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Samsung Electronics Co., Ltd.Canon, Inc.Hitachi Ltd.Fujitsu Ltd.Sharp Corp.SANYO Electric Co., Ltd.Sumitomo Electric Industries Ltd.Sumitomo Chemical Co., Ltd.BOE Technology Group Co., Ltd.Boe Innovation Investment Co. Ltd.KYOCERA Chemical Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fuji Electronics Co., Ltd.Nikon Corp.OppoTaiwan Semiconductor Manufacturing Co., Ltd.Semiconductor Energy Laboratory Co., Ltd.Toppan, Inc.Fraunhofer-Gesellschaft eVSamsung Electro-Mechanics Co., Ltd.AGC, Inc. (Japan)ABB Automation, Inc.Renesas Electronics Corp.Shin-Etsu Chemical Co., Ltd.Alps Alpine Co., Ltd.Suzuki Co., Ltd.Showa Denko Materials Co. Ltd.South China University of TechnologySoutheast University
DB HITEK Co., Ltd.Novatek Microelectronics Corp.LX Semicon Co., Ltd.Faraday Technology Corp.TongFu Microelectronics Co., Ltd.Sitronix Technology Corp.BitMain Technologies Holding Co.Lasertec Corp.Amkor Technology, Inc.BitMain Technologies Holding Co.Walton Advanced Engineering, Inc.Lingsen Precision Industries Ltd.Cavendish Kinetics, Inc.Canaan Creative Co., Ltd.HiSilicon Technologies Co., Ltd.Andes Technology Corp.Shanghai Huahong Group Co., Ltd.United Semiconductor (Xiamen) Co., Ltd.Groq, Inc.United Semiconductor (Xiamen) Co., Ltd.Applied Micro Circuits Corp.Canaan, Inc.Digital Media Professionals Inc.Advanced Digital Chips, Inc.Standing Egg, Inc.Wiliot Ltd.sureCore Ltd.Kneron, Inc.Airmems SASBaum Co., Ltd.
DENSO Corp.KYOCERA Chemical Corp.Taiwan Semiconductor Manufacturing Co., Ltd.Micron Technology, Inc.Samsung Electro-Mechanics Co., Ltd.Renesas Electronics Corp.Showa Denko Materials Co. Ltd.Resonac Corp.South China University of TechnologyEbara Corp.SCREEN Holdings Co., Ltd.University of Electronic Science & Technology of ChinaAdvanced Micro Devices, Inc.Lam Research Corp.Hangzhou Dianzi UniversitySemiconductor Components Industries LLCULVAC, Inc.JUKI Corp.Macronix International Co., Ltd.Shin-Etsu Handotai Co., Ltd.SEMES Co., Ltd.LAPIS Semiconductor Co. Ltd.Shinko Electric Industries Co., Ltd.Shinko Electric Industries Co., Ltd.Realtek Semiconductor Corp.Fujitsu Semiconductor Ltd.DB HITEK Co., Ltd.Advanced Semiconductor Engineering, Inc.Skyworks Solutions, Inc.Shenzhen Goodix Technology Co., Ltd.
Samsung Electronics Co., Ltd.Canon, Inc.Canon, Inc.Fujitsu Ltd.Sharp Corp.SANYO Electric Co., Ltd.Intel Corp.Sumitomo Electric Industries Ltd.Sumitomo Electric Industries Ltd.BOE Technology Group Co., Ltd.KYOCERA Chemical Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fuji Electronics Co., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Taiwan Semiconductor Manufacturing Co., Ltd.Semiconductor Energy Laboratory Co., Ltd.Samsung Electro-Mechanics Co., Ltd.Renesas Electronics Corp.Shin-Etsu Chemical Co., Ltd.Alps Alpine Co., Ltd.Yamaha Corp.Suzuki Co., Ltd.Showa Denko Materials Co. Ltd.Resonac Corp.Sumitomo Metal Industries Ltd.Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd.Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd.TCL China Star Optoelectronics Technology Co., Ltd.
Lam Research Corp.Qimonda AGMosaid Technologies, Inc.Elite Semiconductor Memory Technology, Inc.Elite Semiconductor Memory Technology, Inc.Fujitsu Semiconductor Memory Solution Ltd.Memory Corp. PlcMemory Corp. PlcGENUSION, Inc.Eorex Corp.Ryoden Corp.Winbond Electronics Corporation AmericaE-CMOS Corp.ATMOS Corp.
Xerox Holdings Corp.Toshiba Tec Corp.Avery Dennison Corp.Zenith Electronics LLCSymbol Technologies, Inc.Spectrum Brands, Inc.TomTom International BVPHC Holdings Corp.Miwa Lock Co., Ltd.Star Micronics Co., Ltd.Shandong New Beiyang Information Technology Co., Ltd.Zebra Technologies Corp.Shandong New Beiyang Information Technology Co., Ltd.Siemens AG ÖsterreichSensormatic Electronics LLCProMOS Technologies, Inc.Indesit Company SpAEM Microelectronic-Marin SAKYOCERA AVX Components Corp.Harada Industry Co., Ltd.pSemi Corp.Marchesini Group SpABinder GmbHLeica Biosystems Nussloch GmbHKESPION Co., Ltd.Shenzhen Genvict Technologies Co., Ltd.Krber AGKrber AGArizon RFID Technology Co., Ltd.ZIH Corp.
