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Samsung Electronics Co., Ltd.Canon, Inc.Hitachi Ltd.Fujitsu Ltd.Sharp Corp.SANYO Electric Co., Ltd.Intel Corp.Sumitomo Electric Industries Ltd.Sumitomo Chemical Co., Ltd.BOE Technology Group Co., Ltd.Boe Innovation Investment Co. Ltd.KYOCERA Chemical Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fuji Electronics Co., Ltd.Nikon Corp.OppoTaiwan Semiconductor Manufacturing Co., Ltd.Semiconductor Energy Laboratory Co., Ltd.Toppan, Inc.Fraunhofer-Gesellschaft eVSamsung Electro-Mechanics Co., Ltd.AGC, Inc. (Japan)ABB Automation, Inc.Renesas Electronics Corp.Shin-Etsu Chemical Co., Ltd.Alps Alpine Co., Ltd.Suzuki Co., Ltd.Showa Denko Materials Co. Ltd.South China University of Technology
Samsung Electronics Co., Ltd.Canon, Inc.Canon, Inc.Sony Group Corp.International Business Machines Corp.Fujitsu Ltd.General Electric Co.Huawei Technologies Co., Ltd.Seiko Epson Corp.SANYO Electric Co., Ltd.ZTE Corp.Apple, Inc.FUJIFILM Corp.Hewlett-Packard Development Co.Eastman Kodak Co.Fujifilm Business Innovation Corp.Fujifilm Business Innovation Corp.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Honeywell International, Inc.Xerox Holdings Corp.Tencent Technology (Shenzhen) Co., Ltd.Alcatel-Lucent S AMicrosoft Corp.Beijing Xiaomi Mobile Software Co., Ltd.Toyota Industries Corp.Muratec Automation Co., Ltd.Victor Company of Japan Ltd.Victor Company of Japan Ltd.Beijing Xiaomi Mobile Software Co., Ltd.
Hitachi Ltd.LG Electronics, Inc.Toyota Motor Corp.Fujitsu Ltd.General Electric Co.General Electric Co.Ericsson, Inc.Intel Corp.Apple, Inc.Boe Innovation Investment Co. Ltd.Google LLCHoneywell International, Inc.Xerox Holdings Corp.Bayerische Motoren Werke AGAlcatel-Lucent S ANTT DOCOMO, Inc.Renesas Electronics Corp.Dow Global Technologies LLCMicrosoft Corp.Toshiba Lighting & Technology Corp.Toyoda Gosei Co., Ltd.Toshiba Lighting & Technology Corp.Hilti AGMediaTek, Inc.Aisin AW Co., Ltd.Boston Scientific Scimed, Inc.Advanced Micro Devices, Inc.Otis Elevator Co.Azbil Corp.SK Telecom Co., Ltd.
Fujitsu Ltd.Taiwan Semiconductor Manufacturing Co., Ltd.South China University of TechnologyMediaTek, Inc.Advantest Corp.Toyota Central R&D Labs, Inc.Nanjing University of Posts & TelecommunicationsSocionext, Inc.Shinko Electric Industries Co., Ltd.Shinko Electric Industries Co., Ltd.Fujitsu Semiconductor Ltd.DB HITEK Co., Ltd.Advanced Semiconductor Engineering, Inc.EPISTAR Corp.Novatek Microelectronics Corp.Synopsys, Inc.Dowa Electronics Materials Co., Ltd.Rambus, Inc.KIOXIA Corp.Canon Anelva Corp.Siliconware Precision Industries Co., Ltd.Power Integrations, Inc.International Rectifier Corp.STATS ChipPAC Pte Ltd.Nagoya Institute of TechnologyChipMOS Technologies, Inc.Nuvoton Technology Corp.Powertech Technology, Inc.JCET Group Co., Ltd.eMemory Technology, Inc.
DB HITEK Co., Ltd.Novatek Microelectronics Corp.LX Semicon Co., Ltd.Faraday Technology Corp.TongFu Microelectronics Co., Ltd.Sitronix Technology Corp.BitMain Technologies Holding Co.Lasertec Corp.Amkor Technology, Inc.BitMain Technologies Holding Co.Walton Advanced Engineering, Inc.Lingsen Precision Industries Ltd.Canaan Creative Co., Ltd.HiSilicon Technologies Co., Ltd.Andes Technology Corp.Shanghai Huahong Group Co., Ltd.United Semiconductor (Xiamen) Co., Ltd.Groq, Inc.United Semiconductor (Xiamen) Co., Ltd.Applied Micro Circuits Corp.Canaan, Inc.Digital Media Professionals Inc.Celis Semiconductor Corp.Advanced Digital Chips, Inc.Wiliot Ltd.Standing Egg, Inc.sureCore Ltd.Kneron, Inc.Airmems SASWD Silicone Co., Ltd.
Samsung Electronics Co., Ltd.Canon, Inc.Canon, Inc.Fujitsu Ltd.Sharp Corp.SANYO Electric Co., Ltd.Intel Corp.Sumitomo Electric Industries Ltd.Sumitomo Electric Industries Ltd.BOE Technology Group Co., Ltd.KYOCERA Chemical Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fuji Electronics Co., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Taiwan Semiconductor Manufacturing Co., Ltd.Oki Electric Industry Co., Ltd.Semiconductor Energy Laboratory Co., Ltd.Micron Technology, Inc.Samsung Electro-Mechanics Co., Ltd.Renesas Electronics Corp.Shin-Etsu Chemical Co., Ltd.Alps Alpine Co., Ltd.Yamaha Corp.Suzuki Co., Ltd.Showa Denko Materials Co. Ltd.Resonac Corp.Sumitomo Metal Industries Ltd.Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd.
Fujitsu Semiconductor Ltd.Xilinx, Inc.DB HITEK Co., Ltd.Advanced Semiconductor Engineering, Inc.X-FAB Semiconductor Foundries GmbHAmkor Technology, Inc.Empyrean Technology Co., Ltd.ANSYS, Inc.Xcerra Corp.Zuken Ltd.Magma Design Automation LLCComair Rotron, Inc.Jedat Inc.Jasper Design Automation, Inc.Zipalog, Inc.Tellurex Corp.IOTA TechnologySilvaco, Inc.MEP Technologies, Inc.Boyd Corp. (Woburn), Inc.Hammond Power Solutions, Inc.Breker Verification Systems, Inc.Kooltronic, Inc.Athena Design Systems, Inc.Teklatech A/SValid Logic Systems, Inc.Certess, Inc.Sagantec Israel Ltd.Helic SAIncentia Design Systems, Inc.