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Daimler-Benz Aerospace AGFried. Krupp GmbHGebrueder SulzerNippon Steel Nisshin Co., Ltd.LIXIL Corp. /Old/Koenig & Bauer AGKoenig & Bauer AGTaiheiyo Cement Corp.Kennametal, Inc.China Construction Eighth Engineering Division Corp. Ltd.China Construction Second Engineering Bureau Co., Ltd.United States Gypsum Co.China Railway Siyuan Survey & Design Group Co., Ltd.United States Gypsum Co.Combustion Engineering, Inc.Primetals Asset Management U.K. Ltd.Saint-Gobain TM KKZhejiang Yasha Decoration Co., Ltd.Albemarle Corp.Paul Wurth SAJohns Manville Corp.Powerchina Huadong Engineering Corp. Ltd.Powerchina Huadong Engineering Corp. Ltd.Shanghai Baoye Group Co., Ltd.Graco, Inc.China Construction Seventh Engineering Division Corp. Ltd.SMS group GmbHKorea Institute of Construction TechnologyThe First Co. of China Eighth Engineering Bureau Ltd.RHI Magnesita Deutschland AG
BlackBerry Ltd.Socionext, Inc.Macronix International Co., Ltd.Freescale Semiconductor, Inc.VIA Technologies, Inc.Unisys Corp.Broadcom Corp.Atmel Corp.British Gas Ltd.Shenzhen Polytechnic CollegeTYK Corp.Schweitzer Engineering Laboratories, Inc.Indesit Company SpANuvoton Technology Corp.Hitachi Industry & Control Solutions Ltd.Pilz GmbH & Co. KGHandan CollegeEVOC Intelligent Technology Co. Ltd.EVOC Intelligent Technology Co. Ltd.SCHUNK GmbH & Co. KGHoltek Semiconductor, Inc.Shanghai Huahong Integrated Circuit Co., Ltd.Shanghai Huahong Integrated Circuit Co., Ltd.Stefan cel Mare University of SuceavaBaumüller Nürnberg GmbHPTC, Inc.Coherent Logix, Inc.ATS Corp.Xicato, Inc.Dassault Systemes Simulia Corp.
General Dynamics Corp.Rheinmetall Waffe Munition GmbHHYUNDAI ROTEM Co.Israel Aerospace Industries Ltd.GIAT Industries SASUMBDA Deutschland GmbHCockerill Maintenance et Ingénierie SAOto Melara SpANorth Electro-Optic Co., Ltd.TDA Armements SASUnited Defense LPPLA Dalian Naval AcademyGeneral Dynamics Ordnance & Tactical Systems, Inc.CAS, Inc.Harbin Xinguang Optic-Electronics Technology Co., Ltd.Wyle Laboratories, Inc.Shanxi Zhongtian Rocket Technology Co., Ltd.TPL, Inc.Robotic Technology, Inc.WilliamsRDM, Inc.General Dynamics Defense Systems, Inc.General Dynamics Defense Systems, Inc.Mecar SALOGIC Devices, Inc.Cai Barrington, Inc.Hanwha Land Systems Co., Ltd.Zbrojovka Vsetin asSimmel Difesa SpAScience & Engineering Services, Inc.Protability & Precision
Lite-On IT Corp.Access Co., Ltd.DEXIN Corp.Trek 2000 International Ltd.Sercomm Corp.Movea SAGenomSys SAAbsolute Software Corp.Canaan Creative Co., Ltd.Innodisk Corp.Cricut, Inc.Red Bend Ltd.Hyperstone GmbHADTEX, Inc.Ivani LLCAxiohm SASLattice Energy Technology Corp.Tera SRLActions Semiconductor Co. Ltd.Magnum Semiconductor, Inc.WFE Technology Corp.Oak Technology, Inc.Teknovus, Inc.Bandspeed, Inc.Imperas, Inc.Cypak ABKilopass Technology, Inc.Jiangsu Eazytec Co., Ltd.Future Dial, Inc.Kudelski SA
Xi'an Sinochip Semiconductors Co., Ltd.Wix.com Ltd.Chongqing Polycomp International Corp.Chongqing Polycomp International Corp.Orient Semiconductor Electronics Ltd.Shenzhen Huion Animation Technology Co. Ltd.NingXia XN Automation Equipment Co., Ltd.NingXia XN Automation Equipment Co., Ltd.TQ-Systems GmbHKnig + Neurath AGUnited Memories, Inc.Tela Innovations, Inc.Shenzhen Chipsbank Technologies Co., Ltd.Shenzhen Chipsbank Technologies Co., Ltd.Beijing UniStrong Science & Technology Co., Ltd.Beijing UniStrong Science & Technology Co., Ltd.IDEEMATEC Deutschland GmbHPeddinghaus CorpOber SAI&T GmbHSunfolding, Inc.Suzhou Juneng Machine Vision Technology Co., Ltd.Suzhou Juneng Machine Vision Technology Co., Ltd.Hangzhou Pinming Software Co., Ltd.Universal Electric Corp.Accelerated Systems, Inc.Best Technology (Shenzhen), Inc.Shanghai Supratec Environment Co., Ltd.Steinmüller Engineering GmbHAB Connectors Ltd.
Samsung Electronics Co., Ltd.Canon, Inc.International Business Machines Corp.Fujitsu Ltd.General Electric Co.Huawei Technologies Co., Ltd.Seiko Epson Corp.SANYO Electric Co., Ltd.Intel Corp.ZTE Corp.Apple, Inc.FUJIFILM Corp.Hewlett-Packard Development Co.Eastman Kodak Co.Fujifilm Business Innovation Corp.Google LLCFujifilm Business Innovation Corp.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Honeywell International, Inc.Xerox Holdings Corp.Tencent Technology (Shenzhen) Co., Ltd.Alcatel-Lucent S AOlympus Corp.Microsoft Corp.Beijing Xiaomi Mobile Software Co., Ltd.Toyota Industries Corp.Muratec Automation Co., Ltd.Victor Company of Japan Ltd.Victor Company of Japan Ltd.