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Olympus Corp.Ishida Co., Ltd.Skyworks Solutions, Inc.Iris Ohyama, Inc.Hologic, Inc.IEE International Electronics & Engineering SAIRO ABITW Ltd.VanJee Technology Co., Ltd.Anpec Electronics Corp.International Currency TechnologiesRiken Keiki Co., Ltd.American Science & Engineering, Inc.Togami Electric Mfg. Co., Ltd.Togami Electric Mfg. Co., Ltd.MOXTEK, Inc.Adaptix Ltd.ISORG SAMerten GmbH & Co. KGNingbo Futai Electric Co. Ltd.Excelitas Technologies Corp.iRay Technology Co., Ltd.Sensors Unlimited, Inc.Zellweger Luwa AGChina Security & Fire IOT Sensing Co. Ltd.BERTHOLD TECHNOLOGIES GmbH & Co. KGChina Security & Fire IOT Sensing Co. Ltd.Minelab Electronics Pty Ltd.Precision Biosensor, Inc.Tibet University
Thales GroupMesserschmitt-Boelkow-Blohm GmbHNorthrop Grumman Systems Corp.The Korean Agency for Defense Development (South Korea)Société Nationale Industrielle Aérospatiale SAFourth Military Medical UniversityChina Academy of Launch Vehicle TechnologyHazeltine Corp.AECC Shenyang Liming Aero-Engine Co., Ltd.McDonnell Douglas Corp.Hughes Tool Co.Harbin Aircraft Industrial Group Co. Ltd.Martin Marietta Corp.Western Atlas International, Inc.Beijing Institute of Space Launch TechnologyFN Herstal NVMobileye Vision Technologies Ltd.Shanghai Aircraft Manufacturing Co. Ltd.Smith & Wesson, Inc.China Avionics Systems Co., Ltd.China Aviation Power Machinery Research InstituteAVIC Xi'an Aircraft Industry Group Co., Ltd.Zhengzhou Xindajiean Information Technology Co., Ltd.CIMC Safeway Technology Co., Ltd.TRW Systèmes Aeronautiques SASHuiyang Aviation Propeller Co., Ltd.Xian Aerospace Engine CorpZhangjiagang CIMC Sanctum Cryogenic Equipment Co., Ltd.Shaanxi Baocheng Aviation Instrument Co., Ltd.Zhengzhou Aircraft Equipment Co., Ltd.
General Electric Co.Honeywell International, Inc.The Boeing Co.Thales GroupSubaru Corp.LIG Nex1 Co., Ltd.Raytheon Co.Subaru Corp.Beihang UniversityLucas Industries PlcDaicel Corp.KYB Corp.Hughes Aircraft Co.SZ DJI Technology Co., Ltd.Raytheon Technologies Corp.Japan Aviation Electronics Industry Ltd.Hamilton Sundstrand Corp.AlliedSignal, Inc.Eclipse Aviation Corp.Tektronix, Inc.Deutsches Zentrum für Luft- und Raumfahrt e.V.United Aircraft Corp.Analog Devices, Inc.Mitsubishi Cable Industries Ltd.Voith GmbH & Co. KGaAMesserschmitt-Boelkow-Blohm GmbHMesserschmitt-Boelkow-Blohm GmbHNorthrop Grumman Systems Corp.Pratt & Whitney Canada Corp.Raychem Corp.
Samsung Electronics Co., Ltd.Canon, Inc.Fujitsu Ltd.Sharp Corp.SANYO Electric Co., Ltd.Intel Corp.Sumitomo Electric Industries Ltd.BOE Technology Group Co., Ltd.KYOCERA Chemical Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fuji Electronics Co., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Taiwan Semiconductor Manufacturing Co., Ltd.Semiconductor Energy Laboratory Co., Ltd.Samsung Electro-Mechanics Co., Ltd.Renesas Electronics Corp.Shin-Etsu Chemical Co., Ltd.Alps Alpine Co., Ltd.Yamaha Corp.Suzuki Co., Ltd.Showa Denko Materials Co. Ltd.Sumitomo Metal Industries Ltd.Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd.TCL China Star Optoelectronics Technology Co., Ltd.NXP Semiconductors (Thailand) Co., Ltd.NGK SPARK PLUG CO., LTD.NXP BVTCL China Star Optoelectronics Technology Co., Ltd.
Samsung Electronics Co., Ltd.Canon, Inc.Hitachi Ltd.Fujitsu Ltd.Sharp Corp.SANYO Electric Co., Ltd.Intel Corp.Sumitomo Electric Industries Ltd.Sumitomo Chemical Co., Ltd.BOE Technology Group Co., Ltd.Boe Innovation Investment Co. Ltd.KYOCERA Chemical Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fuji Electronics Co., Ltd.Nikon Corp.OppoTaiwan Semiconductor Manufacturing Co., Ltd.Semiconductor Energy Laboratory Co., Ltd.Toppan, Inc.Samsung Electro-Mechanics Co., Ltd.AGC, Inc. (Japan)ABB Automation, Inc.Renesas Electronics Corp.Shin-Etsu Chemical Co., Ltd.Alps Alpine Co., Ltd.Suzuki Co., Ltd.Showa Denko Materials Co. Ltd.South China University of TechnologySoutheast University
FUJIFILM Corp.Konica Minolta, Inc.Hitachi Medical Corp.Hitachi Medical Corp.Canon Medical Systems Corp.Ishida Co., Ltd.C. R. Bard, Inc. (New Jersey)C. R. Bard, Inc. (New Jersey)Furuno Electric Co., Ltd.Shanghai United Imaging Healthcare Co., Ltd.Agfa-Gevaert NVShanghai United Imaging Healthcare Co., Ltd.DENTSPLY International, Inc.GE Healthcare Ltd. (United Kingdom)Samsung Medison Co., Ltd.Rigaku Corp.Peking University Shenzhen HospitalHenan Provincial HospitalSynthes USA LPVarian Medical Systems, Inc.Henan Provincial Peoples HospitalITW Ltd.Neusoft Medical Systems Co., Ltd.Fujifilm Dimatix, Inc.Kasei Optonix Ltd.The Yoshida Dental Mfg. Co., Ltd.Ion Beam Applications SAVatech Ewoo Holdings Co., Ltd.DÜRR DENTAL SELiebel-Flarsheim Co. LLC
telent Ltd.Schneider Electric USA, Inc.Fibocom Wireless, Inc.CAE, Inc.RGB Systems, Inc.LGS Innovations LLCNuCurrent, Inc.Beijing Mech-Mind Robotics Technologies Co., Ltd.Danobat S. Coop.WiSpry, Inc.ObjectVideo, Inc.Adam Hall GmbHSigma Additive Solutions, Inc.Element AI, Inc.Mecachrome France SASNEC Corporation of AmericaShenzhen Honglu Technology Co., Ltd.Siemens Rail Automation Pty Ltd.Prudent Energy Inc.KA Imaging, Inc.Fengtai Technology (Beijing) Co. Ltd.Kuka Systems North America LLCTongue LaboratoryWallix SARLBlue Spark Technologies, Inc.Speech Processing Solutions GmbHKuka Systems North America LLCRockwell Collins Deutschland GmbHBlue Sky Research, Inc.Coronis SAS