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Advanced Micro Devices, Inc.NVIDIA Corp.Realtek Semiconductor Corp.VIA Technologies, Inc.Cirrus Logic, Inc.Institute For Information IndustryImagination Technologies Ltd.Silicon Laboratories, Inc.Silicon Integrated Systems Corp.Silicon Integrated Systems Corp.ALi Corp.Rockchip Electronics Co., Ltd.LeadCore Technology Co. Ltd.Rockley Photonics Ltd.BitMain Technologies Holding Co.Anyka (Guangzhou) Microelectronics Technology Co., Ltd.Anyka (Guangzhou) Microelectronics Technology Co., Ltd.BitMain Technologies Holding Co.Graphcore Ltd.Volterra Semiconductor Corp.Ingenic Semiconductor Co., Ltd.Ralink Technology Corp.Nan Ya Printed Circuit Board CorpUbiNetics Ltd.SenseTime Group Ltd.Chipintelli Co. Ltd.Flarion Technologies, Inc.Beijing Horizon Robotics Technology Development Co., Ltd.Verisilicon Microelectronics (Shanghai) Co., Ltd.Sequans Communications SA
Samsung Electronics Co., Ltd.Canon, Inc.Canon, Inc.Sony Group Corp.LG Electronics, Inc.Fujitsu Ltd.Sharp Corp.Ricoh Co., Ltd.Seiko Epson Corp.SANYO Electric Co., Ltd.ZTE Corp.Apple, Inc.FUJIFILM Corp.BOE Technology Group Co., Ltd.Hewlett-Packard Development Co.Brother Industries, Ltd.Eastman Kodak Co.Boe Innovation Investment Co. Ltd.Fujifilm Business Innovation Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fujifilm Business Innovation Corp.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Xerox Holdings Corp.Oki Electric Industry Co., Ltd.Semiconductor Energy Laboratory Co., Ltd.Mita Industrial Co., Ltd.Micron Technology, Inc.Toppan, Inc.
Samsung Electronics Co., Ltd.Sony Group Corp.LG Electronics, Inc.General Electric Co.General Electric Co.Sharp Corp.Seiko Epson Corp.SANYO Electric Co., Ltd.E.I. du Pont de Nemours & Co.Intel Corp.Sumitomo Electric Industries Ltd.Sumitomo Electric Industries Ltd.Apple, Inc.Brother Industries, Ltd.KYOCERA Chemical Corp.Fujifilm Business Innovation Corp.Dai Nippon Printing Co., Ltd.Toshiba Chemical Corp.Kyocera Corp.Fujifilm Business Innovation Corp.Fuji Electronics Co., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.OppoTaiwan Semiconductor Manufacturing Co., Ltd.Daewoo Electronics Co. Ltd.DAIKIN INDUSTRIES Ltd.Honeywell International, Inc.Nitto Electric Industrial Co. Ltd.Kobe Steel, Ltd.
Juniper Networks, Inc.FMC Tech Ltd.NTT Communications Corp.Extreme Networks, Inc.ECI Telecom Ltd.Guangzhou Power Supply Bureau of Guangdong Power Grid Corp.BMC Software, Inc.Beijing Ultrapower Software Co., Ltd.SK Broadband Co., Ltd.Nanjing ZTE Software Co., Ltd.Dinglong Culture Co., Ltd.OpenPeak, Inc.Comptel OyjMavenir Private Holdings I Ltd.HLA Group Corp. Ltd.Alipay (China) Network Technology Co., Ltd.HLA Group Corp. Ltd.SolarWinds Worldwide LLCSolarWinds North America, Inc.Riverbed Technology, Inc.Xi'an Jiaoda Jiepu Network Science & Technology Co., Ltd.Kunshan Jingxun Electronic Technology Co., Ltd.Kunshan Jingxun Electronic Technology Co., Ltd.Easylinkin Technology Co. Ltd.InfoVista SASInfoVista SASDIEMME Enologia SpA128 Technology, Inc.Chongqing Municipal Drainage Co., Ltd.Guangzhou Hantele Communication Co. Ltd.
3M Innovative Properties Co.Taiwan Semiconductor Manufacturing Co., Ltd.Bayerische Motoren Werke AGJFE Holdings, Inc.Advantest Corp.NIKE, Inc.Chongqing Changan Automobile Co. Ltd.Milliken & Co. (South Carolina)Raychem Corp.Lear Corp.International Paper Co.Nanya Technology Corp.Cypress Semiconductor Corp.Varian Semiconductor Equipment Associates, Inc.Delta Faucet Co.Atlas Copco ABBrembo SpACrown Equipment Corp.Shanghai Zhenhua Heavy Industries Co., Ltd.Power Integrations, Inc.Wistron NeWeb Corp.Samsung C&T Corp.Hitachi-LG Data Storage, Inc.Jack Technology Co., Ltd.Xiamen Solex High-Tech Industries Co. Ltd.Jack Technology Co., Ltd.Xiamen Solex High-Tech Industries Co. Ltd.HMD Global OyAutodesk, Inc.FARO Technologies, Inc.
Samsung Electronics Co., Ltd.Canon, Inc.Canon, Inc.Sony Group Corp.International Business Machines Corp.Fujitsu Ltd.General Electric Co.General Electric Co.Huawei Technologies Co., Ltd.Seiko Epson Corp.SANYO Electric Co., Ltd.Intel Corp.ZTE Corp.Apple, Inc.FUJIFILM Corp.Hewlett-Packard Development Co.Eastman Kodak Co.Fujifilm Business Innovation Corp.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Honeywell International, Inc.Xerox Holdings Corp.Tencent Technology (Shenzhen) Co., Ltd.Alcatel-Lucent S AOlympus Corp.Microsoft Corp.Beijing Xiaomi Mobile Software Co., Ltd.Toyota Industries Corp.Muratec Automation Co., Ltd.Victor Company of Japan Ltd.Victor Company of Japan Ltd.
Samsung Electronics Co., Ltd.Canon, Inc.Canon, Inc.Hitachi Ltd.Fujitsu Ltd.Sharp Corp.SANYO Electric Co., Ltd.Intel Corp.Sumitomo Electric Industries Ltd.Sumitomo Electric Industries Ltd.BOE Technology Group Co., Ltd.Boe Innovation Investment Co. Ltd.KYOCERA Chemical Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fuji Electronics Co., Ltd.Nikon Corp.OppoTaiwan Semiconductor Manufacturing Co., Ltd.Oki Electric Industry Co., Ltd.Semiconductor Energy Laboratory Co., Ltd.Micron Technology, Inc.Toppan, Inc.Fraunhofer-Gesellschaft eVSamsung Electro-Mechanics Co., Ltd.AGC, Inc. (Japan)ABB Automation, Inc.Shin-Etsu Chemical Co., Ltd.Alps Alpine Co., Ltd.Suzuki Co., Ltd.