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Samsung Electronics Co., Ltd.Canon, Inc.Canon, Inc.Hitachi Ltd.Fujitsu Ltd.Sharp Corp.SANYO Electric Co., Ltd.Intel Corp.Sumitomo Electric Industries Ltd.Sumitomo Electric Industries Ltd.Hon Hai Precision Industry Co., Ltd.Samsung Display Co., Ltd.SK hynix, Inc.BOE Technology Group Co., Ltd.Taiwan Semiconductor Manufacturing Co., Ltd.Boe Innovation Investment Co. Ltd.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fuji Electronics Co., Ltd.Nikon Corp.LG Display Co., Ltd.OppoTaiwan Semiconductor Manufacturing Co., Ltd.Oki Electric Industry Co., Ltd.Applied Materials, Inc.Micron Technology, Inc.Fraunhofer-Gesellschaft eVShin-Etsu Chemical Co., Ltd.TOPPAN Holdings, Inc.Guangzhou Bosma Optoelectronic Technology Co. Ltd.
Samsung Electronics Co., Ltd.LG Electronics, Inc.General Electric Co.General Electric Co.Sharp Corp.Seiko Epson Corp.SANYO Electric Co., Ltd.E.I. du Pont de Nemours & Co.Intel Corp.Sumitomo Electric Industries Ltd.Apple, Inc.Sumitomo Electric Industries Ltd.Hon Hai Precision Industry Co., Ltd.SK hynix, Inc.Gree Electric Appliances, Inc. of ZhuhaiBrother Industries, Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Taiwan Semiconductor Manufacturing Co., Ltd.Fujifilm Business Innovation Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Toshiba Chemical Corp.Fuji Electronics Co., Ltd.LG Display Co., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.OppoTaiwan Semiconductor Manufacturing Co., Ltd.Daewoo Electronics Co. Ltd.DAIKIN INDUSTRIES Ltd.Honeywell International, Inc.
Intel Corp.Nippon Telegraph & Telephone Corp.ZTE Corp.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Motorola, Inc.NTT DOCOMO, Inc.vivo Mobile Communication Co., Ltd.Nokia Siemens Networks OyChina Mobile Communications Group Co., Ltd.MediaTek, Inc.China Mobile Communications Group Co., Ltd.SZ DJI Technology Co., Ltd.Mannesmann AGSK Telecom Co., Ltd.BlackBerry Ltd.Xiaomi Corp.HTC Corp.China Telecom Corp. Ltd.Nubia Technology Co., Ltd.KDDI Corp.Guangzhou Shiyuan Electronic Technology Co. Ltd.China United Network Communications Ltd.Beijing University of Posts & TelecommunicationsEricsson, Inc.Guangzhou Shiyuan Electronic Technology Co. Ltd.Deutsche Telekom AGHangzhou H3C Technologies Co., Ltd.Xilinx, Inc.Hosiden Corp.
Hon Hai Precision Industry Co., Ltd.SK hynix, Inc.Taiwan Semiconductor Manufacturing Co., Ltd.Taiwan Semiconductor Manufacturing Co., Ltd.Applied Materials, Inc.South China University of TechnologySoutheast UniversityHitachi Kokusai Electric, Inc.Ebara Corp.SCREEN Holdings Co., Ltd.University of Electronic Science & Technology of ChinaLam Research Corp.DISCO Corp.Sony Semiconductor Solutions Corp.United Microelectronics Corp.Advantest Corp.Stanley Electric Co., Ltd.ULVAC, Inc.Macronix International Co., Ltd.Socionext, Inc.TOKYO OHKA KOGYO CO., LTD.KLA Corp.Shinko Electric Industries Co., Ltd.Shinko Electric Industries Co., Ltd.National Semiconductor Corp.Fujitsu Semiconductor Ltd.Nanjing University of TechnologyWinbond Electronics Corp.Skyworks Solutions, Inc.DB HITEK Co., Ltd.
Taiwan Semiconductor Manufacturing Co., Ltd.Taiwan Semiconductor Manufacturing Co., Ltd.Applied Materials, Inc.United Microelectronics Corp.Shinko Electric Industries Co., Ltd.Shinko Electric Industries Co., Ltd.Fujitsu Semiconductor Ltd.Advanced Semiconductor Engineering, Inc.Siliconware Precision Industries Co., Ltd.Qimonda AGUnimicron Technology Corp.STATS ChipPAC Pte Ltd.Adeia Semiconductor Technologies LLCPowertech Technology, Inc.JCET Group Co., Ltd.AT & S Austria Technologie & Systemtechnik AGXintec, Inc.King Yuan Electronics Co., Ltd.Chipbond Technology Corp.NEPES Corp.Advanced Chip Engineering Technology, Inc.HANA MICRON, Inc.Camtek Ltd.Niko Semiconductor Co., Ltd.Samsung Semiconductor, Inc.3D Plus SASTianshui Huatian Technology Co., Ltd.Tianshui Huatian Technology Co., Ltd.Micron Technology Taiwan, Inc.Trust Alliance Information Development Inc., Ltd. Shanghai
Taiwan Semiconductor Manufacturing Co., Ltd.Taiwan Semiconductor Manufacturing Co., Ltd.Casio Computer Co., Ltd.Micron Technology, Inc.Showa Denko K.K.DISCO Corp.United Microelectronics Corp.Shin-Etsu Handotai Co., Ltd.Shibaura Mechatronics Corp.Advanced Semiconductor Engineering, Inc.Tokyo Seimitsu Co., Ltd.Soitec SAAtotech Deutschland GmbH & Co. KGVarian Semiconductor Equipment Associates, Inc.Fujimi, Inc.Cymer LLCGlobalWafers Co., Ltd.Genesis Photonics, Inc.Mattson Technology, Inc.Xintec, Inc.EGing Photovoltaic Technology Co., Ltd.Xiamen San'an Optoelectronics Technology Co., Ltd.Xiamen San'an Optoelectronics Technology Co., Ltd.Fujikoshi Machinery Corp.Guilford Pharmaceuticals, Inc.Guangdong Fenghua Advanced Technology (Holding) Co., Ltd.SK Siltron Co., Ltd.Etron Technology, Inc.EO Technics Co., Ltd.Semitool, Inc.
Taiwan Semiconductor Manufacturing Co., Ltd.Taiwan Semiconductor Manufacturing Co., Ltd.Nordson Corp.Shinko Electric Industries Co., Ltd.Tokyo Seimitsu Co., Ltd.MKS Instruments, Inc.Siliconware Precision Industries Co., Ltd.Unimicron Technology Corp.STATS ChipPAC Pte Ltd.Namics Corp.Powertech Technology, Inc.JCET Group Co., Ltd.MPI Corp.AT & S Austria Technologie & Systemtechnik AGXintec, Inc.JAPAN ELECTRONIC MATERIALS CORP.JAPAN ELECTRONIC MATERIALS CORP.HANMI Semiconductor Co., Ltd.King Yuan Electronics Co., Ltd.Chipbond Technology Corp.Technoprobe SpASL Vionics Co., Ltd.NEPES Corp.HANA MICRON, Inc.Walton Advanced Engineering, Inc.Subtron Technology Co., Ltd.Foshan Nationstar Semiconductor Co., Ltd.Lingsen Precision Industries Ltd.Kinsus Interconnect Technology Corp.Samsung Semiconductor, Inc.
