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Samsung Electronics Co., Ltd.Canon, Inc.LG Electronics, Inc.International Business Machines Corp.Fujitsu Ltd.Sharp Corp.Ricoh Co., Ltd.Ricoh Co., Ltd.Seiko Epson Corp.SANYO Electric Co., Ltd.Intel Corp.ZTE Corp.Apple, Inc.FUJIFILM Corp.BOE Technology Group Co., Ltd.Hewlett-Packard Development Co.Brother Industries, Ltd.Eastman Kodak Co.Boe Innovation Investment Co. Ltd.Fujifilm Business Innovation Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fujifilm Business Innovation Corp.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Xerox Holdings Corp.Semiconductor Energy Laboratory Co., Ltd.Mita Industrial Co., Ltd.Toppan, Inc.Konica Minolta, Inc.
Samsung Electronics Co., Ltd.LG Electronics, Inc.General Electric Co.Sharp Corp.Seiko Epson Corp.SANYO Electric Co., Ltd.E.I. du Pont de Nemours & Co.EIDP, Inc.Intel Corp.Sumitomo Electric Industries Ltd.Apple, Inc.Brother Industries, Ltd.KYOCERA Chemical Corp.Fujifilm Business Innovation Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Toshiba Chemical Corp.Fujifilm Business Innovation Corp.Fuji Electronics Co., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.OppoTaiwan Semiconductor Manufacturing Co., Ltd.Daewoo Electronics Co. Ltd.DAIKIN INDUSTRIES Ltd.Honeywell International, Inc.Nitto Electric Industrial Co. Ltd.Kobe Steel, Ltd.Casio Computer Co., Ltd.Midea Group Co. Ltd.
Huawei Technologies Co., Ltd.Ericsson, Inc.Intel Corp.Nippon Telegraph & Telephone Corp.ZTE Corp.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.NTT DOCOMO, Inc.vivo Mobile Communication Co., Ltd.Nokia Siemens Networks OyMediaTek, Inc.China Mobile Communications Group Co., Ltd.China Mobile Communications Group Co., Ltd.SZ DJI Technology Co., Ltd.telent Ltd.Mannesmann AGSK Telecom Co., Ltd.BlackBerry Ltd.Xiaomi Corp.Motorola Solutions, Inc.Nubia Technology Co., Ltd.KDDI Corp.China United Network Communications Ltd.Beijing University of Posts & TelecommunicationsMotorola Solutions Credit Co. LLCGuangzhou Shiyuan Electronic Technology Co. Ltd.Guangzhou Shiyuan Electronic Technology Co. Ltd.Deutsche Telekom AGHangzhou H3C Technologies Co., Ltd.China Telecom Corp. Ltd.
Samsung Electronics Co., Ltd.Canon, Inc.International Business Machines Corp.Fujitsu Ltd.General Electric Co.Huawei Technologies Co., Ltd.Seiko Epson Corp.SANYO Electric Co., Ltd.Intel Corp.ZTE Corp.Apple, Inc.FUJIFILM Corp.Hewlett-Packard Development Co.Eastman Kodak Co.Fujifilm Business Innovation Corp.Google LLCFujifilm Business Innovation Corp.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Honeywell International, Inc.Xerox Holdings Corp.Tencent Technology (Shenzhen) Co., Ltd.Alcatel-Lucent S AOlympus Corp.Microsoft Corp.Beijing Xiaomi Mobile Software Co., Ltd.Toyota Industries Corp.Muratec Automation Co., Ltd.Victor Company of Japan Ltd.Victor Company of Japan Ltd.
Brother Industries, Ltd.Toshiba Tec Corp.Avery Dennison Corp.Swatch AGHitachi Industrial Equipment Systems Co., Ltd.Hand Held Products, Inc.Mpac Group PlcShandong New Beiyang Information Technology Co., Ltd.Zebra Technologies Corp.Shandong New Beiyang Information Technology Co., Ltd.Fuji Seal International, Inc.ITW Ltd.Meto International GmbHOmori Machinery Co., Ltd.Brady Worldwide, Inc.Bemis Co., Inc.Domino Printing Sciences PlcDover Corp.Shenzhen Zhilai Sci & Tech Co. Ltd.Nashua Corp.Shenzhen Zhilai Sci & Tech Co. Ltd.Guala Closures SpAIWK Verpackungstechnik GmbHImpinj, Inc.Spectra Systems Corp.DataLase Ltd.Iconex LLCSmiths Detection LLCKweichow Moutai Co., Ltd.Invengo Information Technology Co., Ltd.
Samsung Electronics Co., Ltd.Canon, Inc.Hitachi Ltd.Fujitsu Ltd.Sharp Corp.SANYO Electric Co., Ltd.Intel Corp.Sumitomo Electric Industries Ltd.Sumitomo Chemical Co., Ltd.BOE Technology Group Co., Ltd.Boe Innovation Investment Co. Ltd.KYOCERA Chemical Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fuji Electronics Co., Ltd.Nikon Corp.OppoTaiwan Semiconductor Manufacturing Co., Ltd.Semiconductor Energy Laboratory Co., Ltd.Toppan, Inc.Samsung Electro-Mechanics Co., Ltd.AGC, Inc. (Japan)ABB Automation, Inc.Renesas Electronics Corp.Shin-Etsu Chemical Co., Ltd.Alps Alpine Co., Ltd.Suzuki Co., Ltd.Showa Denko Materials Co. Ltd.South China University of TechnologySoutheast University
Chi Mei Optoelectronics Corp.Renesas Technology Corp.NXP USA, Inc.NEC Electronics Corp.Hyundai MicroElectronics Co., Ltd.Dongbu Electronics Co. Ltd.FCI SAHitachi Displays Ltd.Elpida Memory, Inc.Thomas & Betts Ltd.Yungu (Gu'an) Technology Co., Ltd.Prime View International Co. Ltd.Greatbatch Ltd.Optrex Corp.Hokuriku Electric Industry Co., Ltd.Hokuriku Electric Industry Co., Ltd.Shanghai Huali Integrated Circuit Manufacturing Co., Ltd.KYOCERA AVX Components Corp.Micronas GmbHShanghai Huali Integrated Circuit Manufacturing Co., Ltd.Kawasaki Microelectronics, Inc.Teikoku Tsushin Kogyo Co., Ltd.Sharp NEC Display Solutions, Ltd.Shoei Chemical, Inc.Zgmicro Wuxi Co. Ltd.Sharp NEC Display Solutions, Ltd.Fositek Corp.Uchihashi Estec Co., Ltd.FCI Americas Technology LLCChangzhou Borui Power Automation Equipment Co., Ltd.