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Huawei Technologies Co., Ltd.Ericsson, Inc.Nippon Telegraph & Telephone Corp.ZTE Corp.Guangdong OPPO Mobile Telecommunications Corp., Ltd.NTT DOCOMO, Inc.vivo Mobile Communication Co., Ltd.Nokia Siemens Networks OyMediaTek, Inc.BT Group PlcChina Mobile Communications Group Co., Ltd.China Mobile Communications Group Co., Ltd.SZ DJI Technology Co., Ltd.telent Ltd.Mannesmann AGSK Telecom Co., Ltd.BlackBerry Ltd.Xiaomi Corp.Motorola Solutions, Inc.Nubia Technology Co., Ltd.KDDI Corp.China United Network Communications Ltd.Beijing University of Posts & TelecommunicationsMotorola Solutions Credit Co. LLCGuangzhou Shiyuan Electronic Technology Co. Ltd.Deutsche Telekom AGHangzhou H3C Technologies Co., Ltd.China Telecom Corp. Ltd.Xilinx, Inc.Broadcom Corp.
Ericsson, Inc.BT Group PlcDatang Mobile Communications Equipment Co. Ltd.Bose Corp.Hyundai WIA Corp.LG-Nortel Co., Ltd.SoftBank Corp.ViaSat, Inc.Wistron NeWeb Corp.Sagemcom Broadband SASRosenberger Hochfrequenztechnik GmbH & Co. KGSagemcom Broadband SASSilicon Laboratories, Inc.KMW, Inc.CETC Potevio Science & Technology Co., Ltd.The MathWorks, Inc.Shanghai Zenmen Technology Co. Ltd.Askey Computer Corp.Faraday Technology Corp.Arcadyan Technology Corp.TP-LINK Technologies Co., Ltd.ALAXALA Networks Corp.Wuhan Research Institute of Post & Telecommunications Co. Ltd.D-Link Corp.VoiceAge Corp.Panasonic Avionics Corp.Shakespeare Co. LLCRearden LLCNETGEAR, Inc.Airoha Technology Corp.
Samsung Electronics Co., Ltd.Canon, Inc.Canon, Inc.Hitachi Ltd.Fujitsu Ltd.Sharp Corp.SANYO Electric Co., Ltd.Sumitomo Electric Industries Ltd.Sumitomo Electric Industries Ltd.Sumitomo Chemical Co., Ltd.BOE Technology Group Co., Ltd.Boe Innovation Investment Co. Ltd.KYOCERA Chemical Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fuji Electronics Co., Ltd.Nikon Corp.OppoTaiwan Semiconductor Manufacturing Co., Ltd.Semiconductor Energy Laboratory Co., Ltd.Guangzhou Bosma Optoelectronic Technology Co. Ltd.Toppan, Inc.Fraunhofer-Gesellschaft eVSamsung Electro-Mechanics Co., Ltd.AGC, Inc. (Japan)ABB Automation, Inc.Renesas Electronics Corp.Shin-Etsu Chemical Co., Ltd.Alps Alpine Co., Ltd.Suzuki Co., Ltd.
LG Electronics, Inc.Sharp Corp.Huawei Technologies Co., Ltd.Ericsson, Inc.Nippon Telegraph & Telephone Corp.ZTE Corp.Kyocera Corp.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Oki Electric Industry Co., Ltd.Alcatel-Lucent S ANTT DOCOMO, Inc.Showa Denko Materials Co. Ltd.Resonac Corp.Western Electric Co., Inc.Fujikura Ltd.Hitachi Metals, Ltd.Proterial Ltd.vivo Mobile Communication Co., Ltd.Nokia Siemens Networks OyLucent Technologies, Inc.BT Group PlcChina Mobile Communications Group Co., Ltd.China Mobile Communications Group Co., Ltd.telent Ltd.Mannesmann AGJapan Aviation Electronics Industry Ltd.SK Telecom Co., Ltd.BlackBerry Ltd.Tokyo Electric Power Co. Holdings, Inc.Nubia Technology Co., Ltd.
Tokyo Seimitsu Co., Ltd.TKX Corp.TEXTOR Maschinenbau GmbHGrasselli SpAPPT Research, Inc.Thurne-Middleby Ltd.Zeetta Networks Ltd.iBEAM Broadcasting Corp.Aewtl Realisations Ltd.United Bakery Equipment Co., Inc.
Ericsson, Inc.ZTE Corp.Datang Mobile Communications Equipment Co. Ltd.KDDI Corp.CommScope Technologies LLCQuanta Computer, Inc.Tamura Corp.Telecom Italia SpAT-Mobile USA, Inc.Hyundai WIA Corp.LSI Corp.Wistron NeWeb Corp.Sagemcom Broadband SASRosenberger Hochfrequenztechnik GmbH & Co. KGSagemcom Broadband SASAnhui Tatfook Technology Co., Ltd.Viavi Solutions, Inc.Extreme Networks, Inc.China Academy of Information & Communication TechnologyMACOM Technology Solutions Holdings, Inc.Askey Computer Corp.HemphillNTT Advanced Technology Corp.China Academy of Information & Communication TechnologyFaraday Technology Corp.Nokia of America Corp.JMA LLCECI Telecom Ltd.ALAXALA Networks Corp.SOLiD, Inc.
Taiwan Semiconductor Manufacturing Co., Ltd.Shin-Etsu Chemical Co., Ltd.Shin-Etsu Handotai Co., Ltd.Angang Steel Co., Ltd.Wuhan Iron & Steel Co., Ltd.Soitec SAWuhan Iron & Steel Group Corp.Fujimi, Inc.Elpida Memory, Inc.Siltronic AGPrimetals Technologies Austria GmbHElkem ASAElectro Scientific Industries, Inc.AIXTRON SENippon Steel & Sumikin Coated Sheet Corp.Inner Mongolia Baotou Steel Union Co. Ltd.Hirata Corp.LX Semicon Co., Ltd.CSG Holding Co., Ltd.GlobalWafers Co., Ltd.eMemory Technology, Inc.Silicon Integrated Systems Corp.Silicon Integrated Systems Corp.Faraday Technology Corp.OSAKA Titanium Technologies Co., Ltd.GigaLane Co., Ltd.Anshan Iron & Steel Group Corp.Fujikoshi Machinery Corp.Tongwei Co., Ltd.Institut National des Sciences Appliquées de Lyon