NEPES Corp.HANA MICRON, Inc.Walton Advanced Engineering, Inc.Subtron Technology Co., Ltd.Foshan Nationstar Semiconductor Co., Ltd.Lingsen Precision Industries Ltd.Kinsus Interconnect Technology Corp.Samsung Semiconductor, Inc.
Hon Hai Precision Industry Co., Ltd.SK hynix, Inc.Taiwan Semiconductor Manufacturing Co., Ltd.Taiwan Semiconductor Manufacturing Co., Ltd.Applied Materials, Inc.South China University of TechnologySoutheast UniversityEbara Corp.SCREEN Holdings Co., Ltd.University of Electronic Science & Technology of ChinaDISCO Corp.Sony Semiconductor Solutions Corp.United Microelectronics Corp.Stanley Electric Co., Ltd.ULVAC, Inc.Macronix International Co., Ltd.Socionext, Inc.TOKYO OHKA KOGYO CO., LTD.KLA Corp.Shinko Electric Industries Co., Ltd.National Semiconductor Corp.Fujitsu Semiconductor Ltd.Nanjing University of TechnologyWinbond Electronics Corp.Skyworks Solutions, Inc.DB HITEK Co., Ltd.Gunze Ltd.Shenzhen Goodix Technology Co., Ltd.Shenzhen Goodix Technology Co., Ltd.Nanya Technology Corp.
Kubota Corp.JATCO Ltd.Quanta Computer, Inc.Lite-On Technology Corp.New York Air Brake Corp.Toyota Motor Engineering & Manufacturing North America, Inc.Nerudia Ltd.Daido Kogyo Co., Ltd.Grifols SAInnovation First, Inc.Kobelco Research Institute, Inc.Meiko Electronics Co., Ltd.Orchid Pharma Ltd.Ionics, Inc.First International Computer, Inc.Jabil, Inc.Kimball International, Inc.Jingye Iron & Steel Co., Ltd.Universal Scientific Industrial Co., Ltd.HANA MICRON, Inc.CompoSecure LLCSolus Advanced Materials Co., Ltd.Labixiaoxin (Fujian) Food Industry Co., Ltd.Stowe Woodward LLCLabixiaoxin (Fujian) Food Industry Co., Ltd.Hatco Corp.Photop Technologies, Inc.Jiangsu Jingjiang Transformer Co., Ltd.Cirtec Medical Systems LLCBeijing Weina Star Technology Co. Ltd.
Taiwan Semiconductor Manufacturing Co., Ltd.Applied Materials, Inc.United Microelectronics Corp.Shinko Electric Industries Co., Ltd.Fujitsu Semiconductor Ltd.Nanya Technology Corp.Polaris Innovations Ltd.Siliconware Precision Industries Co., Ltd.Qimonda AGSTATS ChipPAC Pte Ltd.Invensas Corp.Powertech Technology, Inc.JCET Group Co., Ltd.AT & S Austria Technologie & Systemtechnik AGXintec, Inc.King Yuan Electronics Co., Ltd.Chipbond Technology Corp.Amkor Technology, Inc.NEPES Corp.Advanced Chip Engineering Technology, Inc.HANA MICRON, Inc.Camtek Ltd.Niko Semiconductor Co., Ltd.Samsung Semiconductor, Inc.3D Plus SASTianshui Huatian Technology Co., Ltd.Tianshui Huatian Technology Co., Ltd.Micron Technology Taiwan, Inc.Trust Alliance Information Development Inc., Ltd. ShanghaiTrust Alliance Information Development Inc., Ltd. Shanghai
Wistron Corp.Compal Electronics, Inc.Pegatron Corp.Speed Tech Corp.EVOC Intelligent Technology Co. Ltd.EVOC Intelligent Technology Co. Ltd.Advantech Co., Ltd.LCFC (Hefei) Electronics Technology Co., Ltd.Universal Scientific Industrial Co., Ltd.Shuttle, Inc.LCFC (Hefei) Electronics Technology Co., Ltd.Ramaxel Technology (Shenzhen) Co. Ltd.Super Micro Computer, Inc.Ibeo Automotive Systems GmbHIEI Integration Corp.Portwell, Inc.Kinpo Electronics China Ltd.Hubei Kaile Science & Technology Co., Ltd.Hubei Kaile Science & Technology Co., Ltd.Lealea Hotels & Resorts Co. Ltd.USI Electronics (Shenzhen) Co., Ltd.Shenzhen Seavo Technology Co., Ltd.ARBOR Technology Corp.Shenzhen Sanmu Communication Technology Co., Ltd.Shenzhen Sanmu Communication Technology Co., Ltd.IBASE Technology, Inc.Thermo BioStar, Inc.IBASE Technology, Inc.Axiomtek Co., Ltd.DFI Inc.
