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Alpha Networks, Inc.Alcatel-Lucent Holdings, Inc.Sernet Technology Ltd.GlobespanVirata, Inc.Amati Communications Corp.Amati Communications Corp.Tripath Technology, Inc.Virata Corp.Virata Corp.Comtrend Corp.Tailyn Technologies, Inc.Efficient Networks, Inc.Tellion, Inc.DrayTek Corp.Integrated Telecom Express, Inc.Integrated Telecom Express, Inc.Minim, Inc.MetaSolv Software, Inc.
Hewlett-Packard Development Co.Daewoo Electronics Co. Ltd.Lenovo (Beijing) Co., Ltd.Advanced Micro Devices, Inc.NVIDIA Corp.ASUSTek Computer, Inc.VIA Technologies, Inc.HKC Corp. Ltd.Inspur Electronic Information Industry Co., Ltd.Digital Equipment Corp.Peking University Founder Group Corp.Peking University Founder Group Corp.Inventec (Pudong) Technology Corp.Inventec (Pudong) Technology Corp.Bunker Ramo Corp.STATS ChipPAC Pte Ltd.Fujitsu Client Computing Ltd.Compaq Computer Corp.Compaq Computer Corp.Inspur (Beijing) Electronic Information Industry Co., Ltd.Inspur (Beijing) Electronic Information Industry Co., Ltd.Razer (Asia-Pacific) Pte. Ltd.Sundisk Corp.Qisda (Suzhou) Co. Ltd.Powertech Technology, Inc.Qisda (Suzhou) Co. Ltd.Getac Technology (Kunshan) Co. Ltd.Texas Instruments Deutschland GmbHGetac Technology (Kunshan) Co. Ltd.Hiyes International Co., Ltd.
Fujitsu Ltd.Hewlett-Packard Development Co.Daewoo Electronics Co. Ltd.Lenovo (Beijing) Co., Ltd.Sea Chief Supply Co. Ltd.Makita Corp.ASUSTek Computer, Inc.HKC Corp. Ltd.Julius Blum & Co., Inc.Inspur Electronic Information Industry Co., Ltd.Emhart Industries, Inc.Emhart Industries, Inc.Digital Equipment Corp.Peking University Founder Group Corp.Paul Hettich GmbH & Co. KGSugatsune Kogyo Co., Ltd.Peking University Founder Group Corp.Autoliv ASP, Inc.Inventec (Pudong) Technology Corp.Inventec (Pudong) Technology Corp.Bunker Ramo Corp.ServiceNow, Inc.Miwa Lock Co., Ltd.U-Shin France SASAssa Abloy Ltd.Fujitsu Client Computing Ltd.Aug. Winkhaus GmbH & Co. KGCompaq Computer Corp.Compaq Computer Corp.Inspur (Beijing) Electronic Information Industry Co., Ltd.
Advanced Micro Devices, Inc.NVIDIA Corp.Realtek Semiconductor Corp.VIA Technologies, Inc.Cirrus Logic, Inc.Institute For Information IndustrySilicon Integrated Systems Corp.Silicon Integrated Systems Corp.Cambricon Technologies Corp. Ltd.ALi Corp.Rockchip Electronics Co., Ltd.LeadCore Technology Co. Ltd.Rockley Photonics Ltd.BitMain Technologies Holding Co.Anyka (Guangzhou) Microelectronics Technology Co., Ltd.Anyka (Guangzhou) Microelectronics Technology Co., Ltd.BitMain Technologies Holding Co.Graphcore Ltd.Volterra Semiconductor Corp.Ingenic Semiconductor Co., Ltd.Ralink Technology Corp.Nan Ya Printed Circuit Board CorpUbiNetics Ltd.Time Domain Corp.SenseTime Group Ltd.Chipintelli Co. Ltd.Flarion Technologies, Inc.Beijing Horizon Robotics Technology Development Co., Ltd.Verisilicon Microelectronics (Shanghai) Co., Ltd.Sequans Communications SA
Samsung Electronics Co., Ltd.Canon, Inc.Fujitsu Ltd.Sharp Corp.SANYO Electric Co., Ltd.Intel Corp.Sumitomo Electric Industries Ltd.BOE Technology Group Co., Ltd.KYOCERA Chemical Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fuji Electronics Co., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Taiwan Semiconductor Manufacturing Co., Ltd.Semiconductor Energy Laboratory Co., Ltd.Samsung Electro-Mechanics Co., Ltd.Renesas Electronics Corp.Shin-Etsu Chemical Co., Ltd.Alps Alpine Co., Ltd.Yamaha Corp.Suzuki Co., Ltd.Showa Denko Materials Co. Ltd.Sumitomo Metal Industries Ltd.Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd.TCL China Star Optoelectronics Technology Co., Ltd.NXP Semiconductors (Thailand) Co., Ltd.NGK SPARK PLUG CO., LTD.NXP BVTCL China Star Optoelectronics Technology Co., Ltd.
Samsung Electronics Co., Ltd.Canon, Inc.Hitachi Ltd.Fujitsu Ltd.Sharp Corp.SANYO Electric Co., Ltd.Intel Corp.Sumitomo Electric Industries Ltd.Sumitomo Chemical Co., Ltd.BOE Technology Group Co., Ltd.Boe Innovation Investment Co. Ltd.KYOCERA Chemical Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fuji Electronics Co., Ltd.Nikon Corp.OppoTaiwan Semiconductor Manufacturing Co., Ltd.Semiconductor Energy Laboratory Co., Ltd.Toppan, Inc.Samsung Electro-Mechanics Co., Ltd.AGC, Inc. (Japan)ABB Automation, Inc.Renesas Electronics Corp.Shin-Etsu Chemical Co., Ltd.Alps Alpine Co., Ltd.Suzuki Co., Ltd.Showa Denko Materials Co. Ltd.South China University of TechnologySoutheast University
Samsung Electronics Co., Ltd.Canon, Inc.International Business Machines Corp.Fujitsu Ltd.General Electric Co.Huawei Technologies Co., Ltd.Seiko Epson Corp.SANYO Electric Co., Ltd.Intel Corp.ZTE Corp.Apple, Inc.FUJIFILM Corp.Hewlett-Packard Development Co.Eastman Kodak Co.Fujifilm Business Innovation Corp.Google LLCFujifilm Business Innovation Corp.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Honeywell International, Inc.Xerox Holdings Corp.Tencent Technology (Shenzhen) Co., Ltd.Alcatel-Lucent S AOlympus Corp.Microsoft Corp.Beijing Xiaomi Mobile Software Co., Ltd.Toyota Industries Corp.Muratec Automation Co., Ltd.Victor Company of Japan Ltd.Victor Company of Japan Ltd.