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Samsung Electronics Co., Ltd.Toyota Motor Corp.Huawei Technologies Co., Ltd.Apple, Inc.OppoNTT DOCOMO, Inc.Fujikura Ltd.Lenovo Group Ltd.Datang Mobile Communications Equipment Co. Ltd.BlackBerry Ltd.Xiaomi Corp.Motorola Solutions, Inc.KDDI Corp.China United Network Communications Ltd.Motorola Mobility LLCNintendo Co., Ltd.Motorola Solutions Credit Co. LLCOrange SAGoerTek Inc.Deutsche Telekom AGChina Telecom Corp. Ltd.Toyo Ink SC Holdings Co. Ltd.Giesecke+Devrient GmbHLear Corp.Skyworks Solutions, Inc.Chunghwa Picture Tubes Ltd.PayPal, Inc.Nanya Technology Corp.Shenzhen Royole Technologies Co., Ltd.Shenzhen Royole Technologies Co., Ltd.
RingCentral, Inc.Gigaset Communications GmbHAlpha Networks, Inc.silex technology, Inc.TranSwitch Corp.ShoreTel, Inc.Calix, Inc.Alvarion Ltd.Audiocodes, Inc.Grandstream Networks, Inc.Mobileum, Inc.BroadSoft, Inc.Ooma, Inc.Net2Phone, Inc.Bandwidth, Inc.Acme Packet, Inc.Phoenix Technologies International LLCCalabrio, Inc.JAJAH, Inc.Nextiva, Inc.World Wide Packets, Inc.Nurivoice Co., Ltd.ViaCLIX, Inc.NextNet Wireless, Inc.PowerDsine Ltd.BridgePort Networks, Inc.IntelePeer, Inc.PurpleComm, Inc.Talari Networks, Inc.D2 Technologies, Inc.
CEDAR Audio Ltd.
Samsung Electronics Co., Ltd.Canon, Inc.Canon, Inc.Fujitsu Ltd.Sharp Corp.SANYO Electric Co., Ltd.Sumitomo Electric Industries Ltd.Sumitomo Electric Industries Ltd.BOE Technology Group Co., Ltd.KYOCERA Chemical Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fuji Electronics Co., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Taiwan Semiconductor Manufacturing Co., Ltd.Semiconductor Energy Laboratory Co., Ltd.Guangzhou Bosma Optoelectronic Technology Co. Ltd.Samsung Electro-Mechanics Co., Ltd.Renesas Electronics Corp.Shin-Etsu Chemical Co., Ltd.Alps Alpine Co., Ltd.Yamaha Corp.Suzuki Co., Ltd.Showa Denko Materials Co. Ltd.Resonac Corp.Sumitomo Metal Industries Ltd.Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd.Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd.TCL China Star Optoelectronics Technology Co., Ltd.NXP Semiconductors (Thailand) Co., Ltd.
Samsung Electronics Co., Ltd.Canon, Inc.Hitachi Ltd.Fujitsu Ltd.Sharp Corp.SANYO Electric Co., Ltd.Intel Corp.Sumitomo Electric Industries Ltd.Sumitomo Chemical Co., Ltd.BOE Technology Group Co., Ltd.Boe Innovation Investment Co. Ltd.KYOCERA Chemical Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fuji Electronics Co., Ltd.Nikon Corp.OppoTaiwan Semiconductor Manufacturing Co., Ltd.Semiconductor Energy Laboratory Co., Ltd.Guangzhou Bosma Optoelectronic Technology Co. Ltd.Toppan, Inc.Samsung Electro-Mechanics Co., Ltd.AGC, Inc. (Japan)ABB Automation, Inc.Renesas Electronics Corp.Shin-Etsu Chemical Co., Ltd.Alps Alpine Co., Ltd.Suzuki Co., Ltd.Showa Denko Materials Co. Ltd.South China University of Technology
Huawei Technologies Co., Ltd.Motorola Solutions Credit Co. LLCADC Telecommunications, Inc.Varco International, Inc.Nokia of America Corp.Camco International, Inc.Lantiq Beteiligungs GmbH & Co. KGDiseño de Sistemas en Silicio SACisco Systems, Inc.Reeves Wireline Technologies Ltd.Geoservices SAOptiva, Inc.RadiSys Corp.Wireline Engineering Ltd.Sierra Monolithics, Inc.Cudd Pressure Control, Inc.Netrake Corp.Metanoia Communication, Inc.Accurate Technologies, Inc.Turin Networks, Inc.Symbolic Logic, Inc.Veraz Networks, Inc.Express Energy Services Operating LPGeneral Communication, Inc.Frequency Electronics, Inc.Balance Point Control BVECtel Ltd.UET United Electronic Technology AG