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Samsung Electronics Co., Ltd.Canon, Inc.Canon, Inc.Hitachi Ltd.Fujitsu Ltd.Sharp Corp.SANYO Electric Co., Ltd.Intel Corp.Sumitomo Electric Industries Ltd.Sumitomo Electric Industries Ltd.BOE Technology Group Co., Ltd.Boe Innovation Investment Co. Ltd.KYOCERA Chemical Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fuji Electronics Co., Ltd.Nikon Corp.OppoTaiwan Semiconductor Manufacturing Co., Ltd.Semiconductor Energy Laboratory Co., Ltd.Guangzhou Bosma Optoelectronic Technology Co. Ltd.Toppan, Inc.Fraunhofer-Gesellschaft eVAGC, Inc. (Japan)ABB Automation, Inc.Renesas Electronics Corp.Shin-Etsu Chemical Co., Ltd.Alps Alpine Co., Ltd.Suzuki Co., Ltd.Showa Denko Materials Co. Ltd.
Wistron Corp.LAPIS Semiconductor Co. Ltd.TECO Electric & Machinery Co., Ltd.TECO Electric & Machinery Co., Ltd.Forward Electronics Co., Ltd.Feature Integration Technology Inc.Feature Integration Technology Inc.ENE Technology, Inc.Animation Technologies, Inc.
Canon, Inc.Canon, Inc.Fujitsu Ltd.Sharp Corp.Intel Corp.Sumitomo Electric Industries Ltd.Sumitomo Electric Industries Ltd.BOE Technology Group Co., Ltd.KYOCERA Chemical Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fuji Electronics Co., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Taiwan Semiconductor Manufacturing Co., Ltd.Semiconductor Energy Laboratory Co., Ltd.Guangzhou Bosma Optoelectronic Technology Co. Ltd.Samsung Electro-Mechanics Co., Ltd.Renesas Electronics Corp.Shin-Etsu Chemical Co., Ltd.Alps Alpine Co., Ltd.Yamaha Corp.Suzuki Co., Ltd.Showa Denko Materials Co. Ltd.Resonac Corp.Sumitomo Metal Industries Ltd.Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd.Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd.TCL China Star Optoelectronics Technology Co., Ltd.NXP Semiconductors (Thailand) Co., Ltd.
ELAN Microelectronics Corp.Alcor Micro Corp.ENE Technology, Inc.Alcorlink Corp.oTHE Technology, Inc.
Maxic Technology, Inc.ENE Technology, Inc.Chiphomer Technology Ltd.
Nidec Sankyo Corp.Realtek Semiconductor Corp.PayPal, Inc.Hitachi Channel Solutions, Corp.Phison Electronics Corp.GlassBridge Enterprises, Inc.Precise Biometrics ABTai Twun Enterprise Co. Ltd.Lexar Media, Inc.Lakala Payment Co., Ltd.Nidec Sankyo (Zhejiang) Corp.Szbroad Technology Co. Ltd.ENE Technology, Inc.United Fu Shen Chen Technology Corp.Clover Network, Inc.Etsy, Inc.Uniform Industrial Corp.China-Vision Intelligent Card Reader Co. Ltd.MagTek, Inc.Airlink Technology Co. Ltd.Telxon Corp.SPYRUS, Inc.PNY Technologies, Inc.Alcorlink Corp.KICTeam, Inc.Changzhou Eversafe Electronic Lock Co., Ltd.Ezetap Mobile Solutions Pvt Ltd.Photofast Co., Ltd.Semtek Innovative Solutions Corp.RF IDeas, Inc.
DENSO Corp.KYOCERA Chemical Corp.Taiwan Semiconductor Manufacturing Co., Ltd.Samsung Electro-Mechanics Co., Ltd.Renesas Electronics Corp.Showa Denko Materials Co. Ltd.Resonac Corp.South China University of TechnologyEbara Corp.SCREEN Holdings Co., Ltd.University of Electronic Science & Technology of ChinaAdvanced Micro Devices, Inc.Lam Research Corp.Hangzhou Dianzi UniversitySemiconductor Components Industries LLCULVAC, Inc.JUKI Corp.Macronix International Co., Ltd.Shin-Etsu Handotai Co., Ltd.SEMES Co., Ltd.LAPIS Semiconductor Co. Ltd.Shinko Electric Industries Co., Ltd.Shinko Electric Industries Co., Ltd.Fujitsu Semiconductor Ltd.DB HITEK Co., Ltd.Advanced Semiconductor Engineering, Inc.Skyworks Solutions, Inc.Shenzhen Goodix Technology Co., Ltd.Shenzhen Goodix Technology Co., Ltd.HGST, Inc.