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Hon Hai Precision Industry Co., Ltd.Sonos, Inc.Nordic Semiconductor ASAJMA LLCEnOcean GmbHVIZIO, Inc.Taoglas Ltd.Espressif Systems (Shanghai) Co., Ltd.Espressif Systems (Shanghai) Co., Ltd.Newracom, Inc.Queclink Wireless Solutions Co., Ltd.RF Monolithics, Inc.Queclink Wireless Solutions Co., Ltd.Arlo Technologies, Inc.Sequans Communications SAEagleView Technologies, Inc.Option NVON Semiconductor Connectivity Solutions, Inc.Wirepas OyNEXCOM International Co., Ltd.Merrimac Industries, Inc.ETS-Lindgren, Inc.GainSpan Corp.Newport Media, Inc.Pepex Biomedical, Inc.Artimi Ltd.Forkbeard TechnologiesSource Photonics, Inc.iDevices LLCStrix Systems, Inc.
LG Electronics, Inc.Sharp Corp.Huawei Technologies Co., Ltd.Ericsson, Inc.Nippon Telegraph & Telephone Corp.ZTE Corp.Kyocera Corp.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Electronics & Telecommunications Research InstituteAlcatel-Lucent S ANTT DOCOMO, Inc.Showa Denko Materials Co. Ltd.Western Electric Co., Inc.Fujikura Ltd.Hitachi Metals, Ltd.Proterial Ltd.vivo Mobile Communication Co., Ltd.Nokia Siemens Networks OyLucent Technologies, Inc.China Mobile Communications Group Co., Ltd.China Mobile Communications Group Co., Ltd.telent Ltd.Mannesmann AGJapan Aviation Electronics Industry Ltd.SK Telecom Co., Ltd.BlackBerry Ltd.Motorola Solutions, Inc.Tokyo Electric Power Co. Holdings, Inc.Nubia Technology Co., Ltd.
Huawei Technologies Co., Ltd.Ericsson, Inc.Intel Corp.Nippon Telegraph & Telephone Corp.ZTE Corp.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.NTT DOCOMO, Inc.vivo Mobile Communication Co., Ltd.Nokia Siemens Networks OyMediaTek, Inc.China Mobile Communications Group Co., Ltd.China Mobile Communications Group Co., Ltd.SZ DJI Technology Co., Ltd.telent Ltd.Mannesmann AGSK Telecom Co., Ltd.BlackBerry Ltd.Xiaomi Corp.Motorola Solutions, Inc.Nubia Technology Co., Ltd.KDDI Corp.China United Network Communications Ltd.Beijing University of Posts & TelecommunicationsMotorola Solutions Credit Co. LLCGuangzhou Shiyuan Electronic Technology Co. Ltd.Guangzhou Shiyuan Electronic Technology Co. Ltd.Deutsche Telekom AGHangzhou H3C Technologies Co., Ltd.China Telecom Corp. Ltd.
International Business Machines Corp.McNeil-PPC, Inc.Shenzhen Goodix Technology Co., Ltd.Shenzhen Goodix Technology Co., Ltd.Shanghai Feixun Communication Co., LtdShanghai Feixun Communication Co., LtdLeica Geosystems AGSoftBank Corp.Genesys Cloud Services, Inc.Planmeca OyYealink Network Technology Corp. Ltd.Yonyou Network Technology Co., Ltd.IGNIS Innovation, Inc.Hyperion Catalysis International, Inc.Avaya-Tenovis GmbH & Co. KGInguran LLCVibram SpAHirschmann Car Communication GmbHINVENT Umwelt- und Verfahrenstechnik AGIconex LLCSiebel Systems, Inc.PSS Belgium NVCareland, Inc.GTC Technology US LLCParmigiani Fleurier SACanadian Blood ServicesMMM Münchener Medizin Mechanik GmbHAsiainfo Technologies (China) Ltd.Talkdesk, Inc.Experian Information Solutions, Inc.
Samsung Electronics Co., Ltd.Canon, Inc.Hitachi Ltd.Fujitsu Ltd.Sharp Corp.SANYO Electric Co., Ltd.Intel Corp.Sumitomo Electric Industries Ltd.Sumitomo Chemical Co., Ltd.BOE Technology Group Co., Ltd.Boe Innovation Investment Co. Ltd.KYOCERA Chemical Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fuji Electronics Co., Ltd.Nikon Corp.OppoTaiwan Semiconductor Manufacturing Co., Ltd.Semiconductor Energy Laboratory Co., Ltd.Toppan, Inc.Samsung Electro-Mechanics Co., Ltd.AGC, Inc. (Japan)ABB Automation, Inc.Renesas Electronics Corp.Shin-Etsu Chemical Co., Ltd.Alps Alpine Co., Ltd.Suzuki Co., Ltd.Showa Denko Materials Co. Ltd.South China University of TechnologySoutheast University