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Samsung Electronics Co., Ltd.Canon, Inc.Hitachi Ltd.Fujitsu Ltd.Sharp Corp.SANYO Electric Co., Ltd.Intel Corp.Sumitomo Electric Industries Ltd.Sumitomo Chemical Co., Ltd.BOE Technology Group Co., Ltd.Boe Innovation Investment Co. Ltd.KYOCERA Chemical Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fuji Electronics Co., Ltd.Nikon Corp.OppoTaiwan Semiconductor Manufacturing Co., Ltd.Semiconductor Energy Laboratory Co., Ltd.Toppan, Inc.Samsung Electro-Mechanics Co., Ltd.AGC, Inc. (Japan)ABB Automation, Inc.Renesas Electronics Corp.Shin-Etsu Chemical Co., Ltd.Alps Alpine Co., Ltd.Suzuki Co., Ltd.Showa Denko Materials Co. Ltd.South China University of TechnologySoutheast University
Hyundai Motor Co., Ltd.Mitsubishi Motors Corp.Meidensha Corp.LSIS Co. Ltd.Nissin Electric Co., Ltd.Lite-On Technology Corp.HYOSUNG Corp.Nexans SATamura Corp.XJ Group Corp.Maschinenfabrik Reinhausen GmbHMaschinenfabrik Reinhausen GmbHZhejiang Chint Electrics Co., Ltd.Outboard Marine Corp.Outboard Marine Corp.XJ Electric Co., Ltd.NR Electric Co., Ltd.Pinggao Group Co., Ltd.Alstom SAPinggao Group Co., Ltd.NARI Group Corp.Prysmian SpAWolong Electric Group Co. Ltd.Takaoka Electric Mfg. Co., Ltd.Wolong Electric Group Co. Ltd.LS Electric Co., Ltd.Schweitzer Engineering Laboratories, Inc.Shanghai Liangxin Electrical Co., Ltd.LINAK A/SS & C Electric Co.
Samsung Electronics Co., Ltd.Canon, Inc.LG Electronics, Inc.International Business Machines Corp.Fujitsu Ltd.Sharp Corp.Ricoh Co., Ltd.Ricoh Co., Ltd.Seiko Epson Corp.SANYO Electric Co., Ltd.Intel Corp.ZTE Corp.Apple, Inc.FUJIFILM Corp.BOE Technology Group Co., Ltd.Hewlett-Packard Development Co.Brother Industries, Ltd.Eastman Kodak Co.Boe Innovation Investment Co. Ltd.Fujifilm Business Innovation Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fujifilm Business Innovation Corp.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Xerox Holdings Corp.Semiconductor Energy Laboratory Co., Ltd.Mita Industrial Co., Ltd.Toppan, Inc.Konica Minolta, Inc.
Samsung Electronics Co., Ltd.LG Electronics, Inc.General Electric Co.Sharp Corp.Seiko Epson Corp.SANYO Electric Co., Ltd.E.I. du Pont de Nemours & Co.EIDP, Inc.Intel Corp.Sumitomo Electric Industries Ltd.Apple, Inc.Brother Industries, Ltd.KYOCERA Chemical Corp.Fujifilm Business Innovation Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Toshiba Chemical Corp.Fujifilm Business Innovation Corp.Fuji Electronics Co., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.OppoTaiwan Semiconductor Manufacturing Co., Ltd.Daewoo Electronics Co. Ltd.DAIKIN INDUSTRIES Ltd.Honeywell International, Inc.Nitto Electric Industrial Co. Ltd.Kobe Steel, Ltd.Casio Computer Co., Ltd.Midea Group Co. Ltd.
Samsung Electronics Co., Ltd.Canon, Inc.Fujitsu Ltd.Sharp Corp.SANYO Electric Co., Ltd.Intel Corp.Sumitomo Electric Industries Ltd.BOE Technology Group Co., Ltd.KYOCERA Chemical Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fuji Electronics Co., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Taiwan Semiconductor Manufacturing Co., Ltd.Semiconductor Energy Laboratory Co., Ltd.Samsung Electro-Mechanics Co., Ltd.Renesas Electronics Corp.Shin-Etsu Chemical Co., Ltd.Alps Alpine Co., Ltd.Yamaha Corp.Suzuki Co., Ltd.Showa Denko Materials Co. Ltd.Sumitomo Metal Industries Ltd.Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd.TCL China Star Optoelectronics Technology Co., Ltd.NXP Semiconductors (Thailand) Co., Ltd.NGK SPARK PLUG CO., LTD.NXP BVTCL China Star Optoelectronics Technology Co., Ltd.
Sitronix Technology Corp.Rockchip Electronics Co., Ltd.CEC Huada Electronic Design Co., Ltd.Hunan Goke Microelectronics Co., Ltd.IPGoal Microelectronics (Sichuan) Co., Ltd.Empyrean Technology Co., Ltd.C-Sky Microsystems Co. Ltd.Chipintelli Co. Ltd.Zhuhai Orbita Aerospace Science & Technology Co., Ltd.Innofidei, Inc.Chengdu Sino-Microelectronics Technology Co., Ltd.Asmedia Technology Inc.Beijing YanDong Microelectronic Co., Ltd.Beijing YanDong Microelectronic Co., Ltd.SiliconGo Microelectronics Co. Ltd.Shenzhen Chipsbank Technologies Co., Ltd.Shenzhen Chipsbank Technologies Co., Ltd.ACARD Technology Corp.Chongqing Southwest Integrated Circuit Design Co., Ltd.Chongqing Southwest Integrated Circuit Design Co., Ltd.Shenzhen Legendary Technology Co., Ltd.Advanced Power Electronics Corp.Advanced Power Electronics Corp.Shenzhen Legendary Technology Co., Ltd.Guangzhou Qianjun Network Technology Co., Ltd.Guangzhou Qianjun Network Technology Co., Ltd.I-CoreISSC Technologies Corp.AudioLogic, Inc.Beijing Yuexin Technology Co. Ltd.
Lite-On IT Corp.MStar Semiconductor, Inc.Rockchip Electronics Co., Ltd.Meiko Electronics Co., Ltd.CEC Huada Electronic Design Co., Ltd.Koha Co. Ltd.IHP GmbH - Innovations for High Performance MicroelectronicsHunan Goke Microelectronics Co., Ltd.IPGoal Microelectronics (Sichuan) Co., Ltd.Avnera Corp.C-Sky Microsystems Co. Ltd.Chipintelli Co. Ltd.Zhuhai Orbita Aerospace Science & Technology Co., Ltd.Mac-Eight Co., Ltd.Endwave Corp.Telink Semiconductor (Shanghai) Co., Ltd.Asmedia Technology Inc.Telink Semiconductor (Shanghai) Co., Ltd.Beijing YanDong Microelectronic Co., Ltd.Beijing YanDong Microelectronic Co., Ltd.SiliconGo Microelectronics Co. Ltd.Shenzhen Chipsbank Technologies Co., Ltd.Shenzhen Chipsbank Technologies Co., Ltd.ACARD Technology Corp.Shenzhen Legendary Technology Co., Ltd.Advanced Power Electronics Corp.Advanced Power Electronics Corp.Shenzhen Legendary Technology Co., Ltd.Guangzhou Qianjun Network Technology Co., Ltd.Cdn Corp.