Bond, Inc.
Holding Company
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Basic Info
Headquarter
TY, JP
Founded Year
2016
Social Media
http://www.bond-co.jp
Bond Inc is a company that provides Japanese language, Web application and more. Bond Inc is headquartered in JP TY. Bond Inc was founded in 2016. Bond Inc has a total of 33 patents
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Japanese languageWeb application
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Innovation Word Cloud
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Innovation Matrix
visualizing technology portfolio of hot application areas and blank areas for Bond Inc
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Application Domain L2
Tech Topic L2
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Subsidiaries with patent applications for Bond Inc
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