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telent Ltd.Schneider Electric USA, Inc.Fibocom Wireless, Inc.CAE, Inc.RGB Systems, Inc.LGS Innovations LLCNuCurrent, Inc.Beijing Mech-Mind Robotics Technologies Co., Ltd.Danobat S. Coop.WiSpry, Inc.ObjectVideo, Inc.Adam Hall GmbHSigma Additive Solutions, Inc.Element AI, Inc.Mecachrome France SASNEC Corporation of AmericaShenzhen Honglu Technology Co., Ltd.Siemens Rail Automation Pty Ltd.Prudent Energy Inc.KA Imaging, Inc.Fengtai Technology (Beijing) Co. Ltd.Kuka Systems North America LLCTongue LaboratoryWallix SARLBlue Spark Technologies, Inc.Speech Processing Solutions GmbHRockwell Collins Deutschland GmbHKuka Systems North America LLCCoronis SASOscilloquartz SA
LG Electronics, Inc.Sharp Corp.Huawei Technologies Co., Ltd.Ericsson, Inc.Nippon Telegraph & Telephone Corp.ZTE Corp.Kyocera Corp.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Electronics & Telecommunications Research InstituteMotorola, Inc.Alcatel-Lucent S ANTT DOCOMO, Inc.Showa Denko Materials Co. Ltd.Western Electric Co., Inc.Fujikura Ltd.Hitachi Metals, Ltd.Proterial Ltd.vivo Mobile Communication Co., Ltd.Nokia Siemens Networks OyLucent Technologies, Inc.China Mobile Communications Group Co., Ltd.China Mobile Communications Group Co., Ltd.telent Ltd.Mannesmann AGJapan Aviation Electronics Industry Ltd.SK Telecom Co., Ltd.BlackBerry Ltd.Motorola Solutions, Inc.Tokyo Electric Power Co. Holdings, Inc.