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Samsung Electronics Co., Ltd.Canon, Inc.Canon, Inc.Hitachi Ltd.Fujitsu Ltd.Sharp Corp.SANYO Electric Co., Ltd.Intel Corp.Sumitomo Electric Industries Ltd.Sumitomo Electric Industries Ltd.BOE Technology Group Co., Ltd.Boe Innovation Investment Co. Ltd.KYOCERA Chemical Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fuji Electronics Co., Ltd.Nikon Corp.OppoTaiwan Semiconductor Manufacturing Co., Ltd.Semiconductor Energy Laboratory Co., Ltd.Guangzhou Bosma Optoelectronic Technology Co. Ltd.Toppan, Inc.Fraunhofer-Gesellschaft eVAGC, Inc. (Japan)ABB Automation, Inc.Renesas Electronics Corp.Shin-Etsu Chemical Co., Ltd.Alps Alpine Co., Ltd.Suzuki Co., Ltd.Showa Denko Materials Co. Ltd.
Rohm & Haas Co.Mitsubishi Materials Corp.Tokin Corp. /JP/Sanken Electric Co., Ltd.Noritake Co., Ltd.Toshiba Electronic Devices & Storage Corp.Wolverine World Wide, Inc.SAES Getters SpAFujimi, Inc.Institute of Electrical Engineering, Chinese Academy of SciencesInstitute of Electrical Engineering, Chinese Academy of SciencesTowa Corp.Tokai Carbon Co., Ltd.MillerKnoll, Inc.Toyo Tanso Co., Ltd.CoorsTek, Inc.JCET Group Co., Ltd.Hitachi Power Semiconductor Device Ltd.Metglas, Inc.Hyperion Catalysis International, Inc.SAGE Electrochromics, Inc.Physik Instrumente (PI) GmbH & Co. KGNovaled GmbHNippon Carbon Co., Ltd.Nikko-Materials Co., Ltd.Amkor Technology, Inc.Hanwha Advanced Materials Corp.SK EnpulseYangzhou Yangjie Electronic Technology Co., Ltd.GTAT Corp.
Samsung Electronics Co., Ltd.Canon, Inc.Canon, Inc.Fujitsu Ltd.Sharp Corp.SANYO Electric Co., Ltd.Intel Corp.Sumitomo Electric Industries Ltd.Sumitomo Electric Industries Ltd.BOE Technology Group Co., Ltd.KYOCERA Chemical Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fuji Electronics Co., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Taiwan Semiconductor Manufacturing Co., Ltd.Semiconductor Energy Laboratory Co., Ltd.Guangzhou Bosma Optoelectronic Technology Co. Ltd.Samsung Electro-Mechanics Co., Ltd.Renesas Electronics Corp.Shin-Etsu Chemical Co., Ltd.Alps Alpine Co., Ltd.Yamaha Corp.Suzuki Co., Ltd.Showa Denko Materials Co. Ltd.Resonac Corp.Sumitomo Metal Industries Ltd.Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd.Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd.
SEMES Co., Ltd.Dowa Electronics Materials Co., Ltd.Seoul Semiconductor Co., Ltd.Institute of Electrical Engineering, Chinese Academy of SciencesInstitute of Electrical Engineering, Chinese Academy of SciencesMillerKnoll, Inc.Mattson Technology, Inc.Hitachi Power Semiconductor Device Ltd.IHP GmbH - Innovations for High Performance MicroelectronicsYangzhou Yangjie Electronic Technology Co., Ltd.Zhuzhou Smelter Group Co., Ltd.SCREEN Semiconductor Solutions Co. Ltd.Ningxia Orient Tantalum Industry Co., Ltd.Ningxia Orient Tantalum Industry Co., Ltd.Win Semiconductors Corp.Freiberger Compound Materials GmbHHenan YiCheng New Energy Co., Ltd.Chemcut Corp.United Monolithic Semiconductors SASAXT, Inc.Solyndra, Inc.Nanosolar, Inc.Nitride Semiconductors Co., Ltd.Hunan Shuikoushan Nonferrous Metals Group Co. Ltd.Carborundum Universal Ltd.Global Solar Energy, Inc.Nexcis SAVisual Photonics Epitaxy Co., Ltd.Soitec Belgium NVZhuzhou Keneng New Material Co., Ltd.
3M Co.Rohm & Haas Co.Sintokogio Ltd.Firestone Tire & Rubber Co.Firestone Tire & Rubber Co.Global Tungsten & Powders Corp.Nihon Dempa Kogyo Co., Ltd.Noritake Co., Ltd.Sumitomo Electric Hardmetal Ltd.Saint-Gobain Abrasives Ltd.Ssangyong Motor Co., Ltd.Fujimi, Inc.Institute of Electrical Engineering, Chinese Academy of SciencesInstitute of Electrical Engineering, Chinese Academy of SciencesCompagnie de Saint-Gobain SATungaloy Corp.Saint-Gobain Abrasifs SA (France)NovaTek, Inc.Diamond Innovations, Inc.OMAX Corp.Zhengzhou Research Institute for Abrasives & Grinding Co. LtdEhwa Diamond Industrial Co., Ltd.Hexion, Inc.HeidelbergCement AGTyrolit - Schleifmittelwerke Swarovski KGHenan Huanghe Whirlwind Co., Ltd.Reishauer AGKinik Co.CARBO Ceramics, Inc.Asahi Diamond Industrial Co., Ltd.