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Samsung Electronics Co., Ltd.Canon, Inc.Canon, Inc.Hitachi Ltd.Fujitsu Ltd.Sharp Corp.SANYO Electric Co., Ltd.Intel Corp.Sumitomo Electric Industries Ltd.Sumitomo Electric Industries Ltd.Hon Hai Precision Industry Co., Ltd.Samsung Display Co., Ltd.SK hynix, Inc.BOE Technology Group Co., Ltd.Taiwan Semiconductor Manufacturing Co., Ltd.Boe Innovation Investment Co. Ltd.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fuji Electronics Co., Ltd.Nikon Corp.LG Display Co., Ltd.OppoTaiwan Semiconductor Manufacturing Co., Ltd.Oki Electric Industry Co., Ltd.Applied Materials, Inc.Micron Technology, Inc.Fraunhofer-Gesellschaft eVShin-Etsu Chemical Co., Ltd.TOPPAN Holdings, Inc.Guangzhou Bosma Optoelectronic Technology Co. Ltd.
Samsung Electronics Co., Ltd.Canon, Inc.Canon, Inc.Fujitsu Ltd.Sharp Corp.SANYO Electric Co., Ltd.Intel Corp.Sumitomo Electric Industries Ltd.Sumitomo Electric Industries Ltd.Hon Hai Precision Industry Co., Ltd.Samsung Display Co., Ltd.SK hynix, Inc.BOE Technology Group Co., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Taiwan Semiconductor Manufacturing Co., Ltd.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fuji Electronics Co., Ltd.LG Display Co., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Taiwan Semiconductor Manufacturing Co., Ltd.Oki Electric Industry Co., Ltd.Micron Technology, Inc.Shin-Etsu Chemical Co., Ltd.Guangzhou Bosma Optoelectronic Technology Co. Ltd.Alps Alpine Co., Ltd.Yamaha Corp.Showa Denko Materials Co. Ltd.Resonac Corp.STMicroelectronics SA
Applied Materials, Inc.Hitachi Kokusai Electric, Inc.SCREEN Holdings Co., Ltd.Lam Research Corp.Mitsubishi Paper Mills Ltd.ULVAC, Inc.NOF Corp.Sumitomo Electric Hardmetal Ltd.Varian Semiconductor Equipment Associates, Inc.NuFlare Technology, Inc.Canon Anelva Corp.Siltronic AGJUSUNG ENGINEERING Co., Ltd.Novellus Systems, Inc.Advanced Micro Fabrication Equipment, Inc. ChinaAIXTRON SEAdvanced Micro Fabrication Equipment, Inc. ChinaPraxair S.T. Technology, Inc.Mirae Corp.Kateeva, Inc.Zygo Corp.Horiba Stec Co. Ltd.Brewer Science, Inc.WONIK HOLDINGS CO., LTD.Mattson Technology, Inc.TOCALO Co., Ltd.VON ARDENNE GmbHToray Advanced Film Co., Ltd.Intevac, Inc.Beneq Group Oy
DISCO Corp.Semiconductor Components Industries LLCTokyo Seimitsu Co., Ltd.Toshiba Electronic Devices & Storage Corp.Zhuzhou CRRC Times Electric Co., Ltd.Siltronic AGZhuzhou CRRC Times Electric Co., Ltd.Semikron Elektronik GmbH & Co. KGHangzhou Silan Microelectronics Co., Ltd.Founder Microelectronics, Inc.Alpha & Omega Semiconductor Ltd.Yangzhou Yangjie Electronic Technology Co., Ltd.Suzhou Delphi Laser Co., Ltd.Transphorm Technology, Inc.Wuxi NCE Power Co., Ltd.Plasma-Therm LLCFoshan Blue Rocket Electronics Co., Ltd.Foshan Blue Rocket Electronics Co., Ltd.Jilin Sino-Microelectronics Co., Ltd.Silicon Power Corp.StarPower Semiconductor Ltd.IXYS LLCJones Tech PLCThe Bergquist Co.Dynex Semiconductor Ltd.Solitron Devices, Inc.Vincotech GmbHD3 Semiconductor LLCSinopower Semiconductor, Inc.Jiashan Sunking Power Equipment Technology Co., Ltd.
Applied Materials, Inc.TOPPAN Holdings, Inc.SCREEN Holdings Co., Ltd.Lam Research Corp.DISCO Corp.Advantest Corp.ULVAC, Inc.KLA Corp.Shibaura Mechatronics Corp.Fujitsu Semiconductor Ltd.DB HITEK Co., Ltd.Tokyo Seimitsu Co., Ltd.Varian Semiconductor Equipment Associates, Inc.Teradyne, Inc.Siliconware Precision Industries Co., Ltd.JUSUNG ENGINEERING Co., Ltd.Novellus Systems, Inc.Hitachi High-Tech Science Corp.Advanced Micro Fabrication Equipment, Inc. ChinaAdvanced Micro Fabrication Equipment, Inc. ChinaGlobalWafers Co., Ltd.Powertech Technology, Inc.Mirae Corp.CMC Materials LLCNTT Advanced Technology Corp.STMicroelectronics Asia Pacific Pte Ltd.GigaLane Co., Ltd.SK Siltron Co., Ltd.Monolithic Power Systems, Inc.Eugene Technology Co., Ltd.
Semiconductor Energy Laboratory Co., Ltd.Electronics & Telecommunications Research InstituteSouth China University of TechnologySoutheast UniversityToyoda Gosei Co., Ltd.University of Electronic Science & Technology of ChinaDISCO Corp.Toyota Central R&D Labs, Inc.Hangzhou Dianzi UniversityOsaka UniversityNanjing University of Posts & TelecommunicationsShin-Etsu Handotai Co., Ltd.Fujitsu Semiconductor Ltd.Nanjing University of TechnologyEPISTAR Corp.Soitec SAInstitute of Semiconductors of Chinese Academy of SciencesGwangju Institute of Science & TechnologyHRL Laboratories LLCNational Tsing-Hua UniversityNagoya UniversityIwatsu Electric Co., Ltd.Nisshinbo Micro Devices, Inc.Power Integrations, Inc.Semikron Elektronik GmbH & Co. KGInternational Rectifier Corp.Nagoya Institute of TechnologyThe University of SheffieldAdvanced Optoelectronic Technology, Inc.Nuvoton Technology Corp.
BOE Technology Group Co., Ltd.Taiwan Semiconductor Manufacturing Co., Ltd.Boe Innovation Investment Co. Ltd.LG Display Co., Ltd.Taiwan Semiconductor Manufacturing Co., Ltd.Semiconductor Energy Laboratory Co., Ltd.Lam Research Corp.United Microelectronics Corp.Nichia Corp.Semiconductor Components Industries LLCJUKI Corp.Macronix International Co., Ltd.Socionext, Inc.Shin-Etsu Handotai Co., Ltd.Shinko Electric Industries Co., Ltd.Institute of Microelectronics of Chinese Academy of SciencesShinko Electric Industries Co., Ltd.National Semiconductor Corp.Institute of Microelectronics of Chinese Academy of SciencesSkyworks Solutions, Inc.DB HITEK Co., Ltd.Advanced Semiconductor Engineering, Inc.Altera Corp.Chunghwa Picture Tubes Ltd.Novatek Microelectronics Corp.Soitec SAEnplas Corp.Toshiba Electronic Devices & Storage Corp.HRL Laboratories LLCShenzhen Royole Technologies Co., Ltd.