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Canon, Inc.Canon, Inc.Hitachi Ltd.Fujitsu Ltd.Sharp Corp.Intel Corp.Sumitomo Electric Industries Ltd.Sumitomo Electric Industries Ltd.Sumitomo Chemical Co., Ltd.BOE Technology Group Co., Ltd.Boe Innovation Investment Co. Ltd.KYOCERA Chemical Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fuji Electronics Co., Ltd.Nikon Corp.Taiwan Semiconductor Manufacturing Co., Ltd.Semiconductor Energy Laboratory Co., Ltd.Guangzhou Bosma Optoelectronic Technology Co. Ltd.Toppan, Inc.Fraunhofer-Gesellschaft eVSamsung Electro-Mechanics Co., Ltd.AGC, Inc. (Japan)ABB Automation, Inc.Renesas Electronics Corp.Shin-Etsu Chemical Co., Ltd.Alps Alpine Co., Ltd.Suzuki Co., Ltd.Showa Denko Materials Co. Ltd.Resonac Corp.
Samsung Electronics Co., Ltd.Canon, Inc.Canon, Inc.Fujitsu Ltd.Sharp Corp.SANYO Electric Co., Ltd.Intel Corp.Sumitomo Electric Industries Ltd.Sumitomo Electric Industries Ltd.BOE Technology Group Co., Ltd.KYOCERA Chemical Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fuji Electronics Co., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Taiwan Semiconductor Manufacturing Co., Ltd.Semiconductor Energy Laboratory Co., Ltd.Guangzhou Bosma Optoelectronic Technology Co. Ltd.Samsung Electro-Mechanics Co., Ltd.Renesas Electronics Corp.Shin-Etsu Chemical Co., Ltd.Alps Alpine Co., Ltd.Yamaha Corp.Suzuki Co., Ltd.Showa Denko Materials Co. Ltd.Resonac Corp.Sumitomo Metal Industries Ltd.Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd.Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd.
Taiwan Semiconductor Manufacturing Co., Ltd.SEMES Co., Ltd.Shinko Electric Industries Co., Ltd.Shinko Electric Industries Co., Ltd.Advanced Semiconductor Engineering, Inc.Tokyo Seimitsu Co., Ltd.Siliconware Precision Industries Co., Ltd.MKS Instruments, Inc.STATS ChipPAC Pte Ltd.FormFactor, Inc.MPI Corp.Powertech Technology, Inc.JCET Group Co., Ltd.Namics Corp.AT & S Austria Technologie & Systemtechnik AGXintec, Inc.JAPAN ELECTRONIC MATERIALS CORP.JAPAN ELECTRONIC MATERIALS CORP.King Yuan Electronics Co., Ltd.Chipbond Technology Corp.Technoprobe SpAAmkor Technology, Inc.NEPES Corp.Walton Advanced Engineering, Inc.Subtron Technology Co., Ltd.Foshan Nationstar Semiconductor Co., Ltd.Lingsen Precision Industries Ltd.Kinsus Interconnect Technology Corp.FINETECH GmbH & Co. KG3D Plus SAS
Taiwan Semiconductor Manufacturing Co., Ltd.Semiconductor Energy Laboratory Co., Ltd.South China University of TechnologySoutheast UniversityEbara Corp.SCREEN Holdings Co., Ltd.University of Electronic Science & Technology of ChinaLam Research Corp.Advantest Corp.Stanley Electric Co., Ltd.Sony Semiconductor Solutions Corp.Semiconductor Components Industries LLCULVAC, Inc.TOKYO OHKA KOGYO CO., LTD.Socionext, Inc.Macronix International Co., Ltd.KLA Corp.Hon Hai Precision Industry Co., Ltd.SEMES Co., Ltd.Shinko Electric Industries Co., Ltd.Shinko Electric Industries Co., Ltd.National Semiconductor Corp.Fujitsu Semiconductor Ltd.Nanjing University of TechnologyDB HITEK Co., Ltd.Advanced Semiconductor Engineering, Inc.Skyworks Solutions, Inc.Shenzhen Goodix Technology Co., Ltd.Shenzhen Goodix Technology Co., Ltd.Nanya Technology Corp.
Kubota Corp.JATCO Ltd.Quanta Computer, Inc.Advanced Semiconductor Engineering, Inc.Lite-On Technology Corp.New York Air Brake Corp.Toyota Motor Engineering & Manufacturing North America, Inc.Yuhan Corp.Daido Kogyo Co., Ltd.Grifols SAInnovation First, Inc.Kobelco Research Institute, Inc.Meiko Electronics Co., Ltd.Orchid Pharma Ltd.Ionics, Inc.First International Computer, Inc.Jabil, Inc.Jingye Iron & Steel Co., Ltd.Universal Scientific Industrial Co., Ltd.CompoSecure LLCSolus Advanced Materials Co., Ltd.Labixiaoxin (Fujian) Food Industry Co., Ltd.Stowe Woodward LLCLabixiaoxin (Fujian) Food Industry Co., Ltd.Hatco Corp.Photop Technologies, Inc.Jiangsu Jingjiang Transformer Co., Ltd.Beijing Weina Star Technology Co. Ltd.Jiangsu Jingjiang Transformer Co., Ltd.Beijing Weina Star Technology Co. Ltd.
Taiwan Semiconductor Manufacturing Co., Ltd.Samsung Electro-Mechanics Co., Ltd.Semiconductor Components Industries LLCSEMES Co., Ltd.Shinko Electric Industries Co., Ltd.Shinko Electric Industries Co., Ltd.Fujitsu Semiconductor Ltd.Advanced Semiconductor Engineering, Inc.Nanya Technology Corp.Polaris Innovations Ltd.Siliconware Precision Industries Co., Ltd.Qimonda AGSTATS ChipPAC Pte Ltd.Powertech Technology, Inc.JCET Group Co., Ltd.AT & S Austria Technologie & Systemtechnik AGTongFu Microelectronics Co., Ltd.Xintec, Inc.Chipbond Technology Corp.Amkor Technology, Inc.NEPES Corp.Advanced Chip Engineering Technology, Inc.Camtek Ltd.3D Plus SASTianshui Huatian Technology Co., Ltd.Tianshui Huatian Technology Co., Ltd.Micron Technology Taiwan, Inc.Seoul National UniversityTrust Alliance Information Development Inc., Ltd. ShanghaiFlipChip International LLC
Wistron Corp.Hon Hai Precision Industry Co., Ltd.Advanced Semiconductor Engineering, Inc.Compal Electronics, Inc.Pegatron Corp.EVOC Intelligent Technology Co. Ltd.EVOC Intelligent Technology Co. Ltd.Advantech Co., Ltd.LCFC (Hefei) Electronics Technology Co., Ltd.Shuttle, Inc.LCFC (Hefei) Electronics Technology Co., Ltd.Ramaxel Technology (Shenzhen) Co. Ltd.Ibeo Automotive Systems GmbHIEI Integration Corp.Kinpo Electronics China Ltd.Hubei Kaile Science & Technology Co., Ltd.Mercury Systems, Inc.C-Media Electronics, Inc.Lealea Hotels & Resorts Co. Ltd.Shenzhen Seavo Technology Co., Ltd.ARBOR Technology Corp.Shenzhen Sanmu Communication Technology Co., Ltd.Thermo BioStar, Inc.IBASE Technology, Inc.USI Electronics (Shenzhen) Co., Ltd.Axiomtek Co., Ltd.DFI Inc.Lianzheng Electronics (Shenzhen) Co. Ltd.Cypress Technology Co., Ltd.ASRock, Inc.