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Samsung Electronics Co., Ltd.Canon, Inc.Hitachi Ltd.Fujitsu Ltd.Sharp Corp.SANYO Electric Co., Ltd.Intel Corp.Sumitomo Electric Industries Ltd.Sumitomo Chemical Co., Ltd.BOE Technology Group Co., Ltd.Boe Innovation Investment Co. Ltd.KYOCERA Chemical Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fuji Electronics Co., Ltd.Nikon Corp.OppoTaiwan Semiconductor Manufacturing Co., Ltd.Semiconductor Energy Laboratory Co., Ltd.Toppan, Inc.Samsung Electro-Mechanics Co., Ltd.AGC, Inc. (Japan)ABB Automation, Inc.Renesas Electronics Corp.Shin-Etsu Chemical Co., Ltd.Alps Alpine Co., Ltd.Suzuki Co., Ltd.Showa Denko Materials Co. Ltd.South China University of TechnologySoutheast University
Rohm & Haas Co.Mitsubishi Materials Corp.Tokin Corp. /JP/Sanken Electric Co., Ltd.Noritake Co., Ltd.Toshiba Electronic Devices & Storage Corp.Wolverine World Wide, Inc.Fujimi, Inc.Institute of Electrical Engineering, Chinese Academy of SciencesInstitute of Electrical Engineering, Chinese Academy of SciencesTowa Corp.Tokai Carbon Co., Ltd.MillerKnoll, Inc.Toyo Tanso Co., Ltd.CoorsTek, Inc.JCET Group Co., Ltd.Hitachi Power Semiconductor Device Ltd.Metglas, Inc.Hyperion Catalysis International, Inc.SAGE Electrochromics, Inc.Physik Instrumente (PI) GmbH & Co. KGNovaled GmbHNippon Carbon Co., Ltd.Nikko-Materials Co., Ltd.Amkor Technology, Inc.Research Frontiers, Inc.Hanwha Advanced Materials Corp.SK EnpulseYangzhou Yangjie Electronic Technology Co., Ltd.GTAT Corp.