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Samsung Electronics Co., Ltd.Canon, Inc.Hitachi Ltd.Fujitsu Ltd.Sharp Corp.SANYO Electric Co., Ltd.Intel Corp.Sumitomo Electric Industries Ltd.Sumitomo Chemical Co., Ltd.BOE Technology Group Co., Ltd.Boe Innovation Investment Co. Ltd.KYOCERA Chemical Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fuji Electronics Co., Ltd.Nikon Corp.OppoTaiwan Semiconductor Manufacturing Co., Ltd.Semiconductor Energy Laboratory Co., Ltd.Toppan, Inc.Samsung Electro-Mechanics Co., Ltd.AGC, Inc. (Japan)ABB Automation, Inc.Renesas Electronics Corp.Shin-Etsu Chemical Co., Ltd.Alps Alpine Co., Ltd.Suzuki Co., Ltd.Showa Denko Materials Co. Ltd.South China University of TechnologySoutheast University
Japan Aerospace Exploration AgencyChina Academy of Space TechnologypSemi Corp.Indian Space Research OrganisationUniversity of BradfordI-O Data Device, Inc.Northrop Grumman Innovation Systems, Inc.Sierra Nevada Corp.AST & Science LLCUrtheCast Corp.Addvalue Technologies Ltd.ICEYE OyRedwire Space, Inc.HawkEye 360, Inc.Relativity Space, Inc.Ducommun, Inc.OHB System AGSolid State Devices, Inc.BridgeComm, Inc.Phase Four, Inc.Mott MacDonald Ltd.Effective Space Solutions Ltd.
Samsung Electronics Co., Ltd.LG Electronics, Inc.General Electric Co.Sharp Corp.Seiko Epson Corp.SANYO Electric Co., Ltd.E.I. du Pont de Nemours & Co.EIDP, Inc.Intel Corp.Sumitomo Electric Industries Ltd.Apple, Inc.Brother Industries, Ltd.KYOCERA Chemical Corp.Fujifilm Business Innovation Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Toshiba Chemical Corp.Fujifilm Business Innovation Corp.Fuji Electronics Co., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.OppoTaiwan Semiconductor Manufacturing Co., Ltd.Daewoo Electronics Co. Ltd.DAIKIN INDUSTRIES Ltd.Honeywell International, Inc.Nitto Electric Industrial Co. Ltd.Kobe Steel, Ltd.Casio Computer Co., Ltd.Midea Group Co. Ltd.
Ericsson, Inc.The Boeing Co.Russia Federal Space AgencyThales GroupKDDI Corp.Deutsche Telekom AGDeutsche Telekom AGDeutsches Zentrum für Luft- und Raumfahrt e.V.Hosiden Corp.National Aeronautics & Space AdministrationHuf Hülsbeck & Fürst GmbH & Co. KGAmpex Corp.FCI SAT-Mobile USA, Inc.Nagravision SANisshinbo Micro Devices, Inc.Maspro Denkoh Corp.Korea Aerospace Research InstituteViaSat, Inc.Ball Corp.Wistron NeWeb Corp.Telefónica SASECOM Co., Ltd.Shenzhen Skyworth Digital Technology Co., Ltd.Shenzhen Skyworth Digital Technology Co., Ltd.Japan Aerospace Exploration AgencyShenzhen Coship Electronics Co., Ltd.ArianeGroup SASIsrael Aerospace Industries Ltd.China Academy of Space Technology
Samsung Electronics Co., Ltd.Canon, Inc.Fujitsu Ltd.Sharp Corp.SANYO Electric Co., Ltd.Intel Corp.Sumitomo Electric Industries Ltd.BOE Technology Group Co., Ltd.KYOCERA Chemical Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fuji Electronics Co., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Taiwan Semiconductor Manufacturing Co., Ltd.Semiconductor Energy Laboratory Co., Ltd.Samsung Electro-Mechanics Co., Ltd.Renesas Electronics Corp.Shin-Etsu Chemical Co., Ltd.Alps Alpine Co., Ltd.Yamaha Corp.Suzuki Co., Ltd.Showa Denko Materials Co. Ltd.Sumitomo Metal Industries Ltd.Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd.TCL China Star Optoelectronics Technology Co., Ltd.NXP Semiconductors (Thailand) Co., Ltd.NGK SPARK PLUG CO., LTD.NXP BVTCL China Star Optoelectronics Technology Co., Ltd.
Israel Aerospace Industries Ltd.Atlantic Inertial Systems, Inc.Appareo Systems LLCKearfott Corp.Silicon Sensing Systems Ltd.Fibersense Technology Corp.
Fujitsu Component Ltd.MLS Co., Ltd.Xiamen Hongfa Electroacoustic Co., Ltd.Omega Engineering, Inc.Custom Sensors & Technologies, Inc.Panasonic Electric Works Europe AGGentron Corp.California Eastern Laboratories, Inc.Crydom, Inc.
