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Samsung Electronics Co., Ltd.Canon, Inc.Canon, Inc.Sony Group Corp.Fujitsu Ltd.General Electric Co.General Electric Co.Huawei Technologies Co., Ltd.Seiko Epson Corp.SANYO Electric Co., Ltd.Intel Corp.ZTE Corp.Apple, Inc.FUJIFILM Corp.Hewlett-Packard Development Co.Eastman Kodak Co.Fujifilm Business Innovation Corp.Google LLCFujifilm Business Innovation Corp.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Honeywell International, Inc.Xerox Holdings Corp.Tencent Technology (Shenzhen) Co., Ltd.Alcatel-Lucent S AOlympus Corp.Microsoft Corp.Beijing Xiaomi Mobile Software Co., Ltd.Toyota Industries Corp.Muratec Automation Co., Ltd.
International Business Machines Corp.Fujitsu Ltd.Eastman Kodak Co.Google LLC3M Co.Microsoft Corp.Beijing Xiaomi Mobile Software Co., Ltd.Beijing Xiaomi Mobile Software Co., Ltd.Baidu Online Network Technology (Beijing) Co., Ltd.BlackBerry Ltd.Deutsche Telekom AGDeutsche Telekom AGGemalto, Inc.Sega Group Corp.Beijing Jingdong Shangke Information Technology Co., Ltd.Beijing Jingdong Shangke Information Technology Co., Ltd.Orion Co., Ltd.LEGO A/SLEGO A/SCitrix Systems, Inc.VMware, Inc.NetEase (Hangzhou) Network Co., Ltd.Altera Corp.SK Planet Co., Ltd.Avaya, Inc.HGST, Inc.Heroku, Inc.Alcatel-Lucent Shanghai Bell Co., Ltd.Nuance Communications, Inc.Sandvik Aktiebolag
International Business Machines Corp.Fujitsu Ltd.Tencent Technology (Shenzhen) Co., Ltd.Yokogawa Electric Corp.Hewlett Packard Enterprise Development LPSeagate Technology LLCDelphi Technology, Inc.Praxair S.T. Technology, Inc.Dolby International ABLife Technologies Corp.Unisys Corp.Tata Consultancy Services Ltd.VMware, Inc.Inspur Electronic Information Industry Co., Ltd.Avaya, Inc.MiTAC International Corp.SnapTrack, Inc.Siemens Medical Solutions USA, Inc.Heroku, Inc.Agfa-Gevaert NVLandmark Graphics Corp.Fiberhome Telecommunication Technologies Co., Ltd.Shima Seiki Mfg. Ltd.Shima Seiki Mfg. Ltd.NARI Technology Co., Ltd.Rambus, Inc.Canon Marketing Japan, Inc.HRL Laboratories LLCBull SANEC Soft Ltd.
thyssenkrupp Industrial Solutions AGSMS group GmbHXcellerex, Inc.STATS ChipPAC Pte Ltd.HYUNDAI ROTEM Co.ChipMOS Technologies, Inc.MULTIVAC Sepp Haggenmüller SE & Co. KGSaipem SAChroma Ate, Inc.Mühlbauer GmbH & Co. KGHarnischfeger Corp.Ansaldo Energia SpAEd. Züblin AGBWG Bergwerk- und Walzwerk-Maschinenbau GmbHSuzhou Secote Precision Electronic Co., Ltd.Imagineering, Inc.Bluewater Energy Services BVGeico SpAClextral SASHenan Communications Planning & Design Institute Co., Ltd.Hosokawa Alpine AGHydro International Ltd.Doris Engineering SAConverteam SASLingzhi Environmental Protection Co., Ltd.Lanzhou LS Heavy Equipment Co., Ltd.Lanzhou LS Heavy Equipment Co., Ltd.Lingzhi Environmental Protection Co., Ltd.Leclanché SAMH Robot & Automation Co., Ltd.
General Electric Co.General Electric Co.Honeywell International, Inc.The Boeing Co.Thales GroupSubaru Corp.SNECMA SARaytheon Co.Subaru Corp.Beihang UniversityLucas Industries PlcDaicel Corp.KYB Corp.Hughes Aircraft Co.Airbus Operations Ltd.SZ DJI Technology Co., Ltd.Raytheon Technologies Corp.Japan Aviation Electronics Industry Ltd.Hamilton Sundstrand Corp.AlliedSignal, Inc.Eclipse Aviation Corp.Tektronix, Inc.Deutsches Zentrum für Luft- und Raumfahrt e.V.United Aircraft Corp.Analog Devices, Inc.Mitsubishi Cable Industries Ltd.Voith GmbH & Co. KGaAMesserschmitt-Boelkow-Blohm GmbHMesserschmitt-Boelkow-Blohm GmbHPratt & Whitney Canada Corp.