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Samsung Electronics Co., Ltd.Canon, Inc.Canon, Inc.Hitachi Ltd.Fujitsu Ltd.Sharp Corp.SANYO Electric Co., Ltd.Intel Corp.Sumitomo Electric Industries Ltd.Sumitomo Electric Industries Ltd.BOE Technology Group Co., Ltd.Boe Innovation Investment Co. Ltd.KYOCERA Chemical Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fuji Electronics Co., Ltd.Nikon Corp.OppoTaiwan Semiconductor Manufacturing Co., Ltd.Semiconductor Energy Laboratory Co., Ltd.Guangzhou Bosma Optoelectronic Technology Co. Ltd.Toppan, Inc.Fraunhofer-Gesellschaft eVAGC, Inc. (Japan)ABB Automation, Inc.Renesas Electronics Corp.Shin-Etsu Chemical Co., Ltd.Alps Alpine Co., Ltd.Suzuki Co., Ltd.Showa Denko Materials Co. Ltd.
Giesecke+Devrient GmbHCA Technologies, Inc.Fortinet, Inc.Trend Micro, Inc.Fortinet, Inc.Palo Alto Networks, Inc.Quest Software, Inc.Leidos, Inc.Kaspersky Lab ZAOSophos Ltd.CrowdStrike, Inc.Mandiant, Inc.Forcepoint LLCAvast Software sroCross Match Technologies, Inc.Cassidian Ltd.DocuSign, Inc.Booz Allen Hamilton, Inc.Jumio Corp.RSA Security LLCCyberArk Software Ltd.Webroot, Inc.myPINpad Ltd.KnowBe4, Inc.Airbus Defence & Space SARapid7, Inc.Trustonic Ltd.Microcosm Technology Co., Ltd.Gigamon, Inc.Biolog-id SAS
Samsung Electronics Co., Ltd.Toyota Motor Corp.Huawei Technologies Co., Ltd.Apple, Inc.OppoNTT DOCOMO, Inc.Fujikura Ltd.Lenovo Group Ltd.Datang Mobile Communications Equipment Co. Ltd.BlackBerry Ltd.Xiaomi Corp.Motorola Solutions, Inc.KDDI Corp.China United Network Communications Ltd.Motorola Mobility LLCNintendo Co., Ltd.Motorola Solutions Credit Co. LLCOrange SAGoerTek Inc.Deutsche Telekom AGChina Telecom Corp. Ltd.Toyo Ink SC Holdings Co. Ltd.Giesecke+Devrient GmbHLear Corp.Skyworks Solutions, Inc.Chunghwa Picture Tubes Ltd.PayPal, Inc.Nanya Technology Corp.Shenzhen Royole Technologies Co., Ltd.Meizu Technology Co. Ltd.
Thales GroupRaytheon Co.Hewlett Packard Enterprise Development LPBT Group PlcMotorola Solutions, Inc.Hangzhou H3C Technologies Co., Ltd.Juniper Networks, Inc.Lear Corp.SRI InternationalBundesdruckerei GmbHChina Academy of Telecommunications TechnologyBull SAMcAfee LLCTarget Corp.Huizhou Desay SV Automotive Co., Ltd.Neusoft Corp.Huizhou Desay SV Automotive Co., Ltd.Roke Manor Research Ltd.Hangzhou DPtech Technologies Co., Ltd.Qi An Xin Technology Group, Inc.Hangzhou DPtech Technologies Co., Ltd.Irdeto BVSplunk, Inc.Beijing Topsec Network Security Technology Co. Ltd.S-1 Corp. (Korea)S-1 Corp. (Korea)ELTA Systems Ltd.Akamai Technologies, Inc.Beijing Topsec Network Security Technology Co. Ltd.VeriSign, Inc.
MediaTek, Inc.EM Microelectronic-Marin SAMStar Semiconductor, Inc.Samsung Semiconductor, Inc.Wha Yu Industrial Co., Ltd.Visa Europe Ltd.On Track Innovations Ltd.Innovent LLCDeviceFidelity, Inc.Securitag Assembly Group Co., Ltd.Identiv, Inc.ViVOtech, Inc.Veridify Security, Inc.FIME SASOne2Touch ASTapcentive, Inc.XRomb, Inc.Miura Systems Ltd.Proximiant, Inc.Aquabit Spirals, Inc.Keri Systems, Inc.Proxama Ltd.Ensygnia Ltd.Toro Development SL
Shenzhen Goodix Technology Co., Ltd.Shenzhen Goodix Technology Co., Ltd.Schlage Lock Co.Egis Technology, Inc.IDEX Biometrics ASAPrecise Biometrics ABUNION COMMUNITY Co., Ltd.Oubao Security Technology Co., Ltd.XGD, Inc.MIAXIS BIOMETRICS Co., Ltd.Zhejiang Wellcom Technology Co., Ltd.J-Metrics Technology Co., Ltd.TRAIS Co., Ltd.Guangzhou Heshi Office Equipment Co., Ltd.Identix, Inc.Nanogap Sub NM Powder SANoblis, Inc.NightHawk Biosciences, Inc.DigitalPersona, Inc.Shenzhen Myhand Industrial Co., Ltd.SecuGen Corp.Lightuning Technology, Inc.Lightuning Technology, Inc.Image Match Design, Inc.Suprema HQ, Inc.Next Biometrics Group ASCrime Science Technology SASYantai Seayu New Materials Co., Ltd.BEFS Co., Ltd.ImageWare Systems, Inc.
Samsung Electronics Co., Ltd.Canon, Inc.Fujitsu Ltd.Sharp Corp.SANYO Electric Co., Ltd.Sumitomo Electric Industries Ltd.BOE Technology Group Co., Ltd.KYOCERA Chemical Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fuji Electronics Co., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Taiwan Semiconductor Manufacturing Co., Ltd.Semiconductor Energy Laboratory Co., Ltd.Guangzhou Bosma Optoelectronic Technology Co. Ltd.Samsung Electro-Mechanics Co., Ltd.Renesas Electronics Corp.Shin-Etsu Chemical Co., Ltd.Alps Alpine Co., Ltd.Yamaha Corp.Suzuki Co., Ltd.Showa Denko Materials Co. Ltd.Resonac Corp.Sumitomo Metal Industries Ltd.Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd.NXP Semiconductors (Thailand) Co., Ltd.NGK SPARK PLUG CO., LTD.NXP BVTCL China Star Optoelectronics Technology Co., Ltd.