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Samsung Electronics Co., Ltd.LG Electronics, Inc.General Electric Co.Sharp Corp.Seiko Epson Corp.SANYO Electric Co., Ltd.E.I. du Pont de Nemours & Co.EIDP, Inc.Intel Corp.Sumitomo Electric Industries Ltd.Apple, Inc.Brother Industries, Ltd.Taiwan Semiconductor Manufacturing Co., Ltd.KYOCERA Chemical Corp.Fujifilm Business Innovation Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Toshiba Chemical Corp.Fujifilm Business Innovation Corp.Fuji Electronics Co., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.OppoTaiwan Semiconductor Manufacturing Co., Ltd.Daewoo Electronics Co. Ltd.DAIKIN INDUSTRIES Ltd.Honeywell International, Inc.Nitto Electric Industrial Co. Ltd.Kobe Steel, Ltd.Casio Computer Co., Ltd.
Chengdu Ruiyan Technology Co. Ltd.
Hitachi-LG Data Storage, Inc.McScience Co., Ltd.TRX Systems, Inc.TetraVue, Inc.
Samsung Electronics Co., Ltd.Micron Technology, Inc.MagnaChip Semiconductor Ltd.DB HITEK Co., Ltd.Gentex Corp.Huaian Imaging Device Manufacturer Corp.Huaian Imaging Device Manufacturer Corp.Unity Opto Technology Co., Ltd.Rockley Photonics Ltd.IHP GmbH - Innovations for High Performance MicroelectronicsInvensas Bonding Technologies, Inc.National Chi Nan UniversityFoveon, Inc.MOBOTIX AGAvnera Corp.Tung Thih Electronic Co., Ltd.Skorpios Technologies, Inc.Lightmatter, Inc.Brigates Microelectronics Inc.Tower Semiconductor Ltd.Pixelplus Co., Ltd.Akustica, Inc.AmberWave Systems Corp.MEMSIC, Inc.Sofics BVBASilicon Optronics, Inc.Insiava Pty Ltd.Xiroku, Inc.New Imaging Technologies SADecaWave Ltd.
Honeywell International, Inc.Mitsubishi Motors Corp.FANUC Corp.Toyota Industries Corp.Yokogawa Electric Corp.Daihatsu Motor Co., Ltd.YASKAWA Electric Corp.Magic Leap, Inc.SRI InternationalPixArt Imaging, Inc.Nachi-Fujikoshi Corp.KEYENCE Corp.Denso Wave, Inc.Teradyne, Inc.Vega Grieshaber KGJungheinrich AGBaker Perkins Ltd.Nippon Avionics Co., Ltd.Reliance Electric Ltd.Dassault Systèmes SAM-System Co., Ltd.ifm electronic GmbHCognex Corp.Hypertherm Associates, Inc.Auris Health, Inc.The Raymond Corp.TECO Electric & Machinery Co., Ltd.Kehua Data Co., Ltd.Kollmorgen Corp.Hunan Chinasun Pharmaceutical Machinery Co., Ltd.
Hitachi Ltd.LG Electronics, Inc.Toyota Motor Corp.International Business Machines Corp.Fujitsu Ltd.General Electric Co.Huawei Technologies Co., Ltd.Ericsson, Inc.Intel Corp.Apple, Inc.ZTE Corp.Boe Innovation Investment Co. Ltd.Google LLCHoneywell International, Inc.Xerox Holdings Corp.Bayerische Motoren Werke AGAlcatel-Lucent S ANTT DOCOMO, Inc.Renesas Electronics Corp.Dow Global Technologies LLCMicrosoft Corp.AUDI AGToshiba Lighting & Technology Corp.Toyoda Gosei Co., Ltd.Toshiba Lighting & Technology Corp.Hilti AGMediaTek, Inc.Aisin AW Co., Ltd.Boston Scientific Scimed, Inc.Advanced Micro Devices, Inc.
Toyota Motor Corp.Seiko Epson Corp.Honda Motor Co., Ltd.DENSO Corp.Midea Group Co. Ltd.FANUC Corp.Iseki & Co., Ltd.Hilti AGYASKAWA Electric Corp.SZ DJI Technology Co., Ltd.DAEWOO SHIPBUILDING & MARINE ENGINEERING Co., Ltd.NVIDIA Corp.JD.com, Inc.Miele & Cie. KGDana-Farber Cancer Institute, Inc.Mattel, Inc.Husqvarna ABLEGO A/SHaldor Topse A/SLEGO A/SNational Aeronautics & Space AdministrationThe Shenzhen Institutes of Advanced TechnologyQinetiQ Ltd.The Shenzhen Institutes of Advanced TechnologyWaymo LLCRenishaw PlcSRI InternationalRyobi Ltd.Shibuya Corp.Nachi-Fujikoshi Corp.
