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Tencent Technology (Shenzhen) Co., Ltd.Oracle America, Inc.Hewlett Packard Enterprise Development LPHeidelberger Druckmaschinen AGPraxair S.T. Technology, Inc.China Telecom Corp. Ltd.Dolby International ABUnisys Corp.Tata Consultancy Services Ltd.Hitachi Software Engineering Co., Ltd.Hitachi Software Engineering Co., Ltd.Synopsys, Inc.NEC Soft Ltd.SAMSUNG SDS CO., LTD.The Nielsen Company (US) LLCWINCOR NIXDORF International GmbHCanon IT Solutions, Inc.NTT DATA Corp.Giesecke+Devrient Mobile Security GmbHToshiba Solutions Corp.Vtron Group Co., Ltd.3D Systems, Inc.FoxboroZhejiang Geely Commercial Vehicles Group Co. Ltd.NTT Communications Corp.Visa U.S.A., Inc.COLOPL, Inc.Uchida Yoko Co., Ltd.NEC Personal Computers Ltd.Alto SARL
Sony Group Corp.Yamaha Corp.JVCKenwood Corp.GoerTek Inc.Bose Corp.Hosiden Corp.Harman International Industries, Inc.Onkyo Home Entertainment Corp.Cirrus Logic, Inc.Audio-Technica US, Inc.Nisshinbo Micro Devices, Inc.Toa, Inc.Sonos, Inc.Tohoku Pioneer Corp.Southwire Co. LLCWidex A/SWidex A/SSennheiser V & V GmbH & Co. KGPlantronics, Inc.Shure, Inc.Philips Electronics Ltd.D&M Holdings, Inc.Zalman Tech Co., Ltd.Merry Electronics Co., Ltd.Shenzhen Horn Audio Co. Ltd.AKG Acoustics GmbHSonion Nederland BVAputure Imaging Industries Co., Ltd.Aputure Imaging Industries Co., Ltd.Merry Electronics Shenzhen Co. Ltd.
Alps Alpine Co., Ltd.ShinMaywa Industries, Ltd.Fisher Controls International LLCTHK CO., LTD.Kiekert AGMikuni Corp.KSB SE & Co. KGaAB/E Aerospace, Inc.Siemens Schweiz AGMicroJet Technology Co., Ltd.Sanyo Special Steel Co., Ltd.Murakami Corp.CTS Corp.Mabuchi Motor Co., Ltd.Koganei Corp.Fiskars Brands, Inc.LINAK A/SLinak (Shenzhen) Actuator Systems Ltd.AMOGREENTECH Co., Ltd.KOREA AEROSPACE INDUSTRIES Ltd.Korea University of Technology & EducationAichi Electric Co., Ltd.Amotech Co., Ltd.Nippon Thompson Co., Ltd.Precision Valve Corp.AptarGroup, Inc.Dart Robot Co., Ltd.Harada Industry Co., Ltd.Mitani Valve Co. Ltd.Tokyo Parts Industrial Co., Ltd.
Samsung Electronics Co., Ltd.Canon, Inc.Canon, Inc.Fujitsu Ltd.Sharp Corp.SANYO Electric Co., Ltd.Sumitomo Electric Industries Ltd.Sumitomo Electric Industries Ltd.BOE Technology Group Co., Ltd.KYOCERA Chemical Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fuji Electronics Co., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Taiwan Semiconductor Manufacturing Co., Ltd.Samsung Electro-Mechanics Co., Ltd.Renesas Electronics Corp.Shin-Etsu Chemical Co., Ltd.Alps Alpine Co., Ltd.Yamaha Corp.Suzuki Co., Ltd.Showa Denko Materials Co. Ltd.Resonac Corp.Sumitomo Metal Industries Ltd.Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd.Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd.TCL China Star Optoelectronics Technology Co., Ltd.NXP Semiconductors (Thailand) Co., Ltd.NGK SPARK PLUG CO., LTD.
Samsung Electronics Co., Ltd.Canon, Inc.Canon, Inc.Hitachi Ltd.Fujitsu Ltd.Sharp Corp.SANYO Electric Co., Ltd.Intel Corp.Sumitomo Electric Industries Ltd.Sumitomo Electric Industries Ltd.BOE Technology Group Co., Ltd.Boe Innovation Investment Co. Ltd.KYOCERA Chemical Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fuji Electronics Co., Ltd.Nikon Corp.OppoTaiwan Semiconductor Manufacturing Co., Ltd.Semiconductor Energy Laboratory Co., Ltd.Toppan, Inc.Fraunhofer-Gesellschaft eVSamsung Electro-Mechanics Co., Ltd.AGC, Inc. (Japan)ABB Automation, Inc.Renesas Electronics Corp.Shin-Etsu Chemical Co., Ltd.Alps Alpine Co., Ltd.Suzuki Co., Ltd.Showa Denko Materials Co. Ltd.