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Huawei Technologies Co., Ltd.Ericsson, Inc.Intel Corp.Nippon Telegraph & Telephone Corp.ZTE Corp.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.NTT DOCOMO, Inc.vivo Mobile Communication Co., Ltd.Nokia Siemens Networks OyMediaTek, Inc.China Mobile Communications Group Co., Ltd.China Mobile Communications Group Co., Ltd.SZ DJI Technology Co., Ltd.telent Ltd.Mannesmann AGSK Telecom Co., Ltd.BlackBerry Ltd.Xiaomi Corp.Motorola Solutions, Inc.Nubia Technology Co., Ltd.KDDI Corp.China United Network Communications Ltd.Beijing University of Posts & TelecommunicationsMotorola Solutions Credit Co. LLCGuangzhou Shiyuan Electronic Technology Co. Ltd.Guangzhou Shiyuan Electronic Technology Co. Ltd.Deutsche Telekom AGHangzhou H3C Technologies Co., Ltd.China Telecom Corp. Ltd.
Taiyo Yuden Co., Ltd.Japan Radio Co. Ltd.CTS Corp.TriQuint Semiconductor, Inc.Transense Technologies PlcResonant, Inc.WiSoL Co., Ltd.Top Touch Electronics Co., Ltd.CETC (Deqing) Huaying Electronics Co. Ltd.CETC (Deqing) Huaying Electronics Co. Ltd.Shoulder Electronics Co., Ltd.NanoTemper Technologies GmbHSENSeOR SASThe University of BoltonAtonomics A/SSawtek, Inc.Sawtek, Inc.Crystalwise Technology, Inc.Tai-Saw Technology Co., Ltd.SenSanna, Inc.BEFS Co., Ltd.Schmitt Industries, Inc.Columbia Research Laboratories, Inc.Precision Acoustics Ltd.