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Samsung Electronics Co., Ltd.Canon, Inc.Canon, Inc.Hitachi Ltd.Fujitsu Ltd.Sharp Corp.SANYO Electric Co., Ltd.Sumitomo Electric Industries Ltd.Sumitomo Electric Industries Ltd.Sumitomo Chemical Co., Ltd.BOE Technology Group Co., Ltd.Boe Innovation Investment Co. Ltd.KYOCERA Chemical Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fuji Electronics Co., Ltd.Nikon Corp.OppoTaiwan Semiconductor Manufacturing Co., Ltd.Semiconductor Energy Laboratory Co., Ltd.Toppan, Inc.Fraunhofer-Gesellschaft eVSamsung Electro-Mechanics Co., Ltd.AGC, Inc. (Japan)ABB Automation, Inc.Renesas Electronics Corp.Shin-Etsu Chemical Co., Ltd.Alps Alpine Co., Ltd.Suzuki Co., Ltd.Showa Denko Materials Co. Ltd.
Fujitsu Ltd.Taiwan Semiconductor Manufacturing Co., Ltd.South China University of TechnologyMediaTek, Inc.Advantest Corp.Toyota Central R&D Labs, Inc.Nanjing University of Posts & TelecommunicationsSocionext, Inc.Shinko Electric Industries Co., Ltd.Shinko Electric Industries Co., Ltd.Fujitsu Semiconductor Ltd.DB HITEK Co., Ltd.Advanced Semiconductor Engineering, Inc.EPISTAR Corp.Novatek Microelectronics Corp.Synopsys, Inc.Dowa Electronics Materials Co., Ltd.Rambus, Inc.KIOXIA Corp.Canon Anelva Corp.Siliconware Precision Industries Co., Ltd.Power Integrations, Inc.International Rectifier Corp.STATS ChipPAC Pte Ltd.Nagoya Institute of TechnologyChipMOS Technologies, Inc.Nuvoton Technology Corp.Powertech Technology, Inc.JCET Group Co., Ltd.eMemory Technology, Inc.
Samsung Electronics Co., Ltd.Canon, Inc.Canon, Inc.Fujitsu Ltd.Sharp Corp.SANYO Electric Co., Ltd.Sumitomo Electric Industries Ltd.Sumitomo Electric Industries Ltd.BOE Technology Group Co., Ltd.KYOCERA Chemical Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fuji Electronics Co., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Taiwan Semiconductor Manufacturing Co., Ltd.Oki Electric Industry Co., Ltd.Semiconductor Energy Laboratory Co., Ltd.Micron Technology, Inc.Samsung Electro-Mechanics Co., Ltd.Renesas Electronics Corp.Shin-Etsu Chemical Co., Ltd.Alps Alpine Co., Ltd.Yamaha Corp.Suzuki Co., Ltd.Showa Denko Materials Co. Ltd.Resonac Corp.Sumitomo Metal Industries Ltd.Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd.Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd.TCL China Star Optoelectronics Technology Co., Ltd.
Kubota Corp.MagnaChip Semiconductor Ltd.JATCO Ltd.Quanta Computer, Inc.Advanced Semiconductor Engineering, Inc.Lite-On Technology Corp.New York Air Brake Corp.Toyota Motor Engineering & Manufacturing North America, Inc.Nerudia Ltd.Yuhan Corp.Daido Kogyo Co., Ltd.Grifols SAInnovation First, Inc.Kobelco Research Institute, Inc.Meiko Electronics Co., Ltd.Ionics, Inc.First International Computer, Inc.Jabil, Inc.Kimball International, Inc.Jingye Iron & Steel Co., Ltd.Universal Scientific Industrial Co., Ltd.HANA MICRON, Inc.CompoSecure LLCSolus Advanced Materials Co., Ltd.Labixiaoxin (Fujian) Food Industry Co., Ltd.Labixiaoxin (Fujian) Food Industry Co., Ltd.Hatco Corp.Photop Technologies, Inc.Jiangsu Jingjiang Transformer Co., Ltd.Cirtec Medical Systems LLC
Hewlett-Packard Development Co.Daewoo Electronics Co. Ltd.Lenovo (Beijing) Co., Ltd.Advanced Micro Devices, Inc.NVIDIA Corp.HKC Corp. Ltd.Inspur Electronic Information Industry Co., Ltd.Canon Electronics, Inc.Digital Equipment Corp.Peking University Founder Group Corp.Imagination Technologies Ltd.Peking University Founder Group Corp.Inventec (Pudong) Technology Corp.Inventec (Pudong) Technology Corp.Bunker Ramo Corp.STATS ChipPAC Pte Ltd.Fujitsu Client Computing Ltd.Compaq Computer Corp.Compaq Computer Corp.Inspur (Beijing) Electronic Information Industry Co., Ltd.Razer (Asia-Pacific) Pte. Ltd.Razer (Asia-Pacific) Pte. Ltd.Sundisk Corp.Qisda (Suzhou) Co. Ltd.Powertech Technology, Inc.Qisda (Suzhou) Co. Ltd.Getac Technology (Kunshan) Co. Ltd.Texas Instruments Deutschland GmbHGetac Technology (Kunshan) Co. Ltd.Control Data Corp.
Advanced Micro Devices, Inc.Toshiba Electronic Devices & Storage Corp.Pegatron Corp.STATS ChipPAC Pte Ltd.Beijing Jingwei Hirain Technologies Co., Ltd.Beijing Jingwei Hirain Technologies Co., Ltd.Powertech Technology, Inc.Silicon Integrated Systems Corp.Silicon Integrated Systems Corp.Allwinner Technology Co., Ltd.Graphcore Ltd.SmartGen (Zhengzhou) Technology Co., Ltd.Smiths Detection LLCIngenic Semiconductor Co., Ltd.OthersAutoChips, Inc.Beijing Deepcool Industries Co. Ltd.Beijing Horizon Robotics Technology Development Co., Ltd.Beijing Deepcool Industries Co. Ltd.Verisilicon Microelectronics (Shanghai) Co., Ltd.Shanghai Westwell Information Technology Co. Ltd.Minda Corp.Verisilicon Microelectronics (Shanghai) Co., Ltd.Beijing Horizon Robotics Technology Development Co., Ltd.NZXT, Inc.Spin Transfer Technologies LLCSpreadtrum Communications, Inc.DEIF A/SDEIF A/SAmlogic, Inc.
Fraunhofer-Gesellschaft eVToyota Central R&D Labs, Inc.Semiconductor Components Industries LLCShinko Electric Industries Co., Ltd.Shinko Electric Industries Co., Ltd.Advanced Semiconductor Engineering, Inc.Polaris Innovations Ltd.Dowa Electronics Materials Co., Ltd.Siliconware Precision Industries Co., Ltd.Qimonda AGInternational Rectifier Corp.STATS ChipPAC Pte Ltd.ChipMOS Technologies, Inc.Nuvoton Technology Corp.Powertech Technology, Inc.JCET Group Co., Ltd.eMemory Technology, Inc.Hitachi AIC, Inc.SANYO Semiconductor Co., Ltd.Xintec, Inc.Etron Technology, Inc.Chipbond Technology Corp.Shenzhen Sunlord Electronics Co., Ltd.Amkor Technology, Inc.Princo Corp.NEPES Corp.Xiamen San'an Integrated Circuit Co., Ltd.Camtek Ltd.Xiamen San'an Integrated Circuit Co., Ltd.Xiamen Hongfa Electroacoustic Co., Ltd.