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Samsung Electronics Co., Ltd.Canon, Inc.Hitachi Ltd.Fujitsu Ltd.Sharp Corp.SANYO Electric Co., Ltd.Intel Corp.Sumitomo Electric Industries Ltd.Sumitomo Chemical Co., Ltd.BOE Technology Group Co., Ltd.Boe Innovation Investment Co. Ltd.KYOCERA Chemical Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fuji Electronics Co., Ltd.Nikon Corp.OppoTaiwan Semiconductor Manufacturing Co., Ltd.Semiconductor Energy Laboratory Co., Ltd.Toppan, Inc.Samsung Electro-Mechanics Co., Ltd.AGC, Inc. (Japan)ABB Automation, Inc.Renesas Electronics Corp.Shin-Etsu Chemical Co., Ltd.Alps Alpine Co., Ltd.Suzuki Co., Ltd.Showa Denko Materials Co. Ltd.South China University of TechnologySoutheast University
Marvell Asia Pte Ltd.Guangzhou Shiyuan Electronic Technology Co. Ltd.Guangzhou Shiyuan Electronic Technology Co. Ltd.National Semiconductor Corp.Skyworks Solutions, Inc.Kinpo Electronics, Inc.International Rectifier Corp.Schneider Electric USA, Inc.MegaChips Corp.Nuvoton Technology Corp.Infineon Technologies Americas Corp.Infineon Technologies Americas Corp.GlobalWafers Co., Ltd.Guodian United Power Technology Co., Ltd.MaxLinear, Inc.pSemi Corp.O2Micro International Ltd.Chloride Group Ltd.Ricoh Electronic Devices Co. Ltd.Holtek Semiconductor, Inc.uPI Semiconductor Corp.THine Electronics, Inc.Shanghai Hua Hong NEC Electronics Co., Ltd.Sunwoda Electronic Co., Ltd.SG Micro Corp.Cooper Crouse-Hinds GmbHXiamen San'an Integrated Circuit Co., Ltd.Guangzhou Cansemi Semiconductor Technology Co Ltd.Xiamen San'an Integrated Circuit Co., Ltd.Macroblock, Inc.
Boe Innovation Investment Co. Ltd.Honeywell International, Inc.Thales GroupAlps Alpine Co., Ltd.Raytheon Co.NGK SPARK PLUG CO., LTD.Hamamatsu Photonics KKRaytheon Technologies Corp.Japan Aviation Electronics Industry Ltd.OSRAM Opto Semiconductors GmbHNippon Seiki Co., Ltd.Freescale Semiconductor, Inc.LAPIS Semiconductor Co. Ltd.HELLA GmbH & Co. KGaAAnalog Devices, Inc.DePuy Synthes Products, Inc.Rosemount, Inc.Dr. Johannes Heidenhain GmbHThe Georgia Tech Research Corp.Shenzhen Goodix Technology Co., Ltd.Shenzhen Goodix Technology Co., Ltd.Furuno Electric Co., Ltd.Novatek Microelectronics Corp.Textron, Inc.Asahi Kasei Microdevices Corp.Meizu Technology Co. Ltd.PixArt Imaging, Inc.Tamagawa Seiki Co., Ltd.KEYENCE Corp.Weidmüller Interface GmbH & Co. KG
Kobe Steel, Ltd.POSCO Holdings Inc.IBIDEN Co., Ltd.Sintokogio Ltd.Noritake Co., Ltd.Ryobi Ltd.Foseco International Ltd.Fujimi, Inc.Elkem ASANovuton Technology Corp. JapanTokai Carbon Co., Ltd.Vanguard International Semiconductor Corp.Vanguard International Semiconductor Corp.Toyo Tanso Co., Ltd.KUKA Deutschland GmbHeMemory Technology, Inc.Datong Xincheng New Material Co., Ltd.Datong Xincheng New Material Co., Ltd.Uddeholms ABGiga Device Semiconductor, Inc.Nippon Yakin Kogyo Co., Ltd.Giga Device Semiconductor (Beijing), Inc.Gebr Eickhoff Maschinenfabrik & Eisengiesserei GmbHNewell Operating Co.ASK Chemicals GmbHvoestalpine Stahl GmbHX-FAB Semiconductor Foundries GmbHGrace Semiconductor Manufacturing Corp.Titanium Metals Corp.Lakshmi Machine Works Ltd.
Samsung Electronics Co., Ltd.OppoMicron Technology, Inc.Samsung Electro-Mechanics Co., Ltd.Hamamatsu Photonics KKSony Semiconductor Solutions Corp.Semiconductor Components Industries LLCMagnaChip Semiconductor Ltd.DB HITEK Co., Ltd.Cypress Semiconductor Corp.PixArt Imaging, Inc.LARGAN Precision Co., Ltd.Novuton Technology Corp. JapanSTMicroelectronics International NVIEE International Electronics & Engineering SABYD Semiconductor Co., Ltd.Huaian Imaging Device Manufacturer Corp.Huaian Imaging Device Manufacturer Corp.FUJIFILM Electronic Materials USA, Inc.OFILM Group Co., Ltd.FlexEnable Ltd.Corephotonics Ltd.PolyIC GmbH & Co. KGTeledyne Scientific & Imaging LLCISORG SAInvensas Bonding Technologies, Inc.PMD Technologies Ltd.SEKONIX Co., Ltd.AGC Techno Glass Co. Ltd.Artilux, Inc.
Huawei Technologies Co., Ltd.Ericsson, Inc.Intel Corp.Nippon Telegraph & Telephone Corp.ZTE Corp.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.NTT DOCOMO, Inc.vivo Mobile Communication Co., Ltd.Nokia Siemens Networks OyMediaTek, Inc.China Mobile Communications Group Co., Ltd.China Mobile Communications Group Co., Ltd.SZ DJI Technology Co., Ltd.telent Ltd.Mannesmann AGSK Telecom Co., Ltd.BlackBerry Ltd.Xiaomi Corp.Motorola Solutions, Inc.Nubia Technology Co., Ltd.KDDI Corp.China United Network Communications Ltd.Beijing University of Posts & TelecommunicationsMotorola Solutions Credit Co. LLCGuangzhou Shiyuan Electronic Technology Co. Ltd.Guangzhou Shiyuan Electronic Technology Co. Ltd.Deutsche Telekom AGHangzhou H3C Technologies Co., Ltd.China Telecom Corp. Ltd.
Sharp Corp.Alps Alpine Co., Ltd.Hamamatsu Photonics KKSony Semiconductor Solutions Corp.OSRAM Opto Semiconductors GmbHSemiconductor Components Industries LLCRosemount, Inc.Dr. Johannes Heidenhain GmbHShenzhen Goodix Technology Co., Ltd.Shenzhen Goodix Technology Co., Ltd.Novatek Microelectronics Corp.Keihin Corp.PixArt Imaging, Inc.Tamagawa Seiki Co., Ltd.Key Safety Systems, Inc.STMicroelectronics International NVWatlow Electric Manufacturing Co.Watlow Electric Manufacturing Co.Draeger Safety, Inc.ELAN Microelectronics Corp.ifm electronic GmbHPreh GmbHCrucialtec Co., Ltd.Pepperl+Fuchs, Inc.Egis Technology, Inc.Methode Electronics, Inc.BorgWarner Ludwigsburg GmbHInterface, Inc.FlexEnable Ltd.FIGARO Engineering, Inc.