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Seiko Epson Corp.Apple, Inc.BOE Technology Group Co., Ltd.OppoCasio Computer Co., Ltd.Lenovo Group Ltd.Hilti AGHealthwatch Ltd.NIKE, Inc.Xiaomi Corp.Konami Digital Entertainment Co., Ltd.Motorola Mobility LLCMacronix International Co., Ltd.Milliken & Co. (South Carolina)Freescale Semiconductor, Inc.Magic Leap, Inc.LG Corp.LG Corp.Asahi Kasei Microdevices Corp.Tianma Microelectronics Co., Ltd.Meizu Technology Co. Ltd.Medtronic MiniMed, Inc.Sony Mobile Communications ABAbbott Diabetes Care, Inc.Hannstar Display Corp.DexCom, Inc.Verily Life Sciences LLCMTG Co., Ltd.Rolex SAGoPro, Inc.
Thales GroupRaytheon Co.Hewlett Packard Enterprise Development LPBT Group PlcMotorola Solutions, Inc.Hangzhou H3C Technologies Co., Ltd.Juniper Networks, Inc.NUCTECH Co., Ltd.Lear Corp.SRI InternationalBundesdruckerei GmbHChina Academy of Telecommunications TechnologyBull SAMcAfee LLCTarget Corp.Huizhou Desay SV Automotive Co., Ltd.Huizhou Desay SV Automotive Co., Ltd.Roke Manor Research Ltd.Hangzhou DPtech Technologies Co., Ltd.Qi An Xin Technology Group, Inc.Hangzhou DPtech Technologies Co., Ltd.Irdeto BVSplunk, Inc.Beijing Topsec Network Security Technology Co. Ltd.S-1 Corp. (Korea)S-1 Corp. (Korea)ELTA Systems Ltd.Akamai Technologies, Inc.Beijing Topsec Network Security Technology Co. Ltd.VeriSign, Inc.
Samsung Electronics Co., Ltd.Canon, Inc.Canon, Inc.Hitachi Ltd.Fujitsu Ltd.Sharp Corp.SANYO Electric Co., Ltd.Intel Corp.Sumitomo Electric Industries Ltd.Sumitomo Electric Industries Ltd.BOE Technology Group Co., Ltd.KYOCERA Chemical Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fuji Electronics Co., Ltd.Nikon Corp.OppoTaiwan Semiconductor Manufacturing Co., Ltd.Oki Electric Industry Co., Ltd.Semiconductor Energy Laboratory Co., Ltd.Micron Technology, Inc.Guangzhou Bosma Optoelectronic Technology Co. Ltd.Toppan, Inc.Fraunhofer-Gesellschaft eVAGC, Inc. (Japan)ABB Automation, Inc.Renesas Electronics Corp.Shin-Etsu Chemical Co., Ltd.Alps Alpine Co., Ltd.Suzuki Co., Ltd.
Solidum Systems Corp.
Imagination Technologies Ltd.Achronix Semiconductor Corp.Applied Brain Research, Inc.Hailo Technologies Ltd.Blaize, Inc.PNI Sensor Corp.Mad Street Den, Inc.DRC Computer Corp.
NXP BVAltera Corp.Axcelis Technologies, Inc.Cymer LLCHuaian Imaging Device Manufacturer Corp.Kawasaki Microelectronics, Inc.Huaian Imaging Device Manufacturer Corp.Harvatek Corp.Xiamen San'an Integrated Circuit Co., Ltd.Xiamen San'an Integrated Circuit Co., Ltd.Jiangyin Changdian Advanced Packaging Co., Ltd.Jiangyin Changdian Advanced Packaging Co., Ltd.Henan YiCheng New Energy Co., Ltd.Schefenacker Vision Systems Germany GmbH & Co. KGAnaPass, Inc.StarPower Semiconductor Ltd.Dialog Semiconductor Korea, Inc.Timbre Technologies, Inc.Jiangsu Jiejie Microelectronics Co., Ltd.Aminologics Co., Ltd.MTPV Power Corp.FormFactor Beaverton, Inc.R2 Semiconductor, Inc.Crealights Technology Co. Ltd.Suzhou Tongguan Microelectronics Co., Ltd.Visual Photonics Epitaxy Co., Ltd.ChaoLogix, Inc.CustomArray, Inc.ODTech Co., Ltd.Sintronic Technology, Inc.
Microsoft Corp.Xilinx, Inc.CA Technologies, Inc.General Dynamics Corp.Yokowo Co. Ltd.Fukuvi Chemical Industry Co., Ltd.Briggs & Stratton Corp.Asahi Intecc Co., Ltd.Bombardier Recreational Products, Inc.Huizhou Desay SV Automotive Co., Ltd.Huizhou Desay SV Automotive Co., Ltd.ZF Automotive Germany GmbHWoodward, Inc.FANCL Corp.Federal-Mogul Burscheid GmbHAnalogic Corp.Tenneco, Inc.Gen Digital Inc.NortonLifeLock, Inc.Arcadyan Technology Corp.Nanosys, Inc.Qibu Co., Ltd.Federal-Mogul Motorparts LLCShape LLCThe Valspar Corp.CDTi Advanced Materials, Inc.Symbios, Inc.Powermat Technologies Ltd.Chassis Brakes International BVHayes Lemmerz International, Inc.
