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Samsung Electronics Co., Ltd.Canon, Inc.Fujitsu Ltd.Sharp Corp.SANYO Electric Co., Ltd.Intel Corp.Sumitomo Electric Industries Ltd.BOE Technology Group Co., Ltd.KYOCERA Chemical Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fuji Electronics Co., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Taiwan Semiconductor Manufacturing Co., Ltd.Semiconductor Energy Laboratory Co., Ltd.Samsung Electro-Mechanics Co., Ltd.Renesas Electronics Corp.Shin-Etsu Chemical Co., Ltd.Alps Alpine Co., Ltd.Yamaha Corp.Suzuki Co., Ltd.Showa Denko Materials Co. Ltd.Sumitomo Metal Industries Ltd.Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd.TCL China Star Optoelectronics Technology Co., Ltd.NXP Semiconductors (Thailand) Co., Ltd.NGK SPARK PLUG CO., LTD.NXP BVTCL China Star Optoelectronics Technology Co., Ltd.
Samsung Electronics Co., Ltd.LG Electronics, Inc.General Electric Co.Sharp Corp.Seiko Epson Corp.SANYO Electric Co., Ltd.E.I. du Pont de Nemours & Co.EIDP, Inc.Intel Corp.Sumitomo Electric Industries Ltd.Apple, Inc.Brother Industries, Ltd.KYOCERA Chemical Corp.Fujifilm Business Innovation Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Toshiba Chemical Corp.Fujifilm Business Innovation Corp.Fuji Electronics Co., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.OppoTaiwan Semiconductor Manufacturing Co., Ltd.Daewoo Electronics Co. Ltd.DAIKIN INDUSTRIES Ltd.Honeywell International, Inc.Nitto Electric Industrial Co. Ltd.Kobe Steel, Ltd.Casio Computer Co., Ltd.Midea Group Co. Ltd.
Japan Aviation Electronics Industry Ltd.Chicony Electronics Co., Ltd.Crucialtec Co., Ltd.Cirque Corp.Sysgration Ltd.ATLab, Inc.Jiangsu Transimage Technology Co., Ltd.Jiangsu Transimage Technology Co., Ltd.JNTC Co., Ltd.Silitech Technology Corp.Sensel, Inc.Solid Year Co. Ltd.Cellink Co., Ltd.UC-Logic Technology Corp.AHA Co., Ltd.Luidia Global Co. Ltd.Xiroku, Inc.Ortek Technology, Inc.NextInput, Inc.Misung Polytech Co., Ltd.Sanwa Supply, Inc.Contour Design, Inc.Shenzhen New Solution Electronics Co. Ltd.Lemo SAKinesis Corp.SMK-Link Electronic Corp.Hoffmann & Krippner GmbHUnited Keys, Inc.GM Nameplate, Inc.Varatouch Technology, Inc.
Samsung Electronics Co., Ltd.OppoMicron Technology, Inc.Samsung Electro-Mechanics Co., Ltd.Hamamatsu Photonics KKSony Semiconductor Solutions Corp.Semiconductor Components Industries LLCMagnaChip Semiconductor Ltd.DB HITEK Co., Ltd.Cypress Semiconductor Corp.PixArt Imaging, Inc.LARGAN Precision Co., Ltd.Novuton Technology Corp. JapanSTMicroelectronics International NVIEE International Electronics & Engineering SABYD Semiconductor Co., Ltd.Huaian Imaging Device Manufacturer Corp.Huaian Imaging Device Manufacturer Corp.FUJIFILM Electronic Materials USA, Inc.OFILM Group Co., Ltd.FlexEnable Ltd.Corephotonics Ltd.PolyIC GmbH & Co. KGTeledyne Scientific & Imaging LLCISORG SAInvensas Bonding Technologies, Inc.PMD Technologies Ltd.SEKONIX Co., Ltd.AGC Techno Glass Co. Ltd.Artilux, Inc.
Samsung Electronics Co., Ltd.Canon, Inc.Hitachi Ltd.Fujitsu Ltd.Sharp Corp.SANYO Electric Co., Ltd.Intel Corp.Sumitomo Electric Industries Ltd.Sumitomo Chemical Co., Ltd.BOE Technology Group Co., Ltd.Boe Innovation Investment Co. Ltd.KYOCERA Chemical Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fuji Electronics Co., Ltd.Nikon Corp.OppoTaiwan Semiconductor Manufacturing Co., Ltd.Semiconductor Energy Laboratory Co., Ltd.Toppan, Inc.Samsung Electro-Mechanics Co., Ltd.AGC, Inc. (Japan)ABB Automation, Inc.Renesas Electronics Corp.Shin-Etsu Chemical Co., Ltd.Alps Alpine Co., Ltd.Suzuki Co., Ltd.Showa Denko Materials Co. Ltd.South China University of TechnologySoutheast University
