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Kobe Steel, Ltd.JFE Holdings, Inc.IBIDEN Co., Ltd.Sintokogio Ltd.Noritake Co., Ltd.Ryobi Ltd.Foseco International Ltd.Fujimi, Inc.Elkem ASANovuton Technology Corp. JapanTokai Carbon Co., Ltd.Vanguard International Semiconductor Corp.Vanguard International Semiconductor Corp.Tata Steel Ltd.Toyo Tanso Co., Ltd.ChipMOS Technologies, Inc.Showa Manufacturing Co., Ltd.KUKA Deutschland GmbHeMemory Technology, Inc.Datong Xincheng New Material Co., Ltd.Datong Xincheng New Material Co., Ltd.Uddeholms ABG. Siempelkamp GmbH & Co. KGGiga Device Semiconductor, Inc.Giga Device Semiconductor (Beijing), Inc.Gebr Eickhoff Maschinenfabrik & Eisengiesserei GmbHVereinigte Edelstahlwerke AGNewell Operating Co.ASK Chemicals GmbHVisEra Technologies Co., Ltd.
LG Electronics, Inc.Sharp Corp.Ericsson, Inc.Nippon Telegraph & Telephone Corp.Kyocera Corp.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Electronics & Telecommunications Research InstituteAlcatel-Lucent S ANTT DOCOMO, Inc.Showa Denko Materials Co. Ltd.Resonac Corp.Western Electric Co., Inc.Fujikura Ltd.Hitachi Metals, Ltd.Proterial Ltd.vivo Mobile Communication Co., Ltd.Nokia Siemens Networks OyLucent Technologies, Inc.BT Group PlcChina Mobile Communications Group Co., Ltd.China Mobile Communications Group Co., Ltd.Mannesmann AGJapan Aviation Electronics Industry Ltd.SK Telecom Co., Ltd.BlackBerry Ltd.Motorola Solutions, Inc.Nubia Technology Co., Ltd.Nanjing University of Posts & TelecommunicationsKDDI Corp.