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Koninklijke Philips NVKoninklijke Philips NVSumitomo Electric Industries Ltd.Sumitomo Electric Industries Ltd.Boe Innovation Investment Co. Ltd.Fraunhofer-Gesellschaft eVRenesas Electronics Corp.Industrial Technology Research InstituteFujikura Ltd.Hitachi Metals, Ltd.Proterial Ltd.SNECMA SAMassachusetts Institute of TechnologyTCL China Star Optoelectronics Technology Co., Ltd.TCL China Star Optoelectronics Technology Co., Ltd.University of Electronic Science & Technology of ChinaToyoda Gosei Co., Ltd.Hamamatsu Photonics KKCarl Zeiss AGChi Mei Optoelectronics Corp.Stanley Electric Co., Ltd.Minolta Co., Ltd.China University of Petroleum (East China)China University of Petroleum (East China)OSRAM Opto Semiconductors GmbHChina Jiliang UniversityAgency for Science, Technology & ResearchCalifornia Institute of TechnologySCHOTT AGNanjing University of Posts & Telecommunications
Fraunhofer-Gesellschaft eVFujikura Ltd.Hitachi Metals, Ltd.Proterial Ltd.SNECMA SAHamamatsu Photonics KKChina University of Petroleum (East China)China University of Petroleum (East China)OSRAM Opto Semiconductors GmbHHIROSE ELECTRIC CO., LTD.Tamura Corp.Lawrence Livermore National LaboratoryPolitechnika WroclawskaCiena Corp.De la Rue International Ltd.MKS Instruments, Inc.Tatsuta Electric Wire & Cable Co., Ltd.Tatsuta Electric Wire & Cable Co., Ltd.iconectiv LLCHisense Broadband Multimedia Technologies Co., Ltd.Seikoh Giken Co., Ltd.Hisense Broadband Multimedia Technologies Co., Ltd.Toshiba Materials Co., Ltd.NTT Electronics Corp.Finisar Corp.Finisar Corp.MPI Corp.Lumentum Operations LLCIPG Photonics Corp.Mellanox Technologies Ltd.
Canon, Inc.Canon, Inc.Hitachi Ltd.Fujitsu Ltd.Sharp Corp.Sumitomo Electric Industries Ltd.Sumitomo Electric Industries Ltd.Sumitomo Chemical Co., Ltd.BOE Technology Group Co., Ltd.Boe Innovation Investment Co. Ltd.KYOCERA Chemical Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fuji Electronics Co., Ltd.Nikon Corp.Taiwan Semiconductor Manufacturing Co., Ltd.Semiconductor Energy Laboratory Co., Ltd.Toppan, Inc.Fraunhofer-Gesellschaft eVSamsung Electro-Mechanics Co., Ltd.AGC, Inc. (Japan)ABB Automation, Inc.Renesas Electronics Corp.Shin-Etsu Chemical Co., Ltd.Alps Alpine Co., Ltd.Suzuki Co., Ltd.Showa Denko Materials Co. Ltd.Resonac Corp.South China University of TechnologySoutheast University
Fujifilm Business Innovation Corp.Fujifilm Business Innovation Corp.Daihatsu Motor Co., Ltd.Chery Automobile Co., Ltd.Waymo LLCHERE Global BVLeica Geosystems AGLeica Geosystems AGNovuton Technology Corp. JapanTrimble Navigation Ltd.FARO Technologies, Inc.Zoox, Inc.Nanjing Panda Electronics Co. Ltd.Kuban University of TechnologyNanjing Panda Electronics Co. Ltd.Hitachi-LG Data Storage Korea, Inc.VanJee Technology Co., Ltd.Trimble, Inc.Shanghai Hesai Technology Co., LtdShenzhen Suteng Innovation Technology Co., Ltd.Argo AI LLCShenzhen LeiShen Intelligent System Co., Ltd.Hokuyo Automatic Co. Ltd.Zhejiang Crystal-optech Co., Ltd.ADC Automotive Distance Control Systems GmbHMicrochip Technology Caldicot Ltd.Benewake (Beijing) Co. Ltd.Benewake (Beijing) Co. Ltd.IQE PlcIbeo Automotive Systems GmbH
Canon, Inc.Canon, Inc.Ricoh Co., Ltd.Fujifilm Business Innovation Corp.Fujifilm Business Innovation Corp.Casio Computer Co., Ltd.Fraunhofer-Gesellschaft eVDaihatsu Motor Co., Ltd.Hamamatsu Photonics KKKoito Manufacturing Co., Ltd.Minolta Co., Ltd.Nichia Corp.Kennametal, Inc.Hisense Visual Technology Co., Ltd.Shibaura Mechatronics Corp.Polyplastics Co., Ltd.Lite-On Technology Corp.Han's Laser Technology Industry Group Co., Ltd.Canon Electronics, Inc.Han's Laser Technology Industry Group Co., Ltd.Optoma Corp.Waymo LLCCanon Marketing Japan, Inc.Shibuya Corp.Gwangju Institute of Science & TechnologyKEYENCE Corp.Leica Geosystems AGLeica Geosystems AGShandong Normal UniversityAppotronics Corp. Ltd.
Samsung Electronics Co., Ltd.Sony Group Corp.OppoMicron Technology, Inc.Samsung Electro-Mechanics Co., Ltd.Hamamatsu Photonics KKSony Semiconductor Solutions Corp.Semiconductor Components Industries LLCMagnaChip Semiconductor Ltd.DB HITEK Co., Ltd.Cypress Semiconductor Corp.PixArt Imaging, Inc.LARGAN Precision Co., Ltd.Novuton Technology Corp. JapanSTMicroelectronics International NVIEE International Electronics & Engineering SABYD Semiconductor Co., Ltd.Huaian Imaging Device Manufacturer Corp.Huaian Imaging Device Manufacturer Corp.FUJIFILM Electronic Materials USA, Inc.OFILM Group Co., Ltd.VisEra Technologies Co., Ltd.FlexEnable Ltd.Corephotonics Ltd.PolyIC GmbH & Co. KGTeledyne Scientific & Imaging LLCISORG SAInvensas Bonding Technologies, Inc.PMD Technologies Ltd.SEKONIX Co., Ltd.
Kobe Steel, Ltd.JFE Holdings, Inc.IBIDEN Co., Ltd.Sintokogio Ltd.Noritake Co., Ltd.Ryobi Ltd.Foseco International Ltd.Fujimi, Inc.Elkem ASANovuton Technology Corp. JapanTokai Carbon Co., Ltd.Vanguard International Semiconductor Corp.Vanguard International Semiconductor Corp.Tata Steel Ltd.Toyo Tanso Co., Ltd.ChipMOS Technologies, Inc.Showa Manufacturing Co., Ltd.KUKA Deutschland GmbHeMemory Technology, Inc.Datong Xincheng New Material Co., Ltd.Datong Xincheng New Material Co., Ltd.Uddeholms ABG. Siempelkamp GmbH & Co. KGGiga Device Semiconductor, Inc.Giga Device Semiconductor (Beijing), Inc.Gebr Eickhoff Maschinenfabrik & Eisengiesserei GmbHVereinigte Edelstahlwerke AGNewell Operating Co.ASK Chemicals GmbHVisEra Technologies Co., Ltd.