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Samsung Electronics Co., Ltd.Canon, Inc.Canon, Inc.LG Electronics, Inc.International Business Machines Corp.Fujitsu Ltd.Sharp Corp.Ricoh Co., Ltd.Ricoh Co., Ltd.Seiko Epson Corp.SANYO Electric Co., Ltd.ZTE Corp.Apple, Inc.FUJIFILM Corp.BOE Technology Group Co., Ltd.Hewlett-Packard Development Co.Brother Industries, Ltd.Eastman Kodak Co.Boe Innovation Investment Co. Ltd.Fujifilm Business Innovation Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fujifilm Business Innovation Corp.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Xerox Holdings Corp.Semiconductor Energy Laboratory Co., Ltd.Mita Industrial Co., Ltd.Guangzhou Bosma Optoelectronic Technology Co. Ltd.Toppan, Inc.
Samsung Electronics Co., Ltd.Sony Group Corp.OppoMicron Technology, Inc.Samsung Electro-Mechanics Co., Ltd.Hamamatsu Photonics KKSony Semiconductor Solutions Corp.Semiconductor Components Industries LLCMagnaChip Semiconductor Ltd.DB HITEK Co., Ltd.Cypress Semiconductor Corp.PixArt Imaging, Inc.LARGAN Precision Co., Ltd.Novuton Technology Corp. JapanSTMicroelectronics International NVIEE International Electronics & Engineering SABYD Semiconductor Co., Ltd.Huaian Imaging Device Manufacturer Corp.Huaian Imaging Device Manufacturer Corp.FUJIFILM Electronic Materials USA, Inc.OFILM Group Co., Ltd.VisEra Technologies Co., Ltd.FlexEnable Ltd.Corephotonics Ltd.PolyIC GmbH & Co. KGTeledyne Scientific & Imaging LLCISORG SAInvensas Bonding Technologies, Inc.PMD Technologies Ltd.SEKONIX Co., Ltd.
LG Electronics, Inc.General Electric Co.Sharp Corp.Seiko Epson Corp.E.I. du Pont de Nemours & Co.EIDP, Inc.Intel Corp.Sumitomo Electric Industries Ltd.Apple, Inc.Brother Industries, Ltd.KYOCERA Chemical Corp.Fujifilm Business Innovation Corp.Dai Nippon Printing Co., Ltd.Toshiba Chemical Corp.Kyocera Corp.Fujifilm Business Innovation Corp.Fuji Electronics Co., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Taiwan Semiconductor Manufacturing Co., Ltd.Daewoo Electronics Co. Ltd.DAIKIN INDUSTRIES Ltd.Honeywell International, Inc.Nitto Electric Industrial Co. Ltd.Kobe Steel, Ltd.Casio Computer Co., Ltd.Midea Group Co. Ltd.Electronics & Telecommunications Research InstituteMita Industrial Co., Ltd.The Dow Chemical Co.Guangzhou Bosma Optoelectronic Technology Co. Ltd.
Canon, Inc.Canon, Inc.Sony Group Corp.International Business Machines Corp.Fujitsu Ltd.General Electric Co.General Electric Co.Huawei Technologies Co., Ltd.Seiko Epson Corp.Intel Corp.ZTE Corp.Apple, Inc.FUJIFILM Corp.Hewlett-Packard Development Co.Eastman Kodak Co.Fujifilm Business Innovation Corp.Google LLCFujifilm Business Innovation Corp.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Honeywell International, Inc.Xerox Holdings Corp.Tencent Technology (Shenzhen) Co., Ltd.Alcatel-Lucent S AOlympus Corp.Microsoft Corp.Beijing Xiaomi Mobile Software Co., Ltd.Toyota Industries Corp.Muratec Automation Co., Ltd.Victor Company of Japan Ltd.Victor Company of Japan Ltd.
Canon, Inc.Canon, Inc.Fujitsu Ltd.Sharp Corp.Intel Corp.Sumitomo Electric Industries Ltd.Sumitomo Electric Industries Ltd.BOE Technology Group Co., Ltd.KYOCERA Chemical Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fuji Electronics Co., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Taiwan Semiconductor Manufacturing Co., Ltd.Semiconductor Energy Laboratory Co., Ltd.Guangzhou Bosma Optoelectronic Technology Co. Ltd.Samsung Electro-Mechanics Co., Ltd.Renesas Electronics Corp.Shin-Etsu Chemical Co., Ltd.Alps Alpine Co., Ltd.Yamaha Corp.Suzuki Co., Ltd.Showa Denko Materials Co. Ltd.Resonac Corp.Sumitomo Metal Industries Ltd.Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd.Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd.TCL China Star Optoelectronics Technology Co., Ltd.NXP Semiconductors (Thailand) Co., Ltd.
Samsung Electronics Co., Ltd.Canon, Inc.Canon, Inc.Hitachi Ltd.Fujitsu Ltd.Sharp Corp.SANYO Electric Co., Ltd.Sumitomo Electric Industries Ltd.Sumitomo Electric Industries Ltd.BOE Technology Group Co., Ltd.Boe Innovation Investment Co. Ltd.KYOCERA Chemical Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fuji Electronics Co., Ltd.Nikon Corp.OppoTaiwan Semiconductor Manufacturing Co., Ltd.Semiconductor Energy Laboratory Co., Ltd.Guangzhou Bosma Optoelectronic Technology Co. Ltd.Toppan, Inc.Fraunhofer-Gesellschaft eVSamsung Electro-Mechanics Co., Ltd.AGC, Inc. (Japan)ABB Automation, Inc.Renesas Electronics Corp.Shin-Etsu Chemical Co., Ltd.Alps Alpine Co., Ltd.Suzuki Co., Ltd.Showa Denko Materials Co. Ltd.
Renesas Technology Corp.Primax Electronics Ltd.LARGAN Precision Co., Ltd.Sunny Optical Technology (Group) Co., Ltd.Chicony Electronics Co., Ltd.Ability Opto-Electronics Technology Co., Ltd.Everspin Technologies, Inc.Sintai Optical (Shenzhen) Co. Ltd.Sintai Optical (Shenzhen) Co. Ltd.GeniuS Electronic Optical Co., Ltd.Jahwa Electronics Co., Ltd.PARTRON Co., Ltd.Crossbar, Inc.Newmax Technology Co., Ltd.Adesto Technologies Corp.Beijing SuperPix Micro Technology Co., Ltd.AboCom Systems, Inc.MCNEX Co., Ltd.POWER LOGICS Co., Ltd.Glory Science Co., Ltd.Samsung High-Tech Electro Mechanics Tianjin Co., Ltd.ZeroPoint Technologies ABGiant Electronic Optical (Xiamen) Co., Ltd.Maker Communications, Inc.Shine Tech Co., Ltd.4DS Memory Ltd.