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Samsung Electronics Co., Ltd.Canon, Inc.Canon, Inc.Hitachi Ltd.Fujitsu Ltd.Sharp Corp.SANYO Electric Co., Ltd.Sumitomo Electric Industries Ltd.Sumitomo Electric Industries Ltd.Sumitomo Chemical Co., Ltd.BOE Technology Group Co., Ltd.Boe Innovation Investment Co. Ltd.KYOCERA Chemical Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fuji Electronics Co., Ltd.Nikon Corp.OppoTaiwan Semiconductor Manufacturing Co., Ltd.Semiconductor Energy Laboratory Co., Ltd.Guangzhou Bosma Optoelectronic Technology Co. Ltd.Toppan, Inc.Fraunhofer-Gesellschaft eVSamsung Electro-Mechanics Co., Ltd.AGC, Inc. (Japan)ABB Automation, Inc.Renesas Electronics Corp.Shin-Etsu Chemical Co., Ltd.Alps Alpine Co., Ltd.Suzuki Co., Ltd.
Fujitsu Semiconductor Ltd.KIOXIA Corp.Canon Anelva Corp.Everspin Technologies, Inc.Crocus Technology, Inc.Samsung Semiconductor, Inc.CAPRES A/SGrandis, Inc.LuvHolding OyNVE Corp.4DS, Inc.Spin Transfer Technologies LLCFerroelectric Memory GmbHBeSang, Inc.MicroSense LLCOrganic Spintronics SRLHyper Tech Research, Inc.Supercon, Inc.
Crocus Technology, Inc.Fujitsu Semiconductor Memory Solution Ltd.Ramtron International Corp.Pageant Technologies, Inc.TECH Semiconductor Singapore Pte Ltd.Micromem Technologies, Inc.
Macronix International Co., Ltd.Fujitsu Semiconductor Ltd.KIOXIA Corp.Canon Anelva Corp.Everspin Technologies, Inc.Avalanche Technology, Inc.Crossbar, Inc.Samsung Semiconductor, Inc.Adesto Technologies Corp.Viking Tech Corp.Corsair Memory, Inc.CAPRES A/SNVE Corp.4DS, Inc.Spin Transfer Technologies LLCKilopass Technology, Inc.Ferroelectric Memory GmbHBeSang, Inc.MicroSense LLCHymedix International, Inc.Everspin Corp.Organic Spintronics SRL4DS Memory Ltd.
Micron Technology, Inc.Western Digital Technologies, Inc.Macronix International Co., Ltd.Rambus, Inc.Primax Electronics Ltd.KIOXIA Corp.Canon Anelva Corp.ProMOS Technologies, Inc.Fujitsu Microelectronics, Inc.Chicony Electronics Co., Ltd.Ability Opto-Electronics Technology Co., Ltd.Everspin Technologies, Inc.OFILM Group Co., Ltd.Sintai Optical (Shenzhen) Co. Ltd.Sintai Optical (Shenzhen) Co. Ltd.GeniuS Electronic Optical Co., Ltd.Jahwa Electronics Co., Ltd.PARTRON Co., Ltd.Etron Technology, Inc.Crocus Technology, Inc.Nantero, Inc.Ramaxel Technology (Shenzhen) Co. Ltd.Crossbar, Inc.HYSONIC Co., Ltd.Newmax Technology Co., Ltd.IEI Integration Corp.Beijing Memblaze Technology Co. Ltd.Beijing Memblaze Technology Co. Ltd.Adesto Technologies Corp.Floadia Corp.
Samsung Electronics Co., Ltd.Canon, Inc.Canon, Inc.Fujitsu Ltd.Sharp Corp.SANYO Electric Co., Ltd.Intel Corp.Sumitomo Electric Industries Ltd.Sumitomo Electric Industries Ltd.BOE Technology Group Co., Ltd.KYOCERA Chemical Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fuji Electronics Co., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Taiwan Semiconductor Manufacturing Co., Ltd.Semiconductor Energy Laboratory Co., Ltd.Guangzhou Bosma Optoelectronic Technology Co. Ltd.Samsung Electro-Mechanics Co., Ltd.Renesas Electronics Corp.Shin-Etsu Chemical Co., Ltd.Alps Alpine Co., Ltd.Yamaha Corp.Suzuki Co., Ltd.Showa Denko Materials Co. Ltd.Resonac Corp.Sumitomo Metal Industries Ltd.Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd.Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd.
Samsung Electronics Co., Ltd.Canon, Inc.Canon, Inc.LG Electronics, Inc.International Business Machines Corp.Fujitsu Ltd.Sharp Corp.Ricoh Co., Ltd.Seiko Epson Corp.SANYO Electric Co., Ltd.ZTE Corp.Apple, Inc.FUJIFILM Corp.BOE Technology Group Co., Ltd.Hewlett-Packard Development Co.Brother Industries, Ltd.Eastman Kodak Co.Boe Innovation Investment Co. Ltd.Fujifilm Business Innovation Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fujifilm Business Innovation Corp.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Xerox Holdings Corp.Semiconductor Energy Laboratory Co., Ltd.Mita Industrial Co., Ltd.Guangzhou Bosma Optoelectronic Technology Co. Ltd.Toppan, Inc.Konica Minolta, Inc.