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Samsung Electronics Co., Ltd.Toyota Motor Corp.Apple, Inc.OppoNTT DOCOMO, Inc.Fujikura Ltd.Lenovo Group Ltd.Datang Mobile Communications Equipment Co. Ltd.Toyo Ink SC Holdings Co. Ltd.BlackBerry Ltd.Orange SAXiaomi Corp.HTC Corp.China Telecom Corp. Ltd.KDDI Corp.Motorola Solutions Credit Co. LLCChina United Network Communications Ltd.GoerTek Inc.Motorola Mobility LLCDeutsche Telekom AGMcNeil-PPC, Inc.Giesecke+Devrient GmbHSkyworks Solutions, Inc.Walmart LabsLear Corp.PayPal, Inc.Chunghwa Picture Tubes Ltd.LG Uplus Corp.Shenzhen Royole Technologies Co., Ltd.Shenzhen Royole Technologies Co., Ltd.
Almalence, Inc.Algolux, Inc.Irida Labs S.A.
Samsung Electronics Co., Ltd.Canon, Inc.Canon, Inc.LG Electronics, Inc.Fujitsu Ltd.Sharp Corp.Ricoh Co., Ltd.Seiko Epson Corp.SANYO Electric Co., Ltd.Intel Corp.FUJIFILM Corp.Apple, Inc.Hon Hai Precision Industry Co., Ltd.Samsung Display Co., Ltd.SK hynix, Inc.BOE Technology Group Co., Ltd.Brother Industries, Ltd.Eastman Kodak Co.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Boe Innovation Investment Co. Ltd.Fujifilm Business Innovation Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.LG Display Co., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Xerox Holdings Corp.Oki Electric Industry Co., Ltd.Olympus Corp.Mita Industrial Co., Ltd.Micron Technology, Inc.
Samsung Electronics Co., Ltd.Canon, Inc.Canon, Inc.Fujitsu Ltd.General Electric Co.General Electric Co.Seiko Epson Corp.SANYO Electric Co., Ltd.Intel Corp.FUJIFILM Corp.Apple, Inc.Samsung Display Co., Ltd.Hewlett-Packard Development Co.Google LLCEastman Kodak Co.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Fujifilm Business Innovation Corp.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Honeywell International, Inc.Xerox Holdings Corp.Tencent Technology (Shenzhen) Co., Ltd.Oki Electric Industry Co., Ltd.Olympus Corp.Tencent Technology (Shenzhen) Co., Ltd.Motorola, Inc.TDK Corp.Alcatel-Lucent S AToyota Industries Corp.Microsoft Corp.Victor Company of Japan Ltd.
Samsung Electronics Co., Ltd.SK hynix, Inc.OppoMicron Technology, Inc.Samsung Electro-Mechanics Co., Ltd.Hamamatsu Photonics KKSony Semiconductor Solutions Corp.United Microelectronics Corp.MagnaChip Semiconductor Ltd.DB HITEK Co., Ltd.Cypress Semiconductor Corp.LARGAN Precision Co., Ltd.PixArt Imaging, Inc.STMicroelectronics International NVNovuton Technology Corp. JapanSarnoff Corp.IEE International Electronics & Engineering SASony Group Corp.FUJIFILM Electronic Materials USA, Inc.Huaian Imaging Device Manufacturer Corp.Huaian Imaging Device Manufacturer Corp.VisEra Technologies Co., Ltd.FlexEnable Ltd.PolyIC GmbH & Co. KGTeledyne Scientific & Imaging LLCISORG SAInvensas Bonding Technologies, Inc.PMD Technologies Ltd.SEKONIX Co., Ltd.AGC Techno Glass Co. Ltd.
Koninklijke Philips NVKoninklijke Philips NVFUJIFILM Corp.Nikon Corp.OppoElectronics & Telecommunications Research InstituteFraunhofer-Gesellschaft eVKonica Minolta, Inc.Industrial Technology Research InstituteHuazhong University of Science & TechnologyMinolta Co., Ltd.Hitachi Cable Ltd.Funai Electric Co., Ltd.University of Electronic Science & Technology of ChinaBeihang UniversityBeijing Institute of TechnologyAdvantest Corp.Southwest Jiaotong UniversityHarbin University of Science & TechnologyNational University of Defense TechnologyMax Planck Gesellschaft zur Förderung der Wissenschaften eVSCHOTT AGNanjing UniversityFujinon, Inc.National University of Defense TechnologyNanjing University of Posts & TelecommunicationsNanjing University of Information Science & TechnologyBeijing University of Posts & TelecommunicationsDeutsches Zentrum für Luft- und Raumfahrt e.V.Guilin University of Electronic Technology