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Samsung Electronics Co., Ltd.Canon, Inc.Canon, Inc.Sony Group Corp.Fujitsu Ltd.General Electric Co.General Electric Co.Huawei Technologies Co., Ltd.Seiko Epson Corp.SANYO Electric Co., Ltd.Intel Corp.ZTE Corp.Apple, Inc.FUJIFILM Corp.Hewlett-Packard Development Co.Eastman Kodak Co.Fujifilm Business Innovation Corp.Google LLCFujifilm Business Innovation Corp.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Honeywell International, Inc.Xerox Holdings Corp.Tencent Technology (Shenzhen) Co., Ltd.Alcatel-Lucent S AOlympus Corp.Microsoft Corp.Beijing Xiaomi Mobile Software Co., Ltd.Toyota Industries Corp.Muratec Automation Co., Ltd.
Toppan, Inc.SCREEN Holdings Co., Ltd.ASML Holding NVEvatec AGHyogo University ofPlasma-Therm LLCSEMATECH, Inc.Hermes Microvision, Inc.SUSS Microtec, Inc.Kokusai Semiconductor Equipment Corp.
TRUSTEES OF THE UNIV OF PENNSYLVANIADeutsches Zentrum für Luft- und Raumfahrt e.V.Mattel, Inc.Magic Leap, Inc.LG H&H Co., Ltd.University of PittsburghNippon Sanso KKAVL List GmbHShanghai Maritime UniversityImmersion Corp.Huaiyin Institute of TechnologyGhent UniversityHitachi-GE Nuclear Energy Ltd.Sikorsky Aircraft Corp.Guangdong Polytechnic Normal UniversityUniversity of Kentucky Research FoundationSony Interactive Entertainment LLC3D Systems, Inc.Israel Aerospace Industries Ltd.Huangshan UniversityKorea University of Technology & EducationThe Ritsumeikan TrustChang Gung UniversityThe Board of Trustees of The University of AlabamaDeepMind Technologies Ltd.Xi'an International UniversityBinder GmbHPontificia Universidad Católica de ChileLaerdal Medical ASThe Climate Corp.
Canon, Inc.Canon, Inc.Hitachi Ltd.Fujitsu Ltd.Sharp Corp.Sumitomo Electric Industries Ltd.Sumitomo Electric Industries Ltd.Sumitomo Chemical Co., Ltd.BOE Technology Group Co., Ltd.Boe Innovation Investment Co. Ltd.KYOCERA Chemical Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fuji Electronics Co., Ltd.Nikon Corp.Taiwan Semiconductor Manufacturing Co., Ltd.Semiconductor Energy Laboratory Co., Ltd.Guangzhou Bosma Optoelectronic Technology Co. Ltd.Toppan, Inc.Fraunhofer-Gesellschaft eVSamsung Electro-Mechanics Co., Ltd.AGC, Inc. (Japan)ABB Automation, Inc.Renesas Electronics Corp.Shin-Etsu Chemical Co., Ltd.Alps Alpine Co., Ltd.Suzuki Co., Ltd.Showa Denko Materials Co. Ltd.Resonac Corp.South China University of Technology
Citizen Watch Co., Ltd.Tokin Corp. /JP/Nippon Chemi-Con Corp.LS Mtron Ltd.ELNA Co., Ltd.Koei Chemical Co., Ltd.Gentherm, Inc.Microchip Technology Caldicot Ltd.Transense Technologies PlcIngenic Semiconductor Co., Ltd.EnOcean GmbHNewnagyHenan Jinkai Chemical Investment Holding Group Co., Ltd.Midé Technology Corp.Oscilla Power, Inc.CAP-XX Ltd.Marlow Industries, Inc.Sionic Energyproionic GmbHLumedyne Technologies, Inc.Ioxus, Inc.O-Flexx Technologies GmbHAxion Power International, Inc.Gas Sensing Solutions Ltd.Tigo Energy, Inc.Kinetron BVOcean Harvesting Technologies ABAmbiq Micro, Inc.SPARQ Systems, Inc.Feenex, Inc.
Toppan, Inc.SCREEN Holdings Co., Ltd.DISCO Corp.Lam Research Corp.Advantest Corp.ULVAC, Inc.KLA Corp.SEMES Co., Ltd.Shibaura Mechatronics Corp.Fujitsu Semiconductor Ltd.DB HITEK Co., Ltd.Tokyo Seimitsu Co., Ltd.Varian Semiconductor Equipment Associates, Inc.Teradyne, Inc.Siliconware Precision Industries Co., Ltd.Siltronic AGJUSUNG ENGINEERING Co., Ltd.ASML Holding NVNovellus Systems, Inc.Hitachi High-Tech Science Corp.Advanced Micro Fabrication Equipment, Inc. ChinaAdvanced Micro Fabrication Equipment, Inc. ChinaPowertech Technology, Inc.GlobalWafers Co., Ltd.Mirae Corp.CMC Materials, Inc.STMicroelectronics Asia Pacific Pte Ltd.GigaLane Co., Ltd.Monolithic Power Systems, Inc.SK Siltron Co., Ltd.
Synopsys, Inc.FocalTech Systems Co., Ltd.Helic SA