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Hewlett-Packard Development Co.Daewoo Electronics Co. Ltd.Lenovo (Beijing) Co., Ltd.Advanced Micro Devices, Inc.NVIDIA Corp.ASUSTek Computer, Inc.VIA Technologies, Inc.HKC Corp. Ltd.Inspur Electronic Information Industry Co., Ltd.Canon Electronics, Inc.Digital Equipment Corp.Peking University Founder Group Corp.Peking University Founder Group Corp.Inventec (Pudong) Technology Corp.Inventec (Pudong) Technology Corp.Bunker Ramo Corp.STATS ChipPAC Pte Ltd.Fujitsu Client Computing Ltd.Compaq Computer Corp.Inspur (Beijing) Electronic Information Industry Co., Ltd.Razer (Asia-Pacific) Pte. Ltd.Razer (Asia-Pacific) Pte. Ltd.Sundisk Corp.Qisda (Suzhou) Co. Ltd.Powertech Technology, Inc.Qisda (Suzhou) Co. Ltd.Getac Technology (Kunshan) Co. Ltd.Texas Instruments Deutschland GmbHGetac Technology (Kunshan) Co. Ltd.Hiyes International Co., Ltd.
Fujitsu Ltd.Hewlett-Packard Development Co.Daewoo Electronics Co. Ltd.Lenovo (Beijing) Co., Ltd.Sea Chief Supply Co. Ltd.Makita Corp.HKC Corp. Ltd.Julius Blum & Co., Inc.Inspur Electronic Information Industry Co., Ltd.Canon Electronics, Inc.Emhart Industries, Inc.Emhart Industries, Inc.Digital Equipment Corp.Peking University Founder Group Corp.Paul Hettich GmbH & Co. KGSugatsune Kogyo Co., Ltd.Peking University Founder Group Corp.Autoliv ASP, Inc.Inventec (Pudong) Technology Corp.Inventec (Pudong) Technology Corp.Bunker Ramo Corp.ServiceNow, Inc.Miwa Lock Co., Ltd.U-Shin France SASAssa Abloy Ltd.King Slide Works Co., Ltd.Fujitsu Client Computing Ltd.International Computers Ltd.Aug. Winkhaus GmbH & Co. KGCompaq Computer Corp.