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Samsung Electronics Co., Ltd.Sony Group Corp.LG Electronics, Inc.General Electric Co.General Electric Co.Sharp Corp.Seiko Epson Corp.SANYO Electric Co., Ltd.Sumitomo Electric Industries Ltd.Sumitomo Electric Industries Ltd.Apple, Inc.Brother Industries, Ltd.KYOCERA Chemical Corp.Fujifilm Business Innovation Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Toshiba Chemical Corp.Fujifilm Business Innovation Corp.Fuji Electronics Co., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.OppoTaiwan Semiconductor Manufacturing Co., Ltd.Daewoo Electronics Co. Ltd.DAIKIN INDUSTRIES Ltd.Honeywell International, Inc.Nitto Electric Industrial Co. Ltd.Kobe Steel, Ltd.Casio Computer Co., Ltd.Midea Group Co. Ltd.
Samsung Electronics Co., Ltd.Canon, Inc.Canon, Inc.Fujitsu Ltd.Sharp Corp.SANYO Electric Co., Ltd.Sumitomo Electric Industries Ltd.Sumitomo Electric Industries Ltd.BOE Technology Group Co., Ltd.KYOCERA Chemical Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fuji Electronics Co., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Taiwan Semiconductor Manufacturing Co., Ltd.Semiconductor Energy Laboratory Co., Ltd.Guangzhou Bosma Optoelectronic Technology Co. Ltd.Samsung Electro-Mechanics Co., Ltd.Renesas Electronics Corp.Shin-Etsu Chemical Co., Ltd.Alps Alpine Co., Ltd.Yamaha Corp.Suzuki Co., Ltd.Showa Denko Materials Co. Ltd.Resonac Corp.Sumitomo Metal Industries Ltd.Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd.Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd.TCL China Star Optoelectronics Technology Co., Ltd.
Samsung Electronics Co., Ltd.Canon, Inc.Canon, Inc.Hitachi Ltd.Fujitsu Ltd.Sharp Corp.SANYO Electric Co., Ltd.Sumitomo Electric Industries Ltd.Sumitomo Electric Industries Ltd.Sumitomo Chemical Co., Ltd.BOE Technology Group Co., Ltd.Boe Innovation Investment Co. Ltd.KYOCERA Chemical Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fuji Electronics Co., Ltd.Nikon Corp.OppoTaiwan Semiconductor Manufacturing Co., Ltd.Semiconductor Energy Laboratory Co., Ltd.Guangzhou Bosma Optoelectronic Technology Co. Ltd.Toppan, Inc.Fraunhofer-Gesellschaft eVSamsung Electro-Mechanics Co., Ltd.AGC, Inc. (Japan)ABB Automation, Inc.Renesas Electronics Corp.Shin-Etsu Chemical Co., Ltd.Alps Alpine Co., Ltd.Suzuki Co., Ltd.
Drgerwerk AG & Co. KGaAFIGARO Engineering, Inc.Sensirion AGFocused Photonics (Hangzhou), Inc.Focused Photonics (Hangzhou), Inc.Kidde, Inc.Nemoto & Co. Ltd.Bacharach, Inc.Komyo Rikagaku Kogyo KkeLichens SASSENKO Co., Ltd.AlphaSense Ltd.RAE Systems, Inc.Trolex Ltd.Pem-Tech, Inc.Pem-Tech, Inc.Sensidyne LPGastron Co. Ltd.Aeroqual Ltd.Dynament Ltd.SPEC Sensors LLCGastec Service, Inc.
Alps Alpine Co., Ltd.NGK SPARK PLUG CO., LTD.OSRAM Opto Semiconductors GmbHAnalog Devices, Inc.DePuy Synthes Products, Inc.Rosemount, Inc.Keihin Corp.Asahi Kasei Microdevices Corp.PixArt Imaging, Inc.Tamagawa Seiki Co., Ltd.Vega Grieshaber KGKey Safety Systems, Inc.CTS Corp.STMicroelectronics International NVWatlow Electric Manufacturing Co.Watlow Electric Manufacturing Co.Draeger Safety, Inc.InvenSense, Inc.ifm electronic GmbHGiven Imaging Ltd.Preh GmbHHoriba Stec Co. Ltd.Proteus Digital Health, Inc.Methode Electronics, Inc.Kistler Holding AGBorgWarner Ludwigsburg GmbHOVAL Corp.Nagano Keiki Co., Ltd.Interface, Inc.FlexEnable Ltd.
FIGARO Engineering, Inc.Capteur Sensors & Analysers Ltd.Aeroqual Ltd.
Alps Alpine Co., Ltd.OSRAM Opto Semiconductors GmbHRosemount, Inc.Dr. Johannes Heidenhain GmbHTakata, Inc.Keihin Corp.PixArt Imaging, Inc.Tamagawa Seiki Co., Ltd.Key Safety Systems, Inc.Watlow Electric Manufacturing Co.Watlow Electric Manufacturing Co.Draeger Safety, Inc.The Toro Co.InvenSense, Inc.ifm electronic GmbHPreh GmbHPepperl+Fuchs, Inc.Methode Electronics, Inc.BorgWarner Ludwigsburg GmbHInterface, Inc.Casco Products Corp.FIGARO Engineering, Inc.Nippon Ceramic Co., Ltd.Tactual Labs Co.Balluff, Inc.Hanwei Electronics Group Corp.PolyIC GmbH & Co. KGCyberOptics Corp.IDEX Biometrics ASAElmos Semiconductor SE