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General Electric Co.General Electric Co.Honeywell International, Inc.The Boeing Co.Thales GroupSubaru Corp.LIG Nex1 Co., Ltd.SNECMA SARaytheon Co.Subaru Corp.Beihang UniversityLucas Industries PlcDaicel Corp.KYB Corp.Hughes Aircraft Co.Airbus Operations Ltd.SZ DJI Technology Co., Ltd.Raytheon Technologies Corp.Japan Aviation Electronics Industry Ltd.BASF Corp.Hamilton Sundstrand Corp.AlliedSignal, Inc.Eclipse Aviation Corp.Tektronix, Inc.Deutsches Zentrum für Luft- und Raumfahrt e.V.United Aircraft Corp.Analog Devices, Inc.Mitsubishi Cable Industries Ltd.Voith GmbH & Co. KGaAMesserschmitt-Boelkow-Blohm GmbH
The Boeing Co.Russia Federal Space AgencyAirbus Operations Ltd.Owens Corning Fiberglas Technology, Inc.National Aeronautics & Space AdministrationMikuni Corp.Bell Helicopter Textron, Inc.Shanxi Taigang Stainless Steel Co., Ltd.B/E Aerospace, Inc.Japan Aerospace Exploration AgencyChina Academy of Space TechnologyAlliant Techsystems, Inc.Airbus SE8 Rivers Capital LLCMaterion Corp.Jiangsu Hengshen Fibre Materials Co. Ltd.Titanium Metals Corp.Indian Space Research OrganisationUniversity of BradfordBeijing I-Space Technology Co. Ltd.Ball Aerospace & Technologies Corp.Mankiewicz Gebr & Co. GmbH & Co. KGArianeGroup GmbHChina Life Insurance Co. Ltd.Northrop Grumman Innovation Systems, Inc.Avio SpAAlenia Aeronautica SpASierra Nevada Corp.ILC Dover LPMicrocosm Technology Co., Ltd.
Ericsson, Inc.The Boeing Co.Russia Federal Space AgencyThales GroupSNECMA SAKDDI Corp.Deutsche Telekom AGDeutsche Telekom AGDeutsches Zentrum für Luft- und Raumfahrt e.V.Hosiden Corp.National Aeronautics & Space AdministrationHuf Hülsbeck & Fürst GmbH & Co. KGAmpex Corp.FCI SAT-Mobile USA, Inc.Nisshinbo Micro Devices, Inc.Maspro Denkoh Corp.Korea Aerospace Research InstituteViaSat, Inc.Ball Corp.Yokowo Co. Ltd.Wistron NeWeb Corp.Telefónica SASECOM Co., Ltd.Shenzhen Skyworth Digital Technology Co., Ltd.Shenzhen Skyworth Digital Technology Co., Ltd.Japan Aerospace Exploration AgencyShenzhen Coship Electronics Co., Ltd.ArianeGroup SASIsrael Aerospace Industries Ltd.
Ricoh Co., Ltd.Ricoh Co., Ltd.Hewlett-Packard Development Co.Eastman Kodak Co.Dai Nippon Printing Co., Ltd.Konica Minolta, Inc.Massachusetts Institute of TechnologyNGK SPARK PLUG CO., LTD.Mitsubishi Paper Mills Ltd.Shibaura Machine Co., Ltd.Kennametal, Inc.Unisys Corp.Tokyo Seimitsu Co., Ltd.Waymo LLCLenzing AGSMS group GmbHSandvik AktiebolagManroland Sheetfed GmbHMimaki Engineering Co., Ltd.Hoeganaes Corp.Align Technology, Inc.Draper, Inc.IDEC Corp.Greatbatch Ltd.Widex A/SWidex A/S3D Systems, Inc.Autodesk, Inc.Yamazaki Mazak Corp.FARO Technologies, Inc.
The Boeing Co.National Aeronautics & Space AdministrationpSemi Corp.Ball Aerospace & Technologies Corp.I-O Data Device, Inc.Northrop Grumman Innovation Systems, Inc.ILC Dover LPSpace Exploration Technologies Corp.AAR Corp.Deutsche Lufthansa AGReaction Engines Ltd.David Clark Co., Inc.Blue Origin LLCAnhui Aerospace Biotechnology Co., Ltd.Anhui Aerospace Biotechnology Co., Ltd.China Great Wall Industry Corp.Roccor LLCSkycorp, Inc.Honeybee Robotics Ltd.United Launch Alliance LLCVector Launch, Inc.World View Enterprises, Inc.Swales AerospaceBusek Co., Inc.Solid State Devices, Inc.Rocket Lab USA, Inc.United Space Alliance LLCNeptec Design Group Ltd.
Russia Federal Space AgencyNational Aeronautics & Space AdministrationAirbus SASpSemi Corp.Oceaneering International, Inc.NEC Space Technologies Ltd.University of BradfordBall Aerospace & Technologies Corp.I-O Data Device, Inc.Tesat Spacecom GmbH & Co. KGILC Dover LPTait Towers Manufacturing LLCVulcan, Inc.David Clark Co., Inc.Oxford Space Systems Ltd.Blue Origin LLCUnited Launch Alliance LLCRedwire Space, Inc.Mitsubishi Electric Metecs Co. Ltd.New Mexico State UniversitySwedish Space Corp.Solid State Devices, Inc.OHB System AGAccion Systems, Inc.XANTIA Co., Ltd.Ispace Technologies, Inc.Phase Four, Inc.ALE Co., Ltd.