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Thales GroupMesserschmitt-Boelkow-Blohm GmbHNorthrop Grumman Systems Corp.The Korean Agency for Defense Development (South Korea)Société Nationale Industrielle Aérospatiale SAFourth Military Medical UniversityChina Academy of Launch Vehicle TechnologyHazeltine Corp.AECC Shenyang Liming Aero-Engine Co., Ltd.McDonnell Douglas Corp.Hughes Tool Co.Harbin Aircraft Industrial Group Co. Ltd.Martin Marietta Corp.Western Atlas International, Inc.Beijing Institute of Space Launch TechnologyFN Herstal NVMobileye Vision Technologies Ltd.Shanghai Aircraft Manufacturing Co. Ltd.Smith & Wesson, Inc.China Avionics Systems Co., Ltd.China Aviation Power Machinery Research InstituteAVIC Xi'an Aircraft Industry Group Co., Ltd.Zhengzhou Xindajiean Information Technology Co., Ltd.CIMC Safeway Technology Co., Ltd.TRW Systèmes Aeronautiques SASHuiyang Aviation Propeller Co., Ltd.Xian Aerospace Engine CorpZhangjiagang CIMC Sanctum Cryogenic Equipment Co., Ltd.Shaanxi Baocheng Aviation Instrument Co., Ltd.Zhengzhou Aircraft Equipment Co., Ltd.
General Electric Co.General Electric Co.Honeywell International, Inc.The Boeing Co.Thales GroupSubaru Corp.SNECMA SARaytheon Co.Subaru Corp.Beihang UniversityLucas Industries PlcDaicel Corp.KYB Corp.Hughes Aircraft Co.Airbus Operations Ltd.SZ DJI Technology Co., Ltd.Raytheon Technologies Corp.Japan Aviation Electronics Industry Ltd.Hamilton Sundstrand Corp.AlliedSignal, Inc.Eclipse Aviation Corp.Tektronix, Inc.Deutsches Zentrum für Luft- und Raumfahrt e.V.United Aircraft Corp.Analog Devices, Inc.Mitsubishi Cable Industries Ltd.Voith GmbH & Co. KGaAMesserschmitt-Boelkow-Blohm GmbHMesserschmitt-Boelkow-Blohm GmbHNorthrop Grumman Systems Corp.
Samsung Electronics Co., Ltd.Canon, Inc.Canon, Inc.Fujitsu Ltd.Sharp Corp.SANYO Electric Co., Ltd.Sumitomo Electric Industries Ltd.Sumitomo Electric Industries Ltd.BOE Technology Group Co., Ltd.KYOCERA Chemical Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fuji Electronics Co., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Taiwan Semiconductor Manufacturing Co., Ltd.Semiconductor Energy Laboratory Co., Ltd.Guangzhou Bosma Optoelectronic Technology Co. Ltd.Samsung Electro-Mechanics Co., Ltd.Renesas Electronics Corp.Shin-Etsu Chemical Co., Ltd.Alps Alpine Co., Ltd.Yamaha Corp.Suzuki Co., Ltd.Showa Denko Materials Co. Ltd.Resonac Corp.Sumitomo Metal Industries Ltd.Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd.Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd.TCL China Star Optoelectronics Technology Co., Ltd.NXP Semiconductors (Thailand) Co., Ltd.
Samsung Electronics Co., Ltd.Sony Group Corp.LG Electronics, Inc.General Electric Co.General Electric Co.Sharp Corp.Seiko Epson Corp.SANYO Electric Co., Ltd.Sumitomo Electric Industries Ltd.Sumitomo Electric Industries Ltd.Apple, Inc.Brother Industries, Ltd.KYOCERA Chemical Corp.Fujifilm Business Innovation Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Toshiba Chemical Corp.Fujifilm Business Innovation Corp.Fuji Electronics Co., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.OppoTaiwan Semiconductor Manufacturing Co., Ltd.Daewoo Electronics Co. Ltd.DAIKIN INDUSTRIES Ltd.Honeywell International, Inc.Nitto Electric Industrial Co. Ltd.Kobe Steel, Ltd.Casio Computer Co., Ltd.Midea Group Co. Ltd.
Samsung Electronics Co., Ltd.Canon, Inc.Hitachi Ltd.Fujitsu Ltd.Sharp Corp.SANYO Electric Co., Ltd.Sumitomo Electric Industries Ltd.Sumitomo Chemical Co., Ltd.BOE Technology Group Co., Ltd.Boe Innovation Investment Co. Ltd.KYOCERA Chemical Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fuji Electronics Co., Ltd.Nikon Corp.OppoTaiwan Semiconductor Manufacturing Co., Ltd.Semiconductor Energy Laboratory Co., Ltd.Guangzhou Bosma Optoelectronic Technology Co. Ltd.Toppan, Inc.Fraunhofer-Gesellschaft eVSamsung Electro-Mechanics Co., Ltd.AGC, Inc. (Japan)ABB Automation, Inc.Renesas Electronics Corp.Shin-Etsu Chemical Co., Ltd.Alps Alpine Co., Ltd.Suzuki Co., Ltd.Showa Denko Materials Co. Ltd.South China University of Technology
Chi Mei Optoelectronics Corp.Renesas Technology Corp.NXP USA, Inc.NEC Electronics Corp.Hyundai MicroElectronics Co., Ltd.Dongbu Electronics Co. Ltd.Cheil Industries, Inc.FCI SAHitachi Displays Ltd.Elpida Memory, Inc.Thomas & Betts Ltd.Yungu (Gu'an) Technology Co., Ltd.Prime View International Co. Ltd.Greatbatch Ltd.Optrex Corp.Hokuriku Electric Industry Co., Ltd.Hokuriku Electric Industry Co., Ltd.Shanghai Huali Integrated Circuit Manufacturing Co., Ltd.KYOCERA AVX Components Corp.Micronas GmbHShanghai Huali Integrated Circuit Manufacturing Co., Ltd.Kawasaki Microelectronics, Inc.Teikoku Tsushin Kogyo Co., Ltd.Sharp NEC Display Solutions, Ltd.Shoei Chemical, Inc.Zgmicro Wuxi Co. Ltd.Sharp NEC Display Solutions, Ltd.Fositek Corp.Uchihashi Estec Co., Ltd.FCI Americas Technology LLC
Renesas Electronics Corp.Advanced Micro Devices, Inc.Chi Mei Optoelectronics Corp.Renesas Technology Corp.NXP USA, Inc.NEC Electronics Corp.Hyundai MicroElectronics Co., Ltd.Cardiac Pacemakers, Inc.Dongbu Electronics Co. Ltd.Cheil Industries, Inc.FCI SAToshiba Electronic Devices & Storage Corp.KIOXIA Corp.Hitachi Displays Ltd.Canon Anelva Corp.Elpida Memory, Inc.Toshiba Mobile Display Technology Co., LtdYungu (Gu'an) Technology Co., Ltd.Prime View International Co. Ltd.Optrex Corp.Sunplus Technology Co., Ltd.Micronas GmbHNippon Steel & Sumikin Electronics Devices Inc.Silicon Integrated Systems Corp.Silicon Integrated Systems Corp.Shanghai Huali Integrated Circuit Manufacturing Co., Ltd.Kawasaki Microelectronics, Inc.Sharp NEC Display Solutions, Ltd.Zgmicro Wuxi Co. Ltd.Sharp NEC Display Solutions, Ltd.