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Samsung Electronics Co., Ltd.Canon, Inc.International Business Machines Corp.Fujitsu Ltd.General Electric Co.Huawei Technologies Co., Ltd.Seiko Epson Corp.SANYO Electric Co., Ltd.Intel Corp.ZTE Corp.Apple, Inc.FUJIFILM Corp.Hewlett-Packard Development Co.Eastman Kodak Co.Fujifilm Business Innovation Corp.Google LLCFujifilm Business Innovation Corp.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Honeywell International, Inc.Xerox Holdings Corp.Tencent Technology (Shenzhen) Co., Ltd.Alcatel-Lucent S AOlympus Corp.Microsoft Corp.Beijing Xiaomi Mobile Software Co., Ltd.Toyota Industries Corp.Muratec Automation Co., Ltd.Victor Company of Japan Ltd.Victor Company of Japan Ltd.
Xi'an Sinochip Semiconductors Co., Ltd.Wix.com Ltd.Chongqing Polycomp International Corp.Chongqing Polycomp International Corp.Orient Semiconductor Electronics Ltd.Shenzhen Huion Animation Technology Co. Ltd.NingXia XN Automation Equipment Co., Ltd.NingXia XN Automation Equipment Co., Ltd.TQ-Systems GmbHKnig + Neurath AGUnited Memories, Inc.Tela Innovations, Inc.Shenzhen Chipsbank Technologies Co., Ltd.Shenzhen Chipsbank Technologies Co., Ltd.Beijing UniStrong Science & Technology Co., Ltd.Beijing UniStrong Science & Technology Co., Ltd.IDEEMATEC Deutschland GmbHPeddinghaus CorpOber SAI&T GmbHSunfolding, Inc.Suzhou Juneng Machine Vision Technology Co., Ltd.Suzhou Juneng Machine Vision Technology Co., Ltd.Hangzhou Pinming Software Co., Ltd.Universal Electric Corp.Accelerated Systems, Inc.Best Technology (Shenzhen), Inc.Shanghai Supratec Environment Co., Ltd.Steinmüller Engineering GmbHAB Connectors Ltd.