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Hewlett-Packard Development Co.BlackBerry Ltd.VIA Technologies, Inc.Citrix Systems, Inc.Unisys Corp.Tata Consultancy Services Ltd.VMware, Inc.Avaya, Inc.PayPal, Inc.Uber Technologies, Inc.NTT DATA Corp.Toyo Tanso Co., Ltd.Neos Co. Ltd.Gogoro, Inc.Infosys Ltd.Shanghai Junzheng Network Technology Co., Ltd.Shanghai Junzheng Network Technology Co., Ltd.Lyft, Inc.Hach Co.Fisher-Price, Inc.BMC Software, Inc.Macquarie UniversityPI Industries Ltd.Sophos Ltd.Ivanti, Inc.Aligos Therapeutics, Inc.Shanghai YITU Network Technology Co. Ltd.Shanghai YITU Network Technology Co. Ltd.George Mason UniversitySingapore Airlines Ltd.
Sony Group Corp.Taiwan Semiconductor Manufacturing Co., Ltd.Sony Computer Entertainment, Inc.Wistron Corp.NVIDIA Corp.Nintendo Co., Ltd.Mattel, Inc.LEGO A/SLEGO A/SNihon Dempa Kogyo Co., Ltd.Pegatron Corp.BANDAI NAMCO Entertainment, Inc.MERCURY Corp.Square Enix Holdings Co., Ltd.GREE, Inc.Sony Interactive Entertainment LLCCOLOPL, Inc.NHN Corp.Hasbro, Inc.Precision Valve Corp.Capcom Co., Ltd.Block, Inc.AT & S Austria Technologie & Systemtechnik AGSony Pictures Entertainment, Inc.Giant Manufacturing Co., Ltd.NCsoft Corp.Electronic Arts, Inc.JAPAN ELECTRONIC MATERIALS CORP.JAPAN ELECTRONIC MATERIALS CORP.Zynga, Inc.
LG Electronics, Inc.Fujitsu Ltd.Apple, Inc.Hewlett-Packard Development Co.Taiwan Semiconductor Manufacturing Co., Ltd.Lenovo (Beijing) Co., Ltd.Motorola Solutions Credit Co. LLCHon Hai Precision Industry Co., Ltd.Realtek Semiconductor Corp.HKC Corp. Ltd.Harman International Industries, Inc.Altera Corp.Nihon Dempa Kogyo Co., Ltd.Digital Equipment Corp.Pegatron Corp.Peking University Founder Group Corp.InfoVision Optoelectronics (Kunshan) Co., Ltd.InfoVision Optoelectronics (Kunshan) Co., Ltd.Peking University Founder Group Corp.Elpida Memory, Inc.LSI Corp.Elecom Co., Ltd.Uchida Yoko Co., Ltd.NHN Corp.ELAN Microelectronics Corp.Silicon Integrated Systems Corp.Silicon Integrated Systems Corp.THINKWARE Systems Corp.AvanStrate, Inc.Gateway, Inc.
Samsung Electronics Co., Ltd.Canon, Inc.Fujitsu Ltd.Sharp Corp.SANYO Electric Co., Ltd.Sumitomo Electric Industries Ltd.BOE Technology Group Co., Ltd.KYOCERA Chemical Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fuji Electronics Co., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Taiwan Semiconductor Manufacturing Co., Ltd.Semiconductor Energy Laboratory Co., Ltd.Samsung Electro-Mechanics Co., Ltd.Renesas Electronics Corp.Shin-Etsu Chemical Co., Ltd.Alps Alpine Co., Ltd.Yamaha Corp.Suzuki Co., Ltd.Showa Denko Materials Co. Ltd.Resonac Corp.Sumitomo Metal Industries Ltd.Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd.Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd.TCL China Star Optoelectronics Technology Co., Ltd.NXP Semiconductors (Thailand) Co., Ltd.NGK SPARK PLUG CO., LTD.NXP BV
Samsung Electronics Co., Ltd.Canon, Inc.Canon, Inc.Hitachi Ltd.Fujitsu Ltd.Sharp Corp.SANYO Electric Co., Ltd.Intel Corp.Sumitomo Electric Industries Ltd.Sumitomo Electric Industries Ltd.BOE Technology Group Co., Ltd.Boe Innovation Investment Co. Ltd.KYOCERA Chemical Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fuji Electronics Co., Ltd.Nikon Corp.OppoTaiwan Semiconductor Manufacturing Co., Ltd.Semiconductor Energy Laboratory Co., Ltd.Toppan, Inc.Fraunhofer-Gesellschaft eVSamsung Electro-Mechanics Co., Ltd.AGC, Inc. (Japan)ABB Automation, Inc.Renesas Electronics Corp.Shin-Etsu Chemical Co., Ltd.Alps Alpine Co., Ltd.Suzuki Co., Ltd.Showa Denko Materials Co. Ltd.