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LIG Nex1 Co., Ltd.Raytheon Co.Nokia Siemens Networks OyTokin Corp. /JP/National University of Defense TechnologyNational University of Defense TechnologyAsahi Kasei Microdevices Corp.Guangdong Galanz Enterprises Co., Ltd.New Japan Radio Co., Ltd.Nisshinbo Micro Devices, Inc.Leica Geosystems AGL3Harris Technologies ASA Ltd.Roke Manor Research Ltd.Israel Aerospace Industries Ltd.Keysight Technologies, Inc.MCI, Inc.MCI, Inc.USG Interiors LLCAselsan Elektronik Sanayi ve Ticaret ASMACOM Technology Solutions Holdings, Inc.Vaisala OyjSun Create Electronics Co., Ltd.WM Motor Technology Co., Ltd.Rheinmetall Air Defence AGShanghai Hesai Technology Co., LtdGuangzhou Haige Communications Group Inc. Co.Guangzhou Haige Communications Group Inc. Co.China North Industries Corp.Shenzhen Silver Basis Technology Co., Ltd.Beijing Rigol Electronic Co. Ltd.
Russia Federal Space AgencyWuhan UniversityCalifornia Institute of TechnologyDeutsches Zentrum für Luft- und Raumfahrt e.V.Trimble Navigation Ltd.National Central UniversityNational Central UniversityInstitut National Polytechnique de GrenobleSpace Star Technology Co., Ltd.Kanazawa Institute of TechnologyUtah State UniversityUniversity of Maryland Baltimore CountyNatural Resources, CanadaTeleNav, Inc.Indian Space Research OrganisationBall Aerospace & Technologies Corp.Rochester Institute of TechnologyUniversity of BremenBentley Systems, Inc.Piesat Information Technology Co., Ltd.Hi-Target Surveying Instrument Co. Ltd.SELEX Sistemi Integrati SpAAlenia Aeronautica SpAMicroMultiCopter Aero Technology Co., Ltd.Maxar Intelligence, Inc.Korea Meteorological AdministrationCanadian Space AgencyAreté Associates, Inc.Noblis, Inc.Geomni, Inc.
Samsung Electronics Co., Ltd.Canon, Inc.LG Electronics, Inc.International Business Machines Corp.Fujitsu Ltd.Sharp Corp.Ricoh Co., Ltd.Ricoh Co., Ltd.Seiko Epson Corp.SANYO Electric Co., Ltd.Intel Corp.ZTE Corp.Apple, Inc.FUJIFILM Corp.BOE Technology Group Co., Ltd.Hewlett-Packard Development Co.Brother Industries, Ltd.Eastman Kodak Co.Boe Innovation Investment Co. Ltd.Fujifilm Business Innovation Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fujifilm Business Innovation Corp.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Xerox Holdings Corp.Semiconductor Energy Laboratory Co., Ltd.Mita Industrial Co., Ltd.Toppan, Inc.Konica Minolta, Inc.
Samsung Electronics Co., Ltd.Canon, Inc.International Business Machines Corp.Fujitsu Ltd.General Electric Co.Huawei Technologies Co., Ltd.Seiko Epson Corp.SANYO Electric Co., Ltd.Intel Corp.ZTE Corp.Apple, Inc.FUJIFILM Corp.Hewlett-Packard Development Co.Eastman Kodak Co.Fujifilm Business Innovation Corp.Google LLCFujifilm Business Innovation Corp.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Honeywell International, Inc.Xerox Holdings Corp.Tencent Technology (Shenzhen) Co., Ltd.Alcatel-Lucent S AOlympus Corp.Microsoft Corp.Beijing Xiaomi Mobile Software Co., Ltd.Toyota Industries Corp.Muratec Automation Co., Ltd.Victor Company of Japan Ltd.Victor Company of Japan Ltd.
Zhejiang Geely Holding Group Co., Ltd.Zhejiang Geely Holding Group Co., Ltd.Weidmüller Interface GmbH & Co. KGWM Motor Technology Co., Ltd.Hottinger Baldwin Messtechnik GmbHZongmu Technology (Shanghai) Co. Ltd.Zongmu Technology (Shanghai) Co. Ltd.Communications & Power Industries LLCPenny & Giles Controls Ltd.Calterah Semiconductor Technology (Shanghai) Co., Ltd.Shanghai Baolong Automotive Corp.Shanghai Baolong Automotive Corp.Calterah Semiconductor Technology (Shanghai) Co., Ltd.Legerity, Inc.Uhnder, Inc.PR electronics A/SPR electronics A/STaiwan Semiconductor Co., Ltd.RedMere Technology Ltd.Huayu Automotive Systems Co., Ltd.Eurotherm Ltd.Oculii Corp.ICP DAS Co., Ltd.Anadigm, Inc.Michigan Scientific Corp.Advanced Photonix, Inc.Dwyer Instruments, Inc.Ronan Engineering Co.TMD Technologies Ltd.E-Trolz, Inc.
WM Motor Technology Co., Ltd.ChemImage Corp.Luna Innovations, Inc.Zongmu Technology (Shanghai) Co. Ltd.Zongmu Technology (Shanghai) Co. Ltd.Calterah Semiconductor Technology (Shanghai) Co., Ltd.Shanghai Baolong Automotive Corp.Proceq SAShanghai Baolong Automotive Corp.Calterah Semiconductor Technology (Shanghai) Co., Ltd.Penza State UniversityBeijing Safety Test Technology Co., Ltd.Uhnder, Inc.Know Labs, Inc.Geophysical Survey Systems, Inc.Huayu Automotive Systems Co., Ltd.Digital Barriers Services Ltd.Menlo Systems GmbHKufner Holding GmbHOculii Corp.Norsk Elektro Optikk ASBaySpec, Inc.3d-Radar ASFarran Technology Ltd.TeraSense Group, Inc.Electron Energy Corp.FIRST RF Corp.Millitech, Inc.Sensors & Software, Inc.TMD Technologies Ltd.
Rohde & Schwarz GmbH & Co. KGNihon Dempa Kogyo Co., Ltd.Rittal GmbH & Co. KGTamura Corp.Delixi Electric Co., Ltd.WM Motor Technology Co., Ltd.Shanghai Hugong Electric Group Co., Ltd.Artemis Intelligent Power Ltd.Nikko-Materials Co., Ltd.Fibox Oy ABZongmu Technology (Shanghai) Co. Ltd.Zongmu Technology (Shanghai) Co. Ltd.TAIFLEX Scientific Co., Ltd.Tangshan Sanyou Chemical Industries Co., Ltd.ITEQ Corp.Centre Testing International Group Co., Ltd.Tangshan Sanyou Chemical Industries Co., Ltd.Calterah Semiconductor Technology (Shanghai) Co., Ltd.Chomerics, Inc.Song Chuan Precision Co. Ltd.Centre Testing International Group Co., Ltd.Shanghai Baolong Automotive Corp.Proceq SAShanghai Baolong Automotive Corp.Calterah Semiconductor Technology (Shanghai) Co., Ltd.Applied Spectral Imaging Ltd.Kyoritsu Electrical Instruments Works Ltd.Teledyne Digital Imaging, Inc.Nikkan Industries Co., Ltd.Uhnder, Inc.