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Western Digital Technologies, Inc.LORD Corp.SAES Getters SpACTS Corp.Croda International PlcNanoco Technologies Ltd.Zalman Tech Co., Ltd.Metglas, Inc.RiTdisplay Corp.PolyIC GmbH & Co. KGMonolithic 3D, Inc.General Dynamics Land Systems, Inc.NanoComp Technologies, Inc.SuperPower, Inc.Aavid Thermalloy LLCUniversité de PauSunamp Ltd.G.RAU GmbH & Co. KGChomerics, Inc.Cambrios Technologies Corp.Future Carbon GmbHHypres, Inc.Phase Change Energy Solutions, Inc.BGT Materials Ltd.BGT Materials Ltd.Schoeller Textil AGADMEDES GmbHAdvansa BVMidé Technology Corp.Photonic Lattice, Inc.
LG Electronics, Inc.Sharp Corp.Huawei Technologies Co., Ltd.Ericsson, Inc.Nippon Telegraph & Telephone Corp.ZTE Corp.Kyocera Corp.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Alcatel-Lucent S ANTT DOCOMO, Inc.Showa Denko Materials Co. Ltd.Resonac Corp.Western Electric Co., Inc.Fujikura Ltd.Hitachi Metals, Ltd.Proterial Ltd.vivo Mobile Communication Co., Ltd.Nokia Siemens Networks OyLucent Technologies, Inc.BT Group PlcChina Mobile Communications Group Co., Ltd.China Mobile Communications Group Co., Ltd.telent Ltd.Mannesmann AGJapan Aviation Electronics Industry Ltd.SK Telecom Co., Ltd.BlackBerry Ltd.Tokyo Electric Power Co. Holdings, Inc.Nubia Technology Co., Ltd.Sony Ericsson Mobile Communications AB
Koninklijke Philips NVKoninklijke Philips NVSeiko Epson Corp.E.I. du Pont de Nemours & Co.EIDP, Inc.DAIKIN INDUSTRIES Ltd.Fraunhofer-Gesellschaft eVPOSCO Holdings Inc.JFE Holdings, Inc.South China University of TechnologySoutheast UniversityIndustrial Technology Research InstituteShowa Denko K.K.Resonac Holdings Corp.Shanghai Jiao Tong UniversityDIC CorporationZhejiang University of TechnologyMassachusetts Institute of TechnologyHarbin Institute of TechnologyHuazhong University of Science & TechnologyFunai Electric Co., Ltd.University of Electronic Science & Technology of ChinaKorea Advanced Institute of Science & TechnologySumitomo Bakelite Co., Ltd.Beihang UniversityKunming University of Science & TechnologyDalian University of TechnologyWuhan UniversityAmorepacific Corp.Tongji University
Hewlett Packard Enterprise Development LPNational University of Defense TechnologyNational University of Defense TechnologyGoerTek Inc.Dongguan University of TechnologyShanghai Maritime UniversityXiamen University of TechnologyHebei University of Science & TechnologyNachi-Fujikoshi Corp.UBTECH Robotics Corp. Ltd.Zhejiang Gongshang UniversityCarnegie Mellon UniversitySoftBank Corp.Iflytek Co., Ltd.iRobot Corp.Lovely Professional UniversityKyushu Institute of TechnologyChandigarh UniversityNanchang Institute of TechnologyNational Kaohsiung University of Applied SciencesBeijing Minglue Software System Ltd.Beijing Minglue Software System Ltd.Osaka Prefecture UniversityFujifilm Dimatix, Inc.City University of Hong KongCity University of Hong KongAmyris, Inc.DeepMind Technologies Ltd.National Yunlin University of Science & TechnologyVysoká kola Bánská-Technická Univerzita Ostrava
Samsung Electronics Co., Ltd.Canon, Inc.Canon, Inc.Hitachi Ltd.Fujitsu Ltd.Sharp Corp.SANYO Electric Co., Ltd.Sumitomo Electric Industries Ltd.Sumitomo Electric Industries Ltd.BOE Technology Group Co., Ltd.Boe Innovation Investment Co. Ltd.KYOCERA Chemical Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fuji Electronics Co., Ltd.Nikon Corp.OppoTaiwan Semiconductor Manufacturing Co., Ltd.Semiconductor Energy Laboratory Co., Ltd.Toppan, Inc.Fraunhofer-Gesellschaft eVSamsung Electro-Mechanics Co., Ltd.AGC, Inc. (Japan)ABB Automation, Inc.Renesas Electronics Corp.Shin-Etsu Chemical Co., Ltd.Alps Alpine Co., Ltd.Suzuki Co., Ltd.Showa Denko Materials Co. Ltd.Resonac Corp.
GlacialTech, Inc.GlacialTech, Inc.
