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Honeywell International, Inc.Mitsubishi Motors Corp.FANUC Corp.Toyota Industries Corp.Yokogawa Electric Corp.YASKAWA Electric Corp.Magic Leap, Inc.SRI InternationalPixArt Imaging, Inc.Nachi-Fujikoshi Corp.KEYENCE Corp.Denso Wave, Inc.Jungheinrich AGBaker Perkins Ltd.Nippon Avionics Co., Ltd.Reliance Electric Ltd.Dassault Systèmes SAM-System Co., Ltd.ifm electronic GmbHCognex Corp.Hypertherm Associates, Inc.Auris Health, Inc.The Raymond Corp.TECO Electric & Machinery Co., Ltd.Kehua Data Co., Ltd.Kollmorgen Corp.Hunan Chinasun Pharmaceutical Machinery Co., Ltd.TECO Electric & Machinery Co., Ltd.Hunan Chinasun Pharmaceutical Machinery Co., Ltd.Beckhoff Automation GmbH & Co. KG
National University of Defense TechnologyNational University of Defense TechnologyNanjing University of Posts & TelecommunicationsBeijing University of Posts & TelecommunicationsPower Integrations, Inc.Politecnico di MilanoScientific-Atlanta, Inc.Kumoh National Institute of TechnologyChandigarh UniversityPolitecnico di TorinoBrno University of TechnologyNan Kai University of TechnologyNational ICT Australia Ltd.Pelco, Inc.Chaoyang University of TechnologyXian Jiaotong-Liverpool UniversityMinghsin University of Science & TechnologyChung Hua UniversityMediBeacon, Inc.National Taichung University of Science &TechnologyConservatoire National des Arts et MétiersNational Chi Nan UniversityUniversitt PaderbornLing Tung UniversityIngrain, Inc.Opanga Networks, Inc.SRM UniversityWisesoft Co., Ltd.Causam Energy, Inc.National Ilan University
Hitachi Ltd.LG Electronics, Inc.Toyota Motor Corp.International Business Machines Corp.Fujitsu Ltd.General Electric Co.Huawei Technologies Co., Ltd.Ericsson, Inc.Intel Corp.ZTE Corp.Apple, Inc.Boe Innovation Investment Co. Ltd.Google LLCHoneywell International, Inc.Xerox Holdings Corp.Bayerische Motoren Werke AGAlcatel-Lucent S ANTT DOCOMO, Inc.Renesas Electronics Corp.Dow Global Technologies LLCMicrosoft Corp.Toshiba Lighting & Technology Corp.Toyoda Gosei Co., Ltd.Toshiba Lighting & Technology Corp.Hilti AGMediaTek, Inc.Aisin AW Co., Ltd.Boston Scientific Scimed, Inc.Advanced Micro Devices, Inc.Otis Elevator Co.
Industrial & Commercial Bank of China Ltd.The Texas A&M University SystemNomura Research Institute Ltd.Beijing Jingdong Financial Technology Holding Co. Ltd.The University of Central Florida Research Foundation, Inc.The University of Maryland Baltimore Foundation, Inc.Agricultural Bank of ChinaThe Kansas State University Research FoundationStichting Energieonderzoek Centrum NederlandAnhui Transportation Holding Group Co., Ltd.Globalstar LPChina Merchants Bank Co., Ltd.UNM Rainforest Innovations /VC/Irving Trust Co.Royal Canadian Mint-Canadian Gold ReservesSVA (Group) Co., Ltd.Fineart Technology Co. Ltd.Inner Mongolia First Machinery Group Co., Ltd.The Standard Motor Products Europe Ltd. Retirement & DeathNew York Stem Cell Foundation, Inc.Wuxi China Resources Huajing Microelectronics Co., Ltd.The Samuel Roberts Noble Foundation, Inc.Factory Mutual Insurance Co.Fundación TeknikerChangzhou Yiliyasi Textile Co. Ltd.Ping An Asset Management Co., Ltd.The Bradbury GroupBank of Communications Co., Ltd.Bank of MontrealFundacion Publica Andaluza Progreso y Salud
International Business Machines Corp.Fujitsu Ltd.Tencent Technology (Shenzhen) Co., Ltd.Yokogawa Electric Corp.Oracle America, Inc.Hewlett Packard Enterprise Development LPSeagate Technology LLCDelphi Technology, Inc.Praxair S.T. Technology, Inc.Life Technologies Corp.Juniper Networks, Inc.Unisys Corp.Tata Consultancy Services Ltd.Inspur Electronic Information Industry Co., Ltd.Avaya, Inc.MiTAC International Corp.Siemens Medical Solutions USA, Inc.Heroku, Inc.Agfa-Gevaert NVLandmark Graphics Corp.Fiberhome Telecommunication Technologies Co., Ltd.Shima Seiki Mfg. Ltd.Shima Seiki Mfg. Ltd.NARI Technology Co., Ltd.Rambus, Inc.Canon Marketing Japan, Inc.HRL Laboratories LLCBull SANEC Soft Ltd.Peking University Founder Group Corp.
Schaeffler Technologies AG & Co. KGFluke Corp.Castrol Ltd.Nippon Avionics Co., Ltd.National Instruments Corp.PRÜFTECHNIK Dieter Busch AGPRÜFTECHNIK Dieter Busch AGSoftware AGOpex Corp.Software AGSKF USA, Inc.Burckhardt Compression AGMarquette UniversityFosbel, Inc.Bently Nevada, Inc.Woojin Electro-Nite, Inc.Perpetuum Ltd.Thermoteknix Systems Ltd.Omnisens SASPECTRO Analytical Instruments GmbHGainSpan Corp.Corrpro Cos., Inc.Beijing Bohua Xinzhi Technology, Inc.Dual Inventive Holding BVBrüel & Kjær Vibro GmbHBeijing Bohua Xinzhi Technology, Inc.Dynapar Corp.Seebo Interactive Ltd.Poseidon Nickel Ltd.KCF Technologies, Inc.
Rosemount, Inc.Dr. Johannes Heidenhain GmbHShenzhen Goodix Technology Co., Ltd.Shenzhen Goodix Technology Co., Ltd.PixArt Imaging, Inc.Tamagawa Seiki Co., Ltd.Samsung Medison Co., Ltd.Hitachi Aloka Medical Ltd.Key Safety Systems, Inc.Watlow Electric Manufacturing Co.Watlow Electric Manufacturing Co.Draeger Safety, Inc.ELAN Microelectronics Corp.InvenSense, Inc.ifm electronic GmbHPreh GmbHCrucialtec Co., Ltd.Pepperl+Fuchs, Inc.Egis Technology, Inc.BorgWarner Ludwigsburg GmbHInterface, Inc.FlexEnable Ltd.FIGARO Engineering, Inc.Sensirion AGSchülke & Mayr GmbHNippon Ceramic Co., Ltd.FUJIFILM SonoSite, Inc.Fingerprint Cards ABMeasurement Specialties, Inc.ISORG SA