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Fujikura Ltd.Anritsu Corp.Fiberhome Telecommunication Technologies Co., Ltd.Enplas Corp.AVIC Jonhon Optronic Technology Co., Ltd.AVIC Jonhon Optronic Technology Co., Ltd.ViaSat, Inc.Tatsuta Electric Wire & Cable Co., Ltd.Tatsuta Electric Wire & Cable Co., Ltd.Corning Precision Materials Korea Co., Ltd.Finisar Corp.Finisar Corp.Lumentum Operations LLCHengtong Optic-Electric Co., Ltd.OFS Fitel LLCCrucialtec Co., Ltd.Infinera Corp.SENKO Advanced Components, Inc.Xiamen San'an Optoelectronics Technology Co., Ltd.Xiamen San'an Optoelectronics Technology Co., Ltd.Wuhan Research Institute of Post & Telecommunications Co. Ltd.Guangzhou Haige Communications Group Inc. Co.Guangzhou Haige Communications Group Inc. Co.Osaki Electric Co., Ltd.Thorlabs, Inc.NeoPhotonics Corp.Chaozhou Three-Circle (Group) Co., Ltd.Shenzhen Jpt Opto-Electronics Co. Ltd.Hong Kong Productivity CouncilKinik Co.
Fujitsu Ltd.International Business Machines Corp.Google LLCEastman Kodak Co.3M Co.Microsoft Corp.Beijing Xiaomi Mobile Software Co., Ltd.Baidu Online Network Technology (Beijing) Co., Ltd.BlackBerry Ltd.Deutsche Telekom AGNetEase (Hangzhou) Network Co., Ltd.Beijing Jingdong Shangke Information Technology Co., Ltd.Beijing Jingdong Shangke Information Technology Co., Ltd.VMware, Inc.Citrix Systems, Inc.LEGO A/SLEGO A/SAltera Corp.Avaya, Inc.Sandvik AktiebolagHeroku, Inc.Alcatel-Lucent Shanghai Bell Co., Ltd.Olivetti SpASaudi Basic Industries Corp.CA Technologies, Inc.Samsung SDS Europe Ltd.Hitachi Advanced Digital, Inc.Qizhi Software (Beijing) Co. Ltd.NEC Communication Systems Ltd.Oce Technologies BV
Samsung Electronics Co., Ltd.Canon, Inc.Canon, Inc.Fujitsu Ltd.General Electric Co.General Electric Co.Seiko Epson Corp.SANYO Electric Co., Ltd.Intel Corp.FUJIFILM Corp.Apple, Inc.Samsung Display Co., Ltd.Hewlett-Packard Development Co.Google LLCEastman Kodak Co.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Fujifilm Business Innovation Corp.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Honeywell International, Inc.Xerox Holdings Corp.Tencent Technology (Shenzhen) Co., Ltd.Oki Electric Industry Co., Ltd.Olympus Corp.Tencent Technology (Shenzhen) Co., Ltd.Motorola, Inc.TDK Corp.Alcatel-Lucent S AToyota Industries Corp.Microsoft Corp.Victor Company of Japan Ltd.
Samsung Electronics Co., Ltd.SK hynix, Inc.OppoMicron Technology, Inc.Samsung Electro-Mechanics Co., Ltd.Hamamatsu Photonics KKSony Semiconductor Solutions Corp.United Microelectronics Corp.MagnaChip Semiconductor Ltd.DB HITEK Co., Ltd.Cypress Semiconductor Corp.LARGAN Precision Co., Ltd.PixArt Imaging, Inc.STMicroelectronics International NVNovuton Technology Corp. JapanSarnoff Corp.IEE International Electronics & Engineering SASony Group Corp.FUJIFILM Electronic Materials USA, Inc.Huaian Imaging Device Manufacturer Corp.Huaian Imaging Device Manufacturer Corp.VisEra Technologies Co., Ltd.Corephotonics Ltd.FlexEnable Ltd.PolyIC GmbH & Co. KGTeledyne Scientific & Imaging LLCISORG SAPMD Technologies Ltd.Invensas Bonding Technologies, Inc.SEKONIX Co., Ltd.
Honeywell International, Inc.Toyota Industries Corp.FANUC Corp.Mitsubishi Motors Corp.Yokogawa Electric Corp.Daihatsu Motor Co., Ltd.YASKAWA Electric Corp.Magic Leap, Inc.Emerson Electric Co.Valmet Corp.PixArt Imaging, Inc.Nachi-Fujikoshi Corp.Denso Wave, Inc.KEYENCE Corp.VEGA Grieshaber KGTeradyne, Inc.Fluke Corp.Jungheinrich AGMetal Industries Research & Development CentreUnimicron Technology Corp.Baker Perkins Ltd.Dassault Systèmes SANippon Avionics Co., Ltd.Kollmorgen Corp.Reliance Electric Ltd.Comau SpAAuris Health, Inc.Beckhoff Automation GmbH & Co. KGM-System Co., Ltd.Kehua Data Co., Ltd.
