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Samsung Electronics Co., Ltd.Canon, Inc.International Business Machines Corp.Fujitsu Ltd.General Electric Co.Huawei Technologies Co., Ltd.Seiko Epson Corp.SANYO Electric Co., Ltd.Intel Corp.Apple, Inc.ZTE Corp.FUJIFILM Corp.Hewlett-Packard Development Co.Eastman Kodak Co.Fujifilm Business Innovation Corp.Google LLCFujifilm Business Innovation Corp.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Honeywell International, Inc.Xerox Holdings Corp.Tencent Technology (Shenzhen) Co., Ltd.Motorola, Inc.Alcatel-Lucent S AOlympus Corp.Microsoft Corp.Beijing Xiaomi Mobile Software Co., Ltd.Toyota Industries Corp.Muratec Automation Co., Ltd.Victor Company of Japan Ltd.
Samsung Electronics Co., Ltd.Canon, Inc.Hitachi Ltd.Fujitsu Ltd.Sharp Corp.SANYO Electric Co., Ltd.Intel Corp.Sumitomo Electric Industries Ltd.Sumitomo Chemical Co., Ltd.BOE Technology Group Co., Ltd.Boe Innovation Investment Co. Ltd.Taiwan Semiconductor Manufacturing Co., Ltd.KYOCERA Chemical Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fuji Electronics Co., Ltd.Nikon Corp.OppoTaiwan Semiconductor Manufacturing Co., Ltd.Semiconductor Energy Laboratory Co., Ltd.Toppan, Inc.Samsung Electro-Mechanics Co., Ltd.AGC, Inc. (Japan)ABB Automation, Inc.Renesas Electronics Corp.Shin-Etsu Chemical Co., Ltd.Alps Alpine Co., Ltd.Suzuki Co., Ltd.Showa Denko Materials Co. Ltd.South China University of Technology
Acculogic, Inc.
JTAG Technologies BVAcculogic, Inc.
WEGMANN automotive GmbH & Co. KGJiangsu Kangjie Environmental Engineering Co. Ltd.Professional Compounding Centers of America, Inc.A.W.M. SpATournaire SASanyo Seiki Co. Ltd.Meccanica Finnord SpAHonsel Umformtechnik GmbHRik-fer SrlEms Togo Ltd.Shoei Industries Co., Ltd.Nussbaum Technologies GmbHBirel SpaSPX (Guangzhou) Cooling Technologies Co. Ltd.Nemesio Zubia SADescours & Cabaud SA
Samsung Electronics Co., Ltd.Canon, Inc.Fujitsu Ltd.Sharp Corp.SANYO Electric Co., Ltd.Intel Corp.Sumitomo Electric Industries Ltd.BOE Technology Group Co., Ltd.Taiwan Semiconductor Manufacturing Co., Ltd.KYOCERA Chemical Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fuji Electronics Co., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Taiwan Semiconductor Manufacturing Co., Ltd.Semiconductor Energy Laboratory Co., Ltd.Samsung Electro-Mechanics Co., Ltd.Renesas Electronics Corp.Shin-Etsu Chemical Co., Ltd.Alps Alpine Co., Ltd.Yamaha Corp.Suzuki Co., Ltd.Showa Denko Materials Co. Ltd.Resonac Corp.Sumitomo Metal Industries Ltd.Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd.TCL China Star Optoelectronics Technology Co., Ltd.NXP Semiconductors (Thailand) Co., Ltd.NGK SPARK PLUG CO., LTD.
Taiwan Semiconductor Manufacturing Co., Ltd.Taiwan Semiconductor Manufacturing Co., Ltd.Western Digital Technologies, Inc.Xilinx, Inc.Altera Corp.Chitkara UniversityGenetec Corp.Gowin Semiconductor Corp.QuickLogic Corp.Flex Logix Technologies, Inc.Zhongke Ehiway Microelectronics Technology (Suzhou) Co., Ltd.Achronix Semiconductor Corp.Shri Ramdeobaba College of Engineering & ManagementInnovationszentrum für Telekommunikationstechnik GmbH IZTS2C, Inc.Fachhochschule Technikum WienInstituto Superior Politecnico Jose Antonio EcheverriaJTAG Technologies BVM S Ramaiah School of Advanced StudiesIQ-Analog Corp.Université Cergy-PontoiseSilego Technology, Inc.Acculogic, Inc.Efinix, Inc.Tabula, Inc.Sandensha KKReal Intent, Inc.Abound Logic, Inc.Triscend Corp.Xylon D O O