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Harbin Institute of TechnologyBeihang UniversityDart Robot Co., Ltd.Zhejiang Xinan Chemical Industrial Group Co., Ltd.Midé Technology Corp.Kearfott Corp.Institute of Space TechnologyPioneer Astronautics
General Electric Co.General Electric Co.Honeywell International, Inc.The Boeing Co.Thales GroupSubaru Corp.SNECMA SARaytheon Co.Subaru Corp.Beihang UniversityLucas Industries PlcDaicel Corp.KYB Corp.Hughes Aircraft Co.Airbus Operations Ltd.SZ DJI Technology Co., Ltd.Raytheon Technologies Corp.Japan Aviation Electronics Industry Ltd.Hamilton Sundstrand Corp.AlliedSignal, Inc.Eclipse Aviation Corp.Tektronix, Inc.Deutsches Zentrum für Luft- und Raumfahrt e.V.United Aircraft Corp.Analog Devices, Inc.Mitsubishi Cable Industries Ltd.Voith GmbH & Co. KGaAMesserschmitt-Boelkow-Blohm GmbHMesserschmitt-Boelkow-Blohm GmbHNorthrop Grumman Systems Corp.
Boe Innovation Investment Co. Ltd.Honeywell International, Inc.Thales GroupAlps Alpine Co., Ltd.Raytheon Co.NGK SPARK PLUG CO., LTD.Hamamatsu Photonics KKJapan Aviation Electronics Industry Ltd.Nippon Seiki Co., Ltd.Freescale Semiconductor, Inc.LAPIS Semiconductor Co. Ltd.Analog Devices, Inc.DePuy Synthes Products, Inc.Dr. Johannes Heidenhain GmbHThe Georgia Tech Research Corp.Shenzhen Goodix Technology Co., Ltd.Shenzhen Goodix Technology Co., Ltd.Furuno Electric Co., Ltd.Novatek Microelectronics Corp.Textron, Inc.Asahi Kasei Microdevices Corp.Meizu Technology Co. Ltd.Tamagawa Seiki Co., Ltd.KEYENCE Corp.Weidmüller Interface GmbH & Co. KGFerranti Ltd.Piaggio & C SpAB/E Aerospace, Inc.Piaggio & C SpACooper Industries LLC
Diehl Aerospace GmbHElbit Systems of America LLCL-3 Communication Security & Detection Systems Corp.Innovative Solutions & Support, Inc.Garmin International, Inc.Astronics Corp.Global Eagle Entertainment, Inc.Aspen Avionics, Inc.Esterline Technologies Corp.AvioVision NVuAvionix Corp.DAC International, Inc.Teledyne Controls LLC
Haier Smart Home Co., Ltd.HOSHIZAKI Corp.Mayekawa MFG Co., Ltd.VACUUMSCHMELZE GmbH & Co. KGBaltimore Aircoil Co.ALi Corp.Cooltech Applications SASInner Mongolia Normal UniversityEramet SAJean Chereau SASInstituto Potosino de Investigacion Cientifica y TecnologicaCamfridge Ltd.kiutra GmbHWelbilt, Inc.Advansor A/S
Volvo Penta ABDiehl Aerospace GmbHElbit Systems of America LLCL-3 Communication Security & Detection Systems Corp.Garmin International, Inc.Universal Avionics Systems Corp.Honeywell AerospaceAspen Avionics, Inc.Avidyne Corp.Esterline Technologies Corp.uAvionix Corp.
Samsung Electronics Co., Ltd.Canon, Inc.Canon, Inc.Fujitsu Ltd.Sharp Corp.SANYO Electric Co., Ltd.Intel Corp.Sumitomo Electric Industries Ltd.Sumitomo Electric Industries Ltd.BOE Technology Group Co., Ltd.KYOCERA Chemical Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fuji Electronics Co., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Taiwan Semiconductor Manufacturing Co., Ltd.Semiconductor Energy Laboratory Co., Ltd.Guangzhou Bosma Optoelectronic Technology Co. Ltd.Samsung Electro-Mechanics Co., Ltd.Renesas Electronics Corp.Shin-Etsu Chemical Co., Ltd.Alps Alpine Co., Ltd.Yamaha Corp.Suzuki Co., Ltd.Showa Denko Materials Co. Ltd.Resonac Corp.Sumitomo Metal Industries Ltd.Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd.Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd.
